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TMS320VC5502ZAV300

Texas Instruments

TMS320VC5502ZAV300 by Texas Instruments

TMS320VC5502ZAV300 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and 20 MHz max clock frequency. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$17.268

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 277 parts In-Stock

1+ parts

$12.926

100+ parts

$11.291

1k+ parts

$7.787

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277

$12.926

$11.291

$7.787

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Mouser Electronics

USA . 512 parts In-Stock

1+ parts

$21.610

100+ parts

$13.450

1k+ parts

$13.030

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512

$21.610

$13.450

$13.030

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Distributors (In-Stock)

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Digiode

USA . 3,345 parts In-Stock

1+ parts

$12.280

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3,345

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Vyrian

USA . 8,300 parts In-Stock

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8,300

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Chip Stock

USA . 460 parts In-Stock

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460

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Distributors (Availability)

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Corphita

USA . 1,916 parts In-Stock

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$11.633

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1,916

$11.633

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Parana Technologies

USA . 1,984 parts In-Stock

1+ parts

$21.563

100+ parts

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$21.955

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1,984

$21.563

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$21.955

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DigiPath Technology Company

USA . 291 parts In-Stock

1+ parts

$23.743

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291

$23.743

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Corohmni

South Africa . 5,019 parts In-Stock

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$24.091

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$24.091

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IDEA Electronic Components Group

UK . 1,107 parts In-Stock

1+ parts

$24.228

100+ parts

$23.017

1k+ parts

$21.805

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1,107

$24.228

$23.017

$21.805

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ChromeModa Solutions

Germany . 11 parts In-Stock

1+ parts

$24.228

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$19.867

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11

$24.228

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Lixinc

USA . 12,117 parts In-Stock

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A-Z Elektronik GmbH

Germany . 252 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMS320VC5502ZAV300 by Texas Instruments, a leader in digital signal processors. Ideal for a wide range of applications, this advanced DSP offers integrated cache, low power mode, and boundary scan capabilities. With a compact design and top-notch quality, this product provides exceptional value and benefits to customers seeking cutting-edge technology. Upgrade your projects with the industry-leading TMS320VC5502ZAV300 and unleash its power for superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to physical damage, making this product suitable for a variety of environments.

Integrated Cache: YES

The integrated cache enhances the processing speed and efficiency of the DSP, resulting in improved performance in handling complex signal processing tasks.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V allows for efficient power management and ensures compatibility with a wide range of power sources.

Address Bus Width: 20

With an address bus width of 20, this DSP can access a large memory address space, enabling it to handle large amounts of data and process complex algorithms efficiently.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency of 20 MHz allows for fast data processing and real-time signal handling, making this DSP ideal for high-speed applications.

No. of DMA Channels: 6

The presence of 6 DMA channels provides efficient data transfer capabilities and reduces the load on the processor, enhancing overall system performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5502ZAV300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

201

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5502ZAV300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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