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TMS32C6416DGLZ6E3

Texas Instruments

TMS32C6416DGLZ6E3 by Texas Instruments

TMS32C6416DGLZ6E3 by Texas Instruments is a 32-bit DSP with 16384 RAM words, 64-bit external data bus width, and a max clock frequency of 75.18 MHz. It is used in digital signal processing applications requiring high computational power and low power consumption.

Median Price

$86.445

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 248 parts In-Stock

1+ parts

$79.490

100+ parts

$74.720

1k+ parts

$67.570

10k+ parts

-

248

$79.490

$74.720

$67.570

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DigiKey

USA . 299 parts In-Stock

1+ parts

-

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-

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299

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Verical

USA . 191 parts In-Stock

1+ parts

-

100+ parts

$93.400

1k+ parts

$84.463

10k+ parts

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191

-

$93.400

$84.463

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,461 parts In-Stock

1+ parts

$75.516

100+ parts

-

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1,461

$75.516

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DigiKey Marketplace

USA . 299 parts In-Stock

1+ parts

$82.670

100+ parts

-

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299

$82.670

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Vyrian

USA . 3,231 parts In-Stock

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-

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3,231

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 266 parts In-Stock

1+ parts

$50.978

100+ parts

-

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266

$50.978

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Parana Technologies

USA . 709 parts In-Stock

1+ parts

$60.854

100+ parts

-

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709

$60.854

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ChromeModa Solutions

Germany . 2,994 parts In-Stock

1+ parts

$68.375

100+ parts

$56.068

1k+ parts

-

10k+ parts

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2,994

$68.375

$56.068

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IDEA Electronic Components Group

UK . 1,210 parts In-Stock

1+ parts

$68.375

100+ parts

$64.956

1k+ parts

$61.538

10k+ parts

-

1,210

$68.375

$64.956

$61.538

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Corphita

USA . 274 parts In-Stock

1+ parts

$71.541

100+ parts

-

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274

$71.541

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Microchip USA

USA . 350 parts In-Stock

1+ parts

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350

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DigiPath Technology Company

USA . 145 parts In-Stock

1+ parts

-

100+ parts

$61.647

1k+ parts

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10k+ parts

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145

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$61.647

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Overview

Experience unparalleled performance and efficiency with the TMS32C6416DGLZ6E3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments sets the standard for quality and innovation. This Digital Signal Processor (DSP) is perfect for a wide range of applications, offering customers superior value and benefits. Whether you're looking to enhance your audio systems or improve image processing capabilities, this product delivers exceptional results. Trust Texas Instruments to provide you with cutting-edge technology that meets all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic devices, saving time and reducing production costs.

Maximum Supply Voltage: 1.44 V

With a relatively low maximum supply voltage, the product is energy-efficient and suitable for low-power applications.

Address Bus Width: 32

A wider address bus allows for efficient data communication between the processor and memory, enhancing overall performance.

No. of Terminals: 532

Having a large number of terminals provides flexibility in connecting external components and peripherals, making the product versatile in its usage.

Width: 23 mm

The compact width makes the product suitable for space-constrained applications and allows for easy integration into various electronic devices.

Maximum Clock Frequency: 75.18 MHz

The high clock frequency enables fast data processing and real-time signal handling, making the product ideal for demanding applications.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6416DGLZ6E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6416DGLZ6E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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