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TMS320VC549GGU-80

Texas Instruments

TMS320VC549GGU-80 by Texas Instruments

TMS320VC549GGU-80 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20 MHz. Ideal for industrial applications, it features low power mode, barrel shifter, and CMOS technology for efficient signal processing tasks.

Median Price

$48.240

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 84 parts In-Stock

1+ parts

-

100+ parts

$42.880

1k+ parts

$38.370

10k+ parts

$36.110

84

-

$42.880

$38.370

$36.110

DigiKey

USA . 84 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

84

-

-

-

-

Verical

USA . 84 parts In-Stock

1+ parts

-

100+ parts

$53.600

1k+ parts

$47.962

10k+ parts

$45.138

84

-

$53.600

$47.962

$45.138

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,405 parts In-Stock

1+ parts

$45.277

100+ parts

-

1k+ parts

-

10k+ parts

-

4,405

$45.277

-

-

-

DigiKey Marketplace

USA . 84 parts In-Stock

1+ parts

$49.570

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$49.570

-

-

-

Vyrian

USA . 2,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,931

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 618 parts In-Stock

1+ parts

$19.782

100+ parts

-

1k+ parts

-

10k+ parts

-

618

$19.782

-

-

-

Ampacity Inc.

Singapore . 84 parts In-Stock

1+ parts

$40.510

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$40.510

-

-

-

Corphita

USA . 2,233 parts In-Stock

1+ parts

$42.894

100+ parts

-

1k+ parts

-

10k+ parts

-

2,233

$42.894

-

-

-

Parana Technologies

USA . 616 parts In-Stock

1+ parts

$45.580

100+ parts

-

1k+ parts

-

10k+ parts

-

616

$45.580

-

-

-

DigiPath Technology Company

USA . 1,934 parts In-Stock

1+ parts

$50.190

100+ parts

$46.175

1k+ parts

-

10k+ parts

-

1,934

$50.190

$46.175

-

-

ChromeModa Solutions

Germany . 4,390 parts In-Stock

1+ parts

$51.214

100+ parts

$41.995

1k+ parts

-

10k+ parts

-

4,390

$51.214

$41.995

-

-

IDEA Electronic Components Group

UK . 952 parts In-Stock

1+ parts

$51.214

100+ parts

$48.653

1k+ parts

$46.093

10k+ parts

-

952

$51.214

$48.653

$46.093

-

Microchip USA

USA . 108 parts In-Stock

1+ parts

$105.230

100+ parts

$103.400

1k+ parts

$102.480

10k+ parts

$101.570

108

$105.230

$103.400

$102.480

$101.570

Overview

Unleash the power of cutting-edge technology with the TMS320VC549GGU-80 by Texas Instruments, a top-of-the-line Digital Signal Processor that is setting new standards in performance and efficiency. With a reputation for excellence, Texas Instruments has crafted this device to deliver unparalleled processing capabilities, making it ideal for a wide range of applications. Experience seamless operation, superior quality, and unmatched reliability with this innovative product. Elevate your projects to new heights with the TMS320VC549GGU-80 and unlock endless possibilities in the world of digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and rework, making the product convenient for manufacturing and maintenance.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Address Bus Width: 23

The wide address bus width allows for efficient memory addressing and data processing capabilities, enhancing the product's performance.

Package Shape: SQUARE

The square package shape provides a compact form factor, saving space and enabling easy integration into different systems.

Bit Size: 16

The 16-bit architecture offers a good balance between processing capability and power efficiency, making the product suitable for various signal processing tasks.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages enhances compatibility with different systems and allows for flexible power management.

No. of Terminals: 144

The high number of terminals provides ample connectivity options, enabling the product to interface with various other components effectively.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style options offer flexibility in mounting and assembly, making the product suitable for different PCB designs and manufacturing processes.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures stable operation even under low power conditions, enhancing the product's reliability.

Maximum Operating Temperature: 100 °C

The high operating temperature range allows the product to function in harsh environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The broad operating temperature range ensures reliable performance even in extreme cold conditions, enhancing the product's versatility.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and robustness, ensuring a secure connection between the product and the PCB.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly, making the product convenient for manufacturing and maintenance.

Maximum Seated Height: 1.4 mm

The low seated height allows for a compact design, making the product suitable for space-constrained applications.

RAM Words: 65536

The large RAM capacity enables efficient data storage and retrieval, enhancing the product's processing capabilities.

Width: 12 mm

The compact width allows for easy integration into various PCB layouts, making the product versatile for different system designs.

Boundary Scan: YES

Boundary scan feature aids in testing and debugging the product during manufacturing and maintenance, improving overall reliability.

External Data Bus Width: 16

The 16-bit external data bus width enables fast data transfer and processing, enhancing the product's performance in signal processing tasks.

Maximum Clock Frequency: 20 MHz

The high clock frequency allows for rapid data processing, making the product suitable for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 20

The short reflow duration helps in efficient soldering during assembly, ensuring reliable connections and overall product quality.

Peak Reflow Temperature °C: 220

The high peak reflow temperature tolerance ensures robust soldering performance, making the product suitable for lead-free soldering processes.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and processing efficiency, improving the product's overall performance.

Length: 12 mm

The compact length allows for easy integration into various system designs, making the product suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The product's classification as a digital signal processor with additional peripheral features makes it versatile for a wide range of signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for signal processing applications.

Terminal Form: BALL

The ball terminal form provides a reliable and robust connection, ensuring long-term performance and reliability of the product.

Nominal Supply Voltage: 2.5 V

The stable nominal supply voltage ensures consistent performance and reliable operation of the product under varying load conditions.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density packaging and connection efficiency, making the product suitable for compact system designs.

Format: FIXED POINT

The fixed-point format allows for efficient arithmetic operations, making the product suitable for various signal processing and data manipulation tasks.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level ensures safe handling and storage of the product, preventing damage during manufacturing and assembly.

Low Power Mode: YES

Low power mode feature enables energy-efficient operation and extended battery life, making the product suitable for portable and battery-powered devices.

Barrel Shifter: YES

The barrel shifter feature enhances data manipulation and processing capabilities, improving the product's performance in complex signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC549GGU-80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC549GGU-80 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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