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TMS32C6205DGWTA200

Texas Instruments

TMS32C6205DGWTA200 by Texas Instruments

TMS32C6205DGWTA200 by Texas Instruments is a 32-bit DSP with 8-word cache, 32-bit address bus, and 200 MHz clock frequency. Ideal for industrial applications requiring low power consumption and high-speed data processing. Features include flash ROM programmability, boundary scan support, and multiple internal bus architecture.

Median Price

$26.340

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 90 parts In-Stock

1+ parts

$26.340

100+ parts

$20.750

1k+ parts

$18.840

10k+ parts

$16.900

90

$26.340

$20.750

$18.840

$16.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 667 parts In-Stock

1+ parts

$25.023

100+ parts

-

1k+ parts

-

10k+ parts

-

667

$25.023

-

-

-

Vyrian

USA . 6,841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,841

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,074 parts In-Stock

1+ parts

$14.762

100+ parts

-

1k+ parts

$15.197

10k+ parts

-

2,074

$14.762

-

$15.197

-

DigiPath Technology Company

USA . 2,055 parts In-Stock

1+ parts

$16.254

100+ parts

$14.954

1k+ parts

-

10k+ parts

-

2,055

$16.254

$14.954

-

-

ChromeModa Solutions

Germany . 2,707 parts In-Stock

1+ parts

$16.586

100+ parts

$13.601

1k+ parts

-

10k+ parts

-

2,707

$16.586

$13.601

-

-

IDEA Electronic Components Group

UK . 570 parts In-Stock

1+ parts

$16.586

100+ parts

$15.757

1k+ parts

$14.927

10k+ parts

-

570

$16.586

$15.757

$14.927

-

Corphita

USA . 242 parts In-Stock

1+ parts

$23.706

100+ parts

-

1k+ parts

-

10k+ parts

-

242

$23.706

-

-

-

Corohmni

South Africa . 1,121 parts In-Stock

1+ parts

$71.506

100+ parts

-

1k+ parts

-

10k+ parts

-

1,121

$71.506

-

-

-

Microchip USA

USA . 2,415 parts In-Stock

1+ parts

$152.640

100+ parts

$149.980

1k+ parts

$148.660

10k+ parts

$147.330

2,415

$152.640

$149.980

$148.660

$147.330

Overview

Experience the cutting-edge technology of Texas Instruments with the TMS32C6205DGWTA200 Digital Signal Processor. This powerful DSP offers unparalleled performance and efficiency, making it ideal for a wide range of applications. From audio processing to telecommunications, this versatile chip delivers high-quality results with ease. Trust in Texas Instruments' legacy of innovation and reliability, and elevate your projects to new heights with the TMS32C6205DGWTA200. Unlock the potential of digital signal processing and take your designs to the next level with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides lightweight and durable packaging for easy handling and protection of the DSP.

Integrated Cache: YES

Allows for faster data access and processing, improving overall performance of the DSP.

RAM Words: 65536

Offers a large amount of memory for storage and retrieval of data, making it suitable for complex signal processing tasks.

Maximum Clock Frequency: 200 MHz

Enables high-speed operation for real-time processing of signals, enhancing the responsiveness of the DSP.

Technology: CMOS

Utilizes low power consumption and high noise immunity, making the DSP efficient and reliable in various applications.

ROM Programmability: FLASH

Facilitates easy reprogramming of the read-only memory, allowing for flexibility and customization of the DSP's functions.

Low Power Mode: YES

Supports energy-efficient operation by reducing power consumption when the DSP is idle or under low processing load.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6205DGWTA200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

290 mA

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS32C6205DGWTA200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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