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TMS32C6414CGLZ5E0

Texas Instruments

TMS32C6414CGLZ5E0 by Texas Instruments

TMS32C6414CGLZ5E0 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and max clock frequency of 75.19 MHz. Ideal for digital signal processing applications requiring low power mode and fixed-point format in a compact square package.

Median Price

$57.938

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 420 parts In-Stock

1+ parts

-

100+ parts

$51.500

1k+ parts

$46.080

10k+ parts

$43.370

420

-

$51.500

$46.080

$43.370

DigiKey

USA . 420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

420

-

-

-

-

Verical

USA . 420 parts In-Stock

1+ parts

-

100+ parts

$64.375

1k+ parts

$57.600

10k+ parts

$54.212

420

-

$64.375

$57.600

$54.212

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,945 parts In-Stock

1+ parts

$54.359

100+ parts

-

1k+ parts

-

10k+ parts

-

2,945

$54.359

-

-

-

Vyrian

USA . 4,854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,854

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,955 parts In-Stock

1+ parts

$17.162

100+ parts

-

1k+ parts

$17.378

10k+ parts

-

1,955

$17.162

-

$17.378

-

DigiPath Technology Company

USA . 356 parts In-Stock

1+ parts

$18.897

100+ parts

-

1k+ parts

-

10k+ parts

-

356

$18.897

-

-

-

ChromeModa Solutions

Germany . 6,722 parts In-Stock

1+ parts

$19.283

100+ parts

$15.812

1k+ parts

-

10k+ parts

-

6,722

$19.283

$15.812

-

-

IDEA Electronic Components Group

UK . 1,067 parts In-Stock

1+ parts

$19.283

100+ parts

$18.319

1k+ parts

$17.355

10k+ parts

-

1,067

$19.283

$18.319

$17.355

-

Corohmni

South Africa . 2,533 parts In-Stock

1+ parts

$34.738

100+ parts

-

1k+ parts

-

10k+ parts

-

2,533

$34.738

-

-

-

Corphita

USA . 2,559 parts In-Stock

1+ parts

$51.498

100+ parts

-

1k+ parts

-

10k+ parts

-

2,559

$51.498

-

-

-

Component Stockers USA

USA . 259 parts In-Stock

1+ parts

$58.570

100+ parts

$55.050

1k+ parts

-

10k+ parts

-

259

$58.570

$55.050

-

-

Overview

Experience unparalleled performance and efficiency with the TMS32C6414CGLZ5E0 by Texas Instruments, a leading manufacturer of high-quality Digital Signal Processors (DSPs). This innovative device offers a wide range of applications in various industries, providing customers with superior value and benefits. With its advanced technology and reliable design, this product delivers exceptional results, making it the ideal choice for your digital processing needs. Trust Texas Instruments to provide you with top-of-the-line solutions that enhance your productivity and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design.

Maximum Supply Voltage: 1.26 V

This allows for efficient power usage and reduces the risk of overloading the product.

Address Bus Width: 23

A wider address bus allows for faster data processing and improved performance.

Bit Size: 32

A higher bit size provides better precision and accuracy in signal processing.

Power Supplies (V): 1.2,3.3

Multiple power supply options increase flexibility in system design and implementation.

No. of Terminals: 532

Having a large number of terminals allows for more connectivity options and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

This package style offers efficient signal routing and high-density integration.

Minimum Supply Voltage: 1.14 V

This ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The product can operate effectively in a wide range of temperatures, enhancing its versatility.

Terminal Position: BOTTOM

Bottom terminal position allows for easy connection to other components in the system.

Maximum Seated Height: 3.3 mm

A low seated height makes the product suitable for compact and slim designs.

RAM Words: 16384

Having a large RAM capacity enables the product to handle extensive data processing tasks efficiently.

Width: 23 mm

Compact width makes the product suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging the product during development and production.

External Data Bus Width: 64

A wide external data bus allows for fast data transfer and processing.

Maximum Clock Frequency: 75.19 MHz

High clock frequency enables quick data processing and responsiveness of the product.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and connectivity within the product.

Length: 23 mm

Compact length ensures the product can fit into various form factors and designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows for a wide range of signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high performance, making the product energy-efficient.

Terminal Form: BALL

Ball terminal form simplifies the installation process and ensures reliable connectivity.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance of the product.

Terminal Pitch: 0.8 mm

A fine terminal pitch allows for high-density mounting and compact PCB design.

Format: FIXED POINT

Fixed-point format is suitable for precise mathematical calculations and signal processing.

Low Power Mode: YES

Low power mode helps in reducing energy consumption and increasing the product's efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6414CGLZ5E0 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6414CGLZ5E0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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