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TMS320VC5506GHH

Texas Instruments

TMS320VC5506GHH by Texas Instruments

TMS320VC5506GHH by Texas Instruments is a 32-bit DSP with 16-bit data RAM, operating at max 20 MHz. Ideal for industrial applications, it features low power mode, 179 terminals, and supports boundary scan testing.

Median Price

$9.190

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,929 parts In-Stock

1+ parts

$9.190

100+ parts

$9.010

1k+ parts

$8.820

10k+ parts

-

4,929

$9.190

$9.010

$8.820

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,534 parts In-Stock

1+ parts

-

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-

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4,534

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Vyrian

USA . 2,484 parts In-Stock

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-

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2,484

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Distributors (Availability)

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AZTECH Wire

Italy . 477 parts In-Stock

1+ parts

$4.908

100+ parts

-

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-

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477

$4.908

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One Stop Electronics

USA . 1,150 parts In-Stock

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$19.000

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-

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1,150

$19.000

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Parana Technologies

USA . 1,561 parts In-Stock

1+ parts

$43.048

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1,561

$43.048

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DigiPath Technology Company

USA . 588 parts In-Stock

1+ parts

$47.402

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588

$47.402

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IDEA Electronic Components Group

UK . 1,557 parts In-Stock

1+ parts

$48.369

100+ parts

$45.951

1k+ parts

$43.532

10k+ parts

-

1,557

$48.369

$45.951

$43.532

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ChromeModa Solutions

Germany . 1,123 parts In-Stock

1+ parts

$48.369

100+ parts

$39.663

1k+ parts

-

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1,123

$48.369

$39.663

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Corohmni

South Africa . 5,167 parts In-Stock

1+ parts

$59.892

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5,167

$59.892

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Kepictronics

USA . 640 parts In-Stock

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640

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Corphita

USA . 572 parts In-Stock

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572

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Perfect Parts

USA . 523 parts In-Stock

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523

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Microchip USA

USA . 149 parts In-Stock

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149

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Overview

Unlock the power of digital signal processing with the TMS320VC5506GHH by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that are highly reliable and efficient. This DSP is perfect for a wide range of applications, from audio processing to telecommunications. With its advanced features and low power mode, the TMS320VC5506GHH offers exceptional value and performance, making it the ideal choice for customers looking to take their projects to the next level. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable in different operating conditions.

Surface Mount: YES

Surface mount technology simplifies the manufacturing process and allows for compact designs, saving space.

Maximum Supply Voltage: 1.26 V

Efficient power management with a low maximum supply voltage helps in conserving energy and reducing heat generation.

On Chip Data RAM Width: 16

With a wider on-chip data RAM width, the processor can handle larger datasets and improve overall performance.

Address Bus Width: 21

A wider address bus allows for accessing a larger memory space, enhancing the processor's capabilities in processing complex algorithms.

Package Shape: SQUARE

Square packages provide better thermal performance and are easier to handle during assembly, contributing to the product's reliability.

Bit Size: 32

A 32-bit architecture enables faster data processing and higher computational capabilities, making it suitable for demanding applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows flexibility in system design and compatibility with various components.

No. of Terminals: 179

Having a high number of terminals provides connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density and reliability, making it suitable for applications where space is limited.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for efficient power consumption and extends the product's battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the processor can withstand harsh environmental conditions without performance degradation.

No. of External Interrupts: 5

Having multiple external interrupts enables the processor to respond quickly to external events, improving real-time responsiveness.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold environments without compromising performance.

Terminal Finish: TIN LEAD

The tin-lead finish provides good solderability and solder joint reliability, ensuring stable connections in various operating conditions.

RAM Words: 65536

With a large RAM capacity, the processor can efficiently store and access data, enhancing its processing capabilities.

Width: 12 mm

Compact width dimensions allow for space-saving designs and easy integration into a variety of electronic systems.

Boundary Scan: YES

Boundary scan support facilitates testing and debugging of the product during manufacturing, ensuring product quality and reliability.

External Data Bus Width: 16

A wider external data bus width facilitates faster data transfer between the processor and external memory or peripherals.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast data processing and real-time responsiveness, making the processor suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 20

With a short peak reflow time, the product can undergo the solder reflow process efficiently and reliably during assembly.

Peak Reflow Temperature °C: 220

The high peak reflow temperature ensures proper solder connections and reliability during the assembly process.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer speeds and efficiency within the processor, improving overall performance.

Length: 12 mm

Compact length dimensions contribute to space-efficient designs and easy integration into various electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures the processor's reliability and stability in harsh operating environments.

No. of Timers: 3

Multiple timers provide timing and scheduling functionalities, essential for various time-dependent applications and tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form simplifies the soldering process during assembly and provides reliable electrical connections.

Nominal Supply Voltage: 1.2 V

Stable and efficient nominal supply voltage ensures consistent performance and power consumption for the product.

No. of DMA Channels: 6

Multiple DMA channels enable efficient data transfer between memory and peripherals, enhancing the processor's overall performance.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density packaging and facilitates tight layout designs in compact electronic systems.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances computational accuracy, making the processor suitable for signal processing applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product can withstand moderate exposure to moisture during handling and storage.

Low Power Mode: YES

Low power mode functionality enhances energy efficiency and extends battery life, making the product suitable for power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5506GHH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQURIES 3.3 SUPPLY

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of Terminals:

179

No. of Timers:

3

On Chip Data RAM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5506GHH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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