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TMS32C6416EGLZ5E0

Texas Instruments

TMS32C6416EGLZ5E0 by Texas Instruments

TMS32C6416EGLZ5E0 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at max 75.18 MHz clock frequency. Ideal for digital signal processing applications due to its low power mode and fixed-point format, making it suitable for various signal processing tasks in electronics.

Median Price

$107.482

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 754 parts In-Stock

1+ parts

-

100+ parts

$95.540

1k+ parts

$85.480

10k+ parts

$80.460

754

-

$95.540

$85.480

$80.460

DigiKey

USA . 754 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

754

-

-

-

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Verical

USA . 391 parts In-Stock

1+ parts

-

100+ parts

$119.425

1k+ parts

$106.850

10k+ parts

$100.575

391

-

$119.425

$106.850

$100.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,807 parts In-Stock

1+ parts

$100.842

100+ parts

-

1k+ parts

-

10k+ parts

-

1,807

$100.842

-

-

-

DigiKey Marketplace

USA . 754 parts In-Stock

1+ parts

$110.400

100+ parts

-

1k+ parts

-

10k+ parts

-

754

$110.400

-

-

-

Vyrian

USA . 1,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,967

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 467 parts In-Stock

1+ parts

$61.779

100+ parts

-

1k+ parts

-

10k+ parts

-

467

$61.779

-

-

-

Parana Technologies

USA . 1,449 parts In-Stock

1+ parts

$75.476

100+ parts

-

1k+ parts

-

10k+ parts

-

1,449

$75.476

-

-

-

DigiPath Technology Company

USA . 1,636 parts In-Stock

1+ parts

$83.109

100+ parts

$76.460

1k+ parts

-

10k+ parts

-

1,636

$83.109

$76.460

-

-

ChromeModa Solutions

Germany . 2,034 parts In-Stock

1+ parts

$84.805

100+ parts

$69.540

1k+ parts

-

10k+ parts

-

2,034

$84.805

$69.540

-

-

IDEA Electronic Components Group

UK . 431 parts In-Stock

1+ parts

$84.805

100+ parts

$80.565

1k+ parts

$76.324

10k+ parts

-

431

$84.805

$80.565

$76.324

-

Corphita

USA . 2,884 parts In-Stock

1+ parts

$95.535

100+ parts

-

1k+ parts

-

10k+ parts

-

2,884

$95.535

-

-

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Component Stockers USA

USA . 797 parts In-Stock

1+ parts

$110.100

100+ parts

$103.490

1k+ parts

-

10k+ parts

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797

$110.100

$103.490

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QUARKTWIN TECHNOLOGY LTD

USA . 5,390 parts In-Stock

1+ parts

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5,390

-

-

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Microchip USA

USA . 5,024 parts In-Stock

1+ parts

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100+ parts

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5,024

-

-

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Metaverse IC Inc.

Canada . 600 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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600

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Overview

Experience cutting-edge technology with the Texas Instruments TMS32C6416EGLZ5E0 Digital Signal Processor. Known for their high-quality products, Texas Instruments delivers unmatched performance and reliability in the field of DSPs. This versatile processor is perfect for a wide range of applications, offering customers exceptional value and benefits. Whether you're working on audio processing, telecommunications, or industrial control systems, this DSP provides the power and efficiency you need to take your projects to the next level. Unlock the possibilities with the TMS32C6416EGLZ5E0 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easier to handle and less prone to damage.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product, reducing production time and costs.

Maximum Supply Voltage: 1.26 V

Operating within this voltage range ensures optimal performance and reliability of the product.

Address Bus Width: 32

A wider address bus allows for faster data transfer and processing capabilities, enhancing the overall performance of the product.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space and easy integration into various system designs.

Bit Size: 32

A 32-bit architecture enables the processor to handle large amounts of data and complex calculations, making it suitable for demanding applications.

Power Supplies (V): 1.2,3.3

Having multiple power supply options allows for flexibility in different operating environments and power requirements.

No. of Terminals: 532

A higher number of terminals provide more connectivity options and interfaces, enhancing the versatility and compatibility of the product.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

These package styles offer efficient heat dissipation, compact size, and high-density interconnection capabilities, making the product suitable for various applications.

Minimum Supply Voltage: 1.14 V

Having a low minimum supply voltage helps in reducing power consumption and improving energy efficiency of the product.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity, ensuring reliable connections and performance of the product.

Terminal Position: BOTTOM

Bottom terminal position allows for easier placement and soldering on the PCB, simplifying the assembly process.

Maximum Seated Height: 3.3 mm

A low seated height helps in compact system designs and space-constrained applications, enhancing the product's versatility.

RAM Words: 16384

With a large RAM capacity, the product can handle and process more data simultaneously, improving its performance in multitasking and memory-intensive applications.

Width: 23 mm

Compact width allows for efficient board layout and space-saving designs, making the product suitable for compact electronic devices.

Boundary Scan: YES

Boundary scan capability facilitates debugging, testing, and fault isolation of the product, enhancing its reliability and ease of maintenance.

External Data Bus Width: 64

Having a wide external data bus enables faster data transfer rates and improved data processing capabilities, enhancing the product's performance.

Maximum Clock Frequency: 75.18 MHz

High clock frequency allows for fast data processing and real-time operation, making the product suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 20

Being able to withstand peak reflow temperatures for a longer duration ensures reliable soldering and manufacturing processes, improving the product's quality and durability.

Peak Reflow Temperature °C: 220

Withstanding high peak reflow temperatures ensures proper soldering and assembly of the product, enhancing its reliability and performance under harsh manufacturing conditions.

Internal Bus Architecture: MULTIPLE

Having multiple internal buses enables efficient data communication within the processor, enhancing its processing speed and performance.

Length: 23 mm

Compact length allows for flexible board designs and space-saving integration, making the product suitable for compact and portable devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a dedicated digital signal processor with additional peripheral ICs expands the product's functionality and application range, making it a versatile choice for various signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high-speed processing, and reliable performance, making the product energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form provides reliable and robust connections, ensuring stable performance and durability of the product.

Nominal Supply Voltage: 1.2 V

Having a stable nominal supply voltage ensures consistent and reliable performance of the product under different operating conditions.

Terminal Pitch: 0.8 mm

With a fine terminal pitch, the product allows for high-density interconnection and compact board designs, making it suitable for space-constrained applications.

Format: FIXED POINT

Fixed-point format provides efficient and precise arithmetic calculations, making the product suitable for applications requiring high accuracy and reliability.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the product can withstand moderate exposure to moisture during storage and handling, ensuring its integrity and reliability in various environments.

Low Power Mode: YES

The low power mode feature helps in reducing energy consumption and extending battery life, making the product suitable for power-sensitive applications and devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6416EGLZ5E0 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6416EGLZ5E0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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