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TMS32C6415EGLZ6E3

Texas Instruments

TMS32C6415EGLZ6E3 by Texas Instruments

TMS32C6415EGLZ6E3 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.18 MHz. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,470 parts In-Stock

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Digiode

USA . 2,374 parts In-Stock

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North Shore Components

USA . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 630 parts In-Stock

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$17.339

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630

$17.339

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Ampacity Inc.

Singapore . 899 parts In-Stock

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$18.000

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899

$18.000

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Parana Technologies

USA . 864 parts In-Stock

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$20.082

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$20.011

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864

$20.082

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$20.011

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DigiPath Technology Company

USA . 1,931 parts In-Stock

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$22.113

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$22.113

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ChromeModa Solutions

Germany . 4,383 parts In-Stock

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$22.564

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$18.502

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IDEA Electronic Components Group

UK . 633 parts In-Stock

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$22.564

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$21.436

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$20.308

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633

$22.564

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$20.308

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One Stop Electronics

USA . 734 parts In-Stock

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$33.000

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Corohmni

South Africa . 1,011 parts In-Stock

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$35.531

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Component Stockers USA

USA . 678 parts In-Stock

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$99.990

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Microchip USA

USA . 2,025 parts In-Stock

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$149.260

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$145.280

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$143.290

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$141.300

2,025

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$145.280

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$141.300

Kepictronics

USA . 6,000 parts In-Stock

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Corphita

USA . 4,756 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the TMS32C6415EGLZ6E3 by Texas Instruments. This high-quality DSP offers unmatched performance and reliability, thanks to its advanced features and innovative technology. Ideal for a wide range of applications, this product provides customers with unparalleled value and benefits, making it the perfect choice for those seeking superior processing power and efficiency. Trust Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and protection for the DSP, making it suitable for various environments and applications.

Integrated Cache: YES

Integrated cache helps in improving the performance and efficiency of the DSP by reducing memory access time and enhancing overall processing speed.

Maximum Supply Voltage: 1.44 V

Higher maximum supply voltage allows for better performance and flexibility in power management for the digital signal processor.

Address Bus Width: 32

With a wider address bus width of 32, this DSP can access and process a larger amount of memory locations, enhancing its data processing capabilities.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into various system designs.

Bit Size: 32

A 32-bit architecture provides enhanced computational power and precision in processing digital signals efficiently and accurately.

Power Supplies (V): 1.4, 3.3

Support for multiple power supply voltages (1.4V and 3.3V) offers flexibility in power management and compatibility with different system requirements.

No. of Terminals: 532

Having a high number of terminals allows for versatile connectivity options and integration with other components in a system.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C enables the DSP to perform reliably in demanding thermal conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the DSP can function effectively in a wide range of temperature environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and reliability for easy assembly and long-term performance of the DSP.

Terminal Position: BOTTOM

Bottom terminal position allows for convenient placement and soldering of the DSP onto a PCB, simplifying the assembly process.

RAM Words: 16384

Large RAM capacity of 16384 words enables the DSP to store and manipulate a significant amount of data efficiently during signal processing tasks.

Width: 23 mm

Compact width dimension of 23mm makes the DSP suitable for applications where space is limited and compact designs are required.

External Data Bus Width: 64

A wider external data bus width of 64 facilitates faster data transfer between the DSP and external memory or peripherals, enhancing overall performance.

Maximum Clock Frequency: 75.18 MHz

A high maximum clock frequency of 75.18 MHz allows the DSP to execute instructions and process signals at a faster rate, improving overall efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6415EGLZ6E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6415EGLZ6E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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