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TMS320VC5502ZAV200

Texas Instruments

TMS320VC5502ZAV200 by Texas Instruments

TMS320VC5502ZAV200 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and 20 MHz max clock frequency. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$9.943

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,364 parts In-Stock

1+ parts

$9.943

100+ parts

$8.686

1k+ parts

$5.990

10k+ parts

-

1,364

$9.943

$8.686

$5.990

-

Mouser Electronics

USA . 74 parts In-Stock

1+ parts

$17.680

100+ parts

$10.100

1k+ parts

$9.530

10k+ parts

-

74

$17.680

$10.100

$9.530

-

Chip1Stop

Japan . 630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.486

10k+ parts

-

630

-

-

$8.486

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,297 parts In-Stock

1+ parts

$9.446

100+ parts

-

1k+ parts

-

10k+ parts

-

4,297

$9.446

-

-

-

Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$10.420

100+ parts

-

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-

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44

$10.420

-

-

-

Vyrian

USA . 3,383 parts In-Stock

1+ parts

-

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-

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3,383

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-

-

-

Chip Stock

USA . 3,200 parts In-Stock

1+ parts

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10k+ parts

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3,200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,165 parts In-Stock

1+ parts

$8.949

100+ parts

-

1k+ parts

-

10k+ parts

-

3,165

$8.949

-

-

-

Continental Prestige Electronics

USA . 5,026 parts In-Stock

1+ parts

$10.420

100+ parts

-

1k+ parts

-

10k+ parts

$10.212

5,026

$10.420

-

-

$10.212

Ampacity Inc.

Singapore . 319 parts In-Stock

1+ parts

$15.700

100+ parts

-

1k+ parts

-

10k+ parts

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319

$15.700

-

-

-

Corohmni

South Africa . 3,078 parts In-Stock

1+ parts

$24.375

100+ parts

-

1k+ parts

-

10k+ parts

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3,078

$24.375

-

-

-

Microchip USA

USA . 3,533 parts In-Stock

1+ parts

$28.705

100+ parts

-

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-

10k+ parts

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3,533

$28.705

-

-

-

Parana Technologies

USA . 2,299 parts In-Stock

1+ parts

$41.286

100+ parts

-

1k+ parts

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10k+ parts

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2,299

$41.286

-

-

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ChromeModa Solutions

Germany . 3,012 parts In-Stock

1+ parts

$46.389

100+ parts

$38.039

1k+ parts

-

10k+ parts

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3,012

$46.389

$38.039

-

-

IDEA Electronic Components Group

UK . 1,052 parts In-Stock

1+ parts

$46.389

100+ parts

$44.070

1k+ parts

$41.750

10k+ parts

-

1,052

$46.389

$44.070

$41.750

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Lixinc

USA . 18,025 parts In-Stock

1+ parts

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18,025

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-

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

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4,500

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-

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Argo Parts USA

USA . 4,151 parts In-Stock

1+ parts

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4,151

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-

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DigiPath Technology Company

USA . 401 parts In-Stock

1+ parts

-

100+ parts

$41.824

1k+ parts

-

10k+ parts

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401

-

$41.824

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$10.212

1k+ parts

$9.899

10k+ parts

$9.691

100

-

$10.212

$9.899

$9.691

Overview

Unlock the power of digital signal processing with the TMS320VC5502ZAV200 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that are trusted by professionals worldwide. The TMS320VC5502ZAV200 falls under the category of Digital Signal Processors (DSPs) and offers integrated cache, surface mount capabilities, and a wide range of applications. With its low power mode and high-speed performance, this product provides unparalleled value and benefits to customers looking for reliable and efficient solutions for their projects. Experience the advantages of cutting-edge technology with the TMS320VC5502ZAV200 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for various industrial applications.

Integrated Cache: YES

The integrated cache helps in reducing the access time to frequently used data, enhancing the overall performance of the DSP.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for flexibility in power supply options while operating the DSP.

Address Bus Width: 20

Having a wider address bus width enables the DSP to access a larger memory space, facilitating complex signal processing tasks.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DSP can function efficiently in various environmental conditions without overheating.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency allows for fast processing of signals, making this DSP suitable for real-time applications.

Technology: CMOS

The CMOS technology used in this DSP ensures low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5502ZAV200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

201

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5502ZAV200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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