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TMS320TCI6482BZTZA

Texas Instruments

TMS320TCI6482BZTZA by Texas Instruments

TMS320TCI6482BZTZA by Texas Instruments is a 32-bit DSP with 64-bit external data bus width, operating at a max clock frequency of 66.6 MHz. It features 8192 RAM words and is suitable for industrial applications requiring high-speed digital signal processing capabilities in a compact package style.

Median Price

$33.719

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 27 parts In-Stock

1+ parts

-

100+ parts

$29.250

1k+ parts

$26.170

10k+ parts

$24.630

27

-

$29.250

$26.170

$24.630

DigiKey

USA . 27 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27

-

-

-

-

Verical

USA . 22 parts In-Stock

1+ parts

-

100+ parts

$38.188

1k+ parts

$34.538

10k+ parts

-

22

-

$38.188

$34.538

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,615 parts In-Stock

1+ parts

$30.875

100+ parts

-

1k+ parts

-

10k+ parts

-

4,615

$30.875

-

-

-

DigiKey Marketplace

USA . 27 parts In-Stock

1+ parts

$33.800

100+ parts

-

1k+ parts

-

10k+ parts

-

27

$33.800

-

-

-

Vyrian

USA . 7,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,382

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 113 parts In-Stock

1+ parts

$15.230

100+ parts

-

1k+ parts

-

10k+ parts

-

113

$15.230

-

-

-

Parana Technologies

USA . 2,183 parts In-Stock

1+ parts

$21.028

100+ parts

-

1k+ parts

$21.258

10k+ parts

-

2,183

$21.028

-

$21.258

-

DigiPath Technology Company

USA . 554 parts In-Stock

1+ parts

$23.154

100+ parts

$21.302

1k+ parts

-

10k+ parts

-

554

$23.154

$21.302

-

-

ChromeModa Solutions

Germany . 3,591 parts In-Stock

1+ parts

$23.627

100+ parts

$19.374

1k+ parts

-

10k+ parts

-

3,591

$23.627

$19.374

-

-

IDEA Electronic Components Group

UK . 1,252 parts In-Stock

1+ parts

$23.627

100+ parts

$22.446

1k+ parts

$21.264

10k+ parts

-

1,252

$23.627

$22.446

$21.264

-

Corphita

USA . 162 parts In-Stock

1+ parts

$29.250

100+ parts

-

1k+ parts

-

10k+ parts

-

162

$29.250

-

-

-

Microchip USA

USA . 1,533 parts In-Stock

1+ parts

$71.760

100+ parts

$70.510

1k+ parts

$69.890

10k+ parts

$69.260

1,533

$71.760

$70.510

$69.890

$69.260

QUARKTWIN TECHNOLOGY LTD

USA . 22,983 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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22,983

-

-

-

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GreenTree Electronics

Israel . 63 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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63

-

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Overview

Unlock the power of cutting-edge technology with the TMS320TCI6482BZTZA by Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor offers unmatched performance and versatility for a wide range of applications. With its advanced features and high-quality design, this product provides customers with exceptional value and benefits. Experience seamless operation and superior functionality with the TMS320TCI6482BZTZA, setting a new standard in digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly processes.

Maximum Supply Voltage: 1.2875 V

Provides a stable voltage level for optimal performance.

Address Bus Width: 20

A wider address bus allows for more memory addressing capability, enhancing the product's processing capabilities.

Package Shape: SQUARE

Square packages are space-efficient and easy to mount on circuit boards.

Bit Size: 32

The 32-bit architecture allows for high-speed processing and efficient data handling.

Power Supplies (V): 1.25,1.5/1.8,1.8,3.3

Offers multiple power supply options for flexibility in different applications.

No. of Terminals: 697

A higher number of terminals allow for more connectivity options and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch packaging provide high density and reliability in a compact form factor.

Minimum Supply Voltage: 1.2125 V

Even at lower voltage levels, the product can operate efficiently and reliably.

Maximum Operating Temperature: 105 °C

With a high operating temperature range, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Suitable for operation in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

Provides corrosion resistance and ensures good electrical conductivity for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy installation and secure connections.

Maximum Seated Height: 3.242 mm

Low seated height minimizes the overall profile of the product, ideal for space-constrained applications.

RAM Words: 8192

Ample RAM capacity for efficient data storage and processing.

Width: 24 mm

Compact width enables easy integration into various electronic devices.

Boundary Scan: YES

Boundary scan feature allows for easy testing and debugging of the product during development.

External Data Bus Width: 64

Wider external data bus enables faster data transfer rates and improved performance.

Maximum Clock Frequency: 66.6 MHz

High clock frequency for rapid data processing and real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow temperature duration for safe and reliable soldering processes.

Peak Reflow Temperature °C: 260

High reflow temperature for secure and durable solder joints.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing speed within the product.

Length: 24 mm

Compact length for efficient use of board space and easy integration into electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports various digital processing applications.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation for energy-efficient performance.

Terminal Form: BALL

Ball terminal form allows for secure connections and efficient heat dissipation.

Nominal Supply Voltage: 1.25 V

Stable nominal supply voltage for consistent and reliable operation.

Terminal Pitch: 0.8 mm

Compact terminal pitch for high-density mounting and space-saving designs.

Format: FIXED POINT

Fixed point format for efficient numerical calculations and data processing.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the product is resistant to moisture, ensuring long-term reliability.

Low Power Mode: YES

Low power mode option for energy-efficient operation and extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) TMS320TCI6482BZTZA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25,1.5/1.8,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2875 V

Minimum Supply Voltage:

1.2125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320TCI6482BZTZA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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