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TMS320VC549PGER100

Texas Instruments

TMS320VC549PGER100 by Texas Instruments

TMS320VC549PGER100 by Texas Instruments is a 16-bit DSP with 23-bit address bus width, operating at max 20 MHz clock frequency. Ideal for industrial applications, it features low power mode, barrel shifter, and 65536 RAM words for efficient signal processing tasks.

Median Price

$35.280

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 72 parts In-Stock

1+ parts

-

100+ parts

$31.360

1k+ parts

$28.060

10k+ parts

$26.410

72

-

$31.360

$28.060

$26.410

DigiKey

USA . 72 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

72

-

-

-

-

Verical

USA . 72 parts In-Stock

1+ parts

-

100+ parts

$39.200

1k+ parts

$35.075

10k+ parts

$33.013

72

-

$39.200

$35.075

$33.013

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,584 parts In-Stock

1+ parts

$33.108

100+ parts

-

1k+ parts

-

10k+ parts

-

3,584

$33.108

-

-

-

Vyrian

USA . 7,268 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,268

-

-

-

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DigiKey Marketplace

USA . 72 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

72

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 546 parts In-Stock

1+ parts

$15.563

100+ parts

-

1k+ parts

-

10k+ parts

-

546

$15.563

-

-

-

Corphita

USA . 549 parts In-Stock

1+ parts

$31.365

100+ parts

-

1k+ parts

-

10k+ parts

-

549

$31.365

-

-

-

Parana Technologies

USA . 1,936 parts In-Stock

1+ parts

$73.938

100+ parts

-

1k+ parts

-

10k+ parts

-

1,936

$73.938

-

-

-

Microchip USA

USA . 328 parts In-Stock

1+ parts

$76.960

100+ parts

$75.620

1k+ parts

$74.950

10k+ parts

$74.280

328

$76.960

$75.620

$74.950

$74.280

DigiPath Technology Company

USA . 1,338 parts In-Stock

1+ parts

$81.414

100+ parts

$74.901

1k+ parts

-

10k+ parts

-

1,338

$81.414

$74.901

-

-

ChromeModa Solutions

Germany . 3,265 parts In-Stock

1+ parts

$83.076

100+ parts

$68.122

1k+ parts

-

10k+ parts

-

3,265

$83.076

$68.122

-

-

IDEA Electronic Components Group

UK . 113 parts In-Stock

1+ parts

$83.076

100+ parts

$78.922

1k+ parts

$74.768

10k+ parts

-

113

$83.076

$78.922

$74.768

-

Overview

Unlock the power of digital signal processing with the TMS320VC549PGER100 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge technology in the form of this DSP, perfect for applications in telecommunications, audio processing, and more. With a range of features like low power mode and barrel shifter, this product offers unparalleled value and performance to customers looking to take their projects to the next level. Trust in Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the internal components of the DSP, ensuring long-term reliability.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V allows for efficient power management while still providing adequate power for the DSP to perform its functions effectively.

Bit Size: 16

With a bit size of 16, this DSP is capable of processing digital signals with high precision and accuracy, making it suitable for a wide range of applications.

RAM Words: 65536

The large RAM capacity of 65536 words allows for extensive data storage and processing, enabling the DSP to handle complex algorithms and calculations efficiently.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency of 20 MHz enables the DSP to execute commands and process data at a fast pace, making it ideal for real-time applications that require quick response times.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the DSP can withstand harsh operating conditions, making it suitable for use in industrial environments where temperature variations are common.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC549PGER100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC549PGER100 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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