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TMS320TCI100BCLZ7

Texas Instruments

TMS320TCI100BCLZ7 by Texas Instruments

TMS320TCI100BCLZ7 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 64-bit external data bus width, and operates at a max clock frequency of 75.19 MHz. Ideal for digital signal processing applications requiring low power mode and fixed-point format.

Median Price

$11.260

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$9.750

1k+ parts

$8.720

10k+ parts

$8.210

48

-

$9.750

$8.720

$8.210

DigiKey

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$11.260

1k+ parts

-

10k+ parts

-

48

-

$11.260

-

-

Verical

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$12.188

1k+ parts

$10.900

10k+ parts

$10.262

48

-

$12.188

$10.900

$10.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,100 parts In-Stock

1+ parts

$10.288

100+ parts

-

1k+ parts

-

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3,100

$10.288

-

-

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Vyrian

USA . 8,559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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8,559

-

-

-

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DigiKey Marketplace

USA . 48 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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48

-

-

-

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

1+ parts

-

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-

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5

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7 parts In-Stock

1+ parts

$9.210

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$9.210

-

-

-

Corohmni

South Africa . 248 parts In-Stock

1+ parts

$9.660

100+ parts

-

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-

248

$9.660

-

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Corphita

USA . 3,202 parts In-Stock

1+ parts

$9.747

100+ parts

-

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3,202

$9.747

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Microchip USA

USA . 122 parts In-Stock

1+ parts

$29.120

100+ parts

$28.700

1k+ parts

$28.500

10k+ parts

$28.290

122

$29.120

$28.700

$28.500

$28.290

Parana Technologies

USA . 416 parts In-Stock

1+ parts

$47.786

100+ parts

-

1k+ parts

-

10k+ parts

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416

$47.786

-

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ChromeModa Solutions

Germany . 6,550 parts In-Stock

1+ parts

$53.692

100+ parts

$44.027

1k+ parts

-

10k+ parts

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6,550

$53.692

$44.027

-

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IDEA Electronic Components Group

UK . 67 parts In-Stock

1+ parts

$53.692

100+ parts

$51.007

1k+ parts

$48.323

10k+ parts

-

67

$53.692

$51.007

$48.323

-

DigiPath Technology Company

USA . 2,123 parts In-Stock

1+ parts

-

100+ parts

$48.409

1k+ parts

-

10k+ parts

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2,123

-

$48.409

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Cyclops Electronics Ltd (Excess)

UK . 5 parts In-Stock

1+ parts

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100+ parts

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5

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Overview

Unlock the power of cutting-edge technology with the TMS320TCI100BCLZ7 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability. This versatile product is perfect for a wide range of applications, offering customers the value and benefits they need to stay ahead of the curve. Experience seamless performance and efficiency with the TMS320TCI100BCLZ7, providing you with the competitive edge you've been looking for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package of this product durable and lightweight, ideal for portable or compact applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.24 V

Operates efficiently within a low maximum supply voltage, reducing power consumption and heat generation.

Address Bus Width: 23

A wide address bus width of 23 enables efficient data processing and memory addressing, enhancing overall performance.

Bit Size: 32

A 32-bit architecture provides high computational power and precision for signal processing tasks.

Power Supplies (V): 1.2,3.3

Supports multiple power supply voltages, offering flexibility in operating conditions and power management.

No. of Terminals: 532

A high number of terminals allow for versatile connectivity options and integration with external components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package style ensures secure mounting and precise alignment, improving overall reliability.

Minimum Supply Voltage: 1.16 V

With a low minimum supply voltage requirement, the product can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 90 °C

High maximum operating temperature range allows for reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures, making it suitable for applications where temperature variation is a concern.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

RAM Words: 262144

Large RAM capacity of 262144 words enables efficient data storage and retrieval, essential for processing complex algorithms.

Width: 23 mm

Compact width of 23mm allows for easy integration into space-constrained devices and systems.

Boundary Scan: YES

Boundary scan feature facilitates testing and debugging of the product, ensuring high reliability and ease of maintenance.

External Data Bus Width: 64

Wide external data bus width of 64 enables fast data transfer between the processor and external memory or peripherals.

Maximum Clock Frequency: 75.19 MHz

High maximum clock frequency of 75.19MHz provides swift processing speeds, supporting real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

Capable of withstanding peak reflow temperatures for up to 30 seconds, ensuring robust soldering and assembly processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for reliable soldering and assembly without compromising product integrity.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing efficiency and allows for simultaneous execution of tasks.

Length: 23 mm

Compact length of 23mm ensures the product can fit into tight spaces or compact device designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Peripheral IC type of digital signal processor and other components support a variety of signal processing tasks and interfacing capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital applications, making it a reliable choice for DSPs.

Terminal Form: BALL

Ball terminal form provides secure connections and enables easy soldering processes for reliable performance.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage of 1.2V ensures consistent and efficient operation of the product.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for precise connections and compact PCB design, enhancing overall performance and reliability.

Format: FIXED POINT

Fixed-point format offers efficient mathematical operations with integer numbers, suitable for many signal processing applications.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level of 4 indicates that the product can withstand moderate exposure to moisture during storage and assembly.

Low Power Mode: YES

Incorporation of low power mode allows for energy-saving operation and extended battery life in power-constrained applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320TCI100BCLZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320TCI100BCLZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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