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TMS320VC5507GBB

Texas Instruments

TMS320VC5507GBB by Texas Instruments

TMS320VC5507GBB by Texas Instruments is a 16-bit DSP with 179 terminals, operating at max 20 MHz. Ideal for industrial applications, it features 65536 RAM words, low power mode, and boundary scan capability.

Median Price

$15.753

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,652 parts In-Stock

1+ parts

$15.753

100+ parts

$13.761

1k+ parts

$9.490

10k+ parts

-

2,652

$15.753

$13.761

$9.490

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,064 parts In-Stock

1+ parts

$14.965

100+ parts

-

1k+ parts

-

10k+ parts

-

1,064

$14.965

-

-

-

Vyrian

USA . 4,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,071

-

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 562 parts In-Stock

1+ parts

$8.730

100+ parts

-

1k+ parts

-

10k+ parts

-

562

$8.730

-

-

-

Corphita

USA . 3,366 parts In-Stock

1+ parts

$14.178

100+ parts

-

1k+ parts

-

10k+ parts

-

3,366

$14.178

-

-

-

Corohmni

South Africa . 237 parts In-Stock

1+ parts

$34.390

100+ parts

-

1k+ parts

-

10k+ parts

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237

$34.390

-

-

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Parana Technologies

USA . 2,251 parts In-Stock

1+ parts

$55.661

100+ parts

-

1k+ parts

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10k+ parts

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2,251

$55.661

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-

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DigiPath Technology Company

USA . 297 parts In-Stock

1+ parts

$61.289

100+ parts

$56.386

1k+ parts

-

10k+ parts

-

297

$61.289

$56.386

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ChromeModa Solutions

Germany . 1,088 parts In-Stock

1+ parts

$62.540

100+ parts

$51.283

1k+ parts

-

10k+ parts

-

1,088

$62.540

$51.283

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-

IDEA Electronic Components Group

UK . 589 parts In-Stock

1+ parts

$62.540

100+ parts

$59.413

1k+ parts

$56.286

10k+ parts

-

589

$62.540

$59.413

$56.286

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Overview

Elevate your digital signal processing capabilities with the TMS320VC5507GBB by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge technology with this DSP, offering unparalleled performance and efficiency. Whether you're working on audio processing, image recognition, or control systems, this versatile processor provides the speed and precision you need to bring your projects to life. Discover the value and reliability that Texas Instruments brings to the table with the TMS320VC5507GBB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to damage, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy PCB integration and saves space in the design, making the product more efficient.

Maximum Supply Voltage: 1.65 V

Operating at a maximum voltage of 1.65V ensures energy efficiency and low power consumption, making the product ideal for battery-operated devices.

On Chip Data RAM Width: 16

The 16-bit data RAM width enables faster data processing and manipulation, enhancing the overall performance of the product.

Address Bus Width: 21

With a wide 21-bit address bus, the product can access a large memory space, allowing for complex algorithms and processing tasks to be executed efficiently.

Package Shape: SQUARE

The square package shape makes it easier to align and mount the product on the PCB, ensuring a secure and stable connection.

Bit Size: 16

Operating with a 16-bit architecture allows for high-speed calculations and data operations, making the product suitable for real-time signal processing applications.

No. of Terminals: 179

With a high number of terminals, the product offers multiple connectivity options and interfaces, enhancing its versatility in different system configurations.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures efficient heat dissipation, compact size, and high reliability for the product's design.

Minimum Supply Voltage: 1.55 V

Having a minimum supply voltage of 1.55V allows the product to operate at lower power levels without compromising performance, leading to energy savings.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C enables the product to withstand harsh environmental conditions, ensuring reliable operation in rugged applications.

No. of External Interrupts: 5

The availability of 5 external interrupts allows the product to respond to external events promptly, enhancing its responsiveness and real-time processing capabilities.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the product can perform reliably in extreme cold environments without any degradation in performance.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides excellent solderability and conductivity, ensuring a robust electrical connection and reliability in the product's operation.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy and secure soldering during PCB assembly, ensuring a stable connection and efficient manufacturing process.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4mm allows for a compact product design, saving space on the PCB and enabling integration in slim devices.

RAM Words: 65536

With 65536 RAM words, the product can store and process a large amount of data, enabling complex algorithms and multi-tasking capabilities for enhanced performance.

Width: 12 mm

The compact width of 12mm makes the product suitable for space-constrained applications where size is a critical factor, ensuring easy integration and installation.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the product during the manufacturing process, ensuring high quality and reliability in the final product.

External Data Bus Width: 16

Operating with a 16-bit external data bus width enables fast data transfer between the processor and external devices, enhancing overall system performance.

Maximum Clock Frequency: 20 MHz

With a maximum clock frequency of 20MHz, the product can execute instructions at a high speed, improving processing efficiency and real-time performance.

Maximum Time At Peak Reflow Temperature (s): 20

The 20-second maximum reflow time at peak temperature ensures proper soldering and component reliability during manufacturing, leading to high-quality products.

Peak Reflow Temperature °C: 220

Operating at a peak reflow temperature of 220°C allows for reliable soldering and component mounting, ensuring robust connections in the product's assembly.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enables efficient data transfer and processing within the processor, enhancing overall speed and performance of the product.

Length: 12 mm

The compact length of 12mm makes the product suitable for space-limited designs, ensuring easy integration and efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

The industrial temperature grade design ensures reliable operation in harsh environments, making the product suitable for industrial applications with demanding temperature requirements.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with other peripheral ICs enhances the product's functionality and versatility, allowing for a wide range of signal processing tasks and applications.

No. of Timers: 2

Having 2 timers allows the product to handle timing and scheduling tasks efficiently, enhancing its capability to perform time-critical operations in various applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high speed, and reliability, making the product energy-efficient and suitable for battery-operated devices.

Terminal Form: BALL

The ball terminal form provides reliable connections for surface mount soldering, ensuring secure attachment to the PCB and optimal electrical conductivity.

Nominal Supply Voltage: 1.6 V

Operating at a nominal supply voltage of 1.6V offers a balance between energy efficiency and performance, making the product suitable for a wide range of applications.

No. of DMA Channels: 6

The availability of 6 DMA channels allows for efficient data transfer and management, enhancing the product's ability to handle high-speed data processing tasks.

ROM Programmability: MROM

MROM programmability provides non-volatile memory storage for essential code and data, ensuring secure and reliable operation of the product.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the product allows for compact PCB design and easy soldering, ensuring efficient assembly and reliable electrical connections.

Format: FIXED POINT

Operating with fixed-point format allows for efficient numerical computations and precision in data processing, making the product suitable for DSP applications requiring accurate calculations.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the product can withstand moderate exposure to moisture during handling and storage, ensuring long-term reliability.

Low Power Mode: YES

The low power mode feature allows the product to operate in a power-efficient state when not performing intensive tasks, extending battery life and reducing energy consumption.

On Chip Program ROM Width: 16

With a 16-bit program ROM width, the product can store and execute code efficiently, enhancing program execution speed and overall performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5507GBB attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2V AND 1.35 V SUPPLY

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of Terminals:

179

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5507GBB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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