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TMS32C6416EGLZ6E3

Texas Instruments

TMS32C6416EGLZ6E3 by Texas Instruments

TMS32C6416EGLZ6E3 by Texas Instruments is a 32-bit DSP with integrated cache, operating at 75.18 MHz clock frequency. Ideal for digital signal processing applications, it features a 64-bit external data bus width and low power mode for efficient performance. With a max supply voltage of 1.44 V and package style including grid array and heat sink, it offers versatile solutions in various electronic systems.

Median Price

$173.944

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 289 parts In-Stock

1+ parts

$159.950

100+ parts

$150.350

1k+ parts

$140.760

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289

$159.950

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$140.760

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DigiKey

USA . 273 parts In-Stock

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Verical

USA . 135 parts In-Stock

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$187.938

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$175.950

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135

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$187.938

$175.950

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,729 parts In-Stock

1+ parts

$176.444

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4,729

$176.444

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DigiKey Marketplace

USA . 915 parts In-Stock

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$178.860

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915

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Vyrian

USA . 5,310 parts In-Stock

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Sogenti Electronics

Canada . 171 parts In-Stock

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Chip Stock

USA . 131 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 265 parts In-Stock

1+ parts

$60.611

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265

$60.611

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ChromeModa Solutions

Germany . 983 parts In-Stock

1+ parts

$68.102

100+ parts

$55.844

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983

$68.102

$55.844

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IDEA Electronic Components Group

UK . 782 parts In-Stock

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$68.102

100+ parts

$64.697

1k+ parts

$61.292

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782

$68.102

$64.697

$61.292

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Ampacity Inc.

Singapore . 249 parts In-Stock

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$157.870

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249

$157.870

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Corphita

USA . 322 parts In-Stock

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$167.157

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Corohmni

South Africa . 117 parts In-Stock

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$180.626

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Microchip USA

USA . 2,525 parts In-Stock

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$254.917

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$254.917

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DigiPath Technology Company

USA . 330 parts In-Stock

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$61.401

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330

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$61.401

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Overview

Experience cutting-edge technology with the TMS32C6416EGLZ6E3 by Texas Instruments, a leader in digital signal processors. This powerful DSP boasts integrated cache and a wide range of applications, delivering unmatched performance and reliability. From audio processing to telecommunications, this product is designed to meet all your needs with ease. Trust Texas Instruments for top-quality products that provide exceptional value and benefits, revolutionizing the way you work and innovate. Elevate your projects with the TMS32C6416EGLZ6E3 and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is common, cost-effective, and provides good protection for the internal components of the DSP.

Integrated Cache: YES

Having an integrated cache helps improve the performance of the DSP by reducing the time it takes to access frequently used data.

Maximum Supply Voltage: 1.44 V

The higher maximum supply voltage allows for flexibility in power supply options while ensuring the safe operation of the DSP.

Address Bus Width: 32

A wider address bus allows the DSP to access a larger memory space, enhancing its capabilities for processing and storing data.

Package Shape: SQUARE

The square package shape helps in efficient placement on a circuit board and allows for a compact design.

Bit Size: 32

A 32-bit architecture provides a good balance between performance and power efficiency for the DSP.

No. of Terminals: 532

Having a large number of terminals enables the DSP to connect to a variety of external components and interfaces, enhancing its versatility.

Minimum Supply Voltage: 1.36 V

The lower minimum supply voltage helps in reducing power consumption and extending the battery life of devices utilizing this DSP.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures the DSP can function reliably even in demanding environmental conditions.

No. of External Interrupts: 4

Having multiple external interrupts allows the DSP to respond to various events or signals in real-time, enhancing its responsiveness.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6416EGLZ6E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6416EGLZ6E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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