Loading...

TMS320VC5510AGPHA2

Texas Instruments

TMS320VC5510AGPHA2 by Texas Instruments

TMS320VC5510AGPHA2 by Texas Instruments is a 16-bit DSP with 32-bit external data bus, operating at max 50 MHz. Ideal for industrial applications, it features 163840 RAM words, operates b/w -40 to 85 °C, and has low power mode for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,030 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,030

-

-

-

-

Digiode

USA . 1,673 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,673

-

-

-

-

Semi Source

USA . 149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

149

-

-

-

-

Electronic Expediters

USA . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 483 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

483

$10.000

-

-

-

AZTECH Wire

Italy . 730 parts In-Stock

1+ parts

$18.095

100+ parts

-

1k+ parts

-

10k+ parts

-

730

$18.095

-

-

-

Parana Technologies

USA . 1,139 parts In-Stock

1+ parts

$53.747

100+ parts

-

1k+ parts

-

10k+ parts

-

1,139

$53.747

-

-

-

DigiPath Technology Company

USA . 2,303 parts In-Stock

1+ parts

$59.182

100+ parts

$54.448

1k+ parts

-

10k+ parts

-

2,303

$59.182

$54.448

-

-

ChromeModa Solutions

Germany . 6,885 parts In-Stock

1+ parts

$60.390

100+ parts

$49.520

1k+ parts

-

10k+ parts

-

6,885

$60.390

$49.520

-

-

IDEA Electronic Components Group

UK . 1,057 parts In-Stock

1+ parts

$60.390

100+ parts

$57.370

1k+ parts

$54.351

10k+ parts

-

1,057

$60.390

$57.370

$54.351

-

Corohmni

South Africa . 4,904 parts In-Stock

1+ parts

$68.971

100+ parts

-

1k+ parts

-

10k+ parts

-

4,904

$68.971

-

-

-

Corphita

USA . 1,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,364

-

-

-

-

Microchip USA

USA . 481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

481

-

-

-

-

Overview

Unlock the power of digital signal processing with the TMS320VC5510AGPHA2 by Texas Instruments. Designed to deliver high-quality performance, this DSP offers unmatched precision and efficiency. Ideal for a wide range of applications in industries such as telecommunications, audio processing, and industrial automation, this product provides customers with exceptional value and reliability. Trust in Texas Instruments' legacy of excellence and innovation, and experience the benefits of cutting-edge technology with the TMS320VC5510AGPHA2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product suitable for various applications.

Surface Mount: YES

This feature allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.65 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product energy-efficient.

Address Bus Width: 22

With a wide address bus width, the product can handle complex processing tasks and large datasets efficiently.

Bit Size: 16

The 16-bit architecture allows for fast data processing and manipulation, suitable for real-time applications that require quick response times.

Power Supplies (V): 1.6,3.3

The availability of multiple power supply options gives flexibility in designing and integrating the product into different systems.

No. of Terminals: 205

The high number of terminals allows for more connectivity options and interfaces, enhancing the product's versatility.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers compact size, high density, and reliability, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.55 V

The low minimum supply voltage ensures stable operation even under low power conditions, improving the product's reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the product to function in harsh environments without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can operate in extreme cold conditions, increasing its usability in various applications.

Terminal Finish: TIN LEAD

The use of tin-lead terminal finish provides good solderability and reliability, essential for ensuring a robust electrical connection.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripheral IC types expands the product's capabilities and compatibility with different systems and devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5510AGPHA2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B205

JESD-609 Code:

e0

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

205

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA205,17X17,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

163840

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5510AGPHA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20