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TMS320LC548PGE-66

Texas Instruments

TMS320LC548PGE-66 by Texas Instruments

TMS320LC548PGE-66 by Texas Instruments is a 16-bit DSP with 3.3V power supply, 20MHz clock frequency, and 8K RAM words. Ideal for industrial applications requiring low power consumption and fixed-point format processing. Features include boundary scan, multiple internal bus architecture, and on-chip data RAM width of 16 bits.

Median Price

$68.666

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 801 parts In-Stock

1+ parts

$68.666

100+ parts

$61.037

1k+ parts

$44.880

10k+ parts

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801

$68.666

$61.037

$44.880

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Rochester

USA . 152 parts In-Stock

1+ parts

-

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$64.510

1k+ parts

$57.720

10k+ parts

$54.330

152

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$64.510

$57.720

$54.330

DigiKey

USA . 152 parts In-Stock

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Verical

USA . 112 parts In-Stock

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$80.638

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$72.150

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$67.912

112

-

$80.638

$72.150

$67.912

Distributors (In-Stock)

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DF Sales Co.

USA . 19 parts In-Stock

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$50.000

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DF Sales Co.

USA . 19 parts In-Stock

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19

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Bristol Electronics

USA . 2,598 parts In-Stock

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$58.819

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$48.232

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2,598

$58.819

$48.232

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Digiode

USA . 2,834 parts In-Stock

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$59.214

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2,834

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Vyrian

USA . 5,911 parts In-Stock

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5,911

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Dan-Mar Components

USA . 2,590 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 1,440 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,355 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 960 parts In-Stock

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PC Components Company LLC

USA . 123 parts In-Stock

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ComSIT Distribution GmbH

Germany . 117 parts In-Stock

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Speed Components Ltd

Israel . 50 parts In-Stock

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50

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Legend Electronics Inc.

USA . 38 parts In-Stock

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ECAB

Sweden . 37 parts In-Stock

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Prism Electronics

USA . 35 parts In-Stock

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Resion

USA . 23 parts In-Stock

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Holdelec - ElecDif-Pro

France . 20 parts In-Stock

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A2Z Electronics, Inc.

USA . 18 parts In-Stock

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Connector Distribution Corp

USA . 15 parts In-Stock

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Right Parts Inc.

USA . 15 parts In-Stock

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Lakeland Logistics Inc

USA . 8 parts In-Stock

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Manotoh

Italy . 8 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 3 parts In-Stock

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Carlin Systems, Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,486 parts In-Stock

1+ parts

$34.041

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-

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$139.968

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1,486

$34.041

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$139.968

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DigiPath Technology Company

USA . 578 parts In-Stock

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$37.483

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$34.484

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578

$37.483

$34.484

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ChromeModa Solutions

Germany . 1,905 parts In-Stock

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$38.248

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$31.363

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$38.248

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IDEA Electronic Components Group

UK . 1,338 parts In-Stock

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$38.248

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$36.336

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$34.423

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1,338

$38.248

$36.336

$34.423

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Corohmni

South Africa . 1,197 parts In-Stock

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$39.102

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$39.102

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Corphita

USA . 326 parts In-Stock

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$56.097

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Component Stockers USA

USA . 170 parts In-Stock

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$64.030

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$60.190

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170

$64.030

$60.190

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Microchip USA

USA . 153 parts In-Stock

1+ parts

$141.260

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$140.030

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$140.030

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$138.800

153

$141.260

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$138.800

GreenTree Electronics

Israel . 104 parts In-Stock

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ChipstoGo Electronic ltd

UK . 11 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 4 parts In-Stock

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Overview

Experience unparalleled performance with the TMS320LC548PGE-66 by Texas Instruments, a leading manufacturer in the digital signal processors (DSPs) category. This versatile product offers high-quality processing power, making it ideal for a wide range of applications. With a focus on value and reliability, customers can trust in the benefits and advantages that this innovative solution brings to their projects. Trust Texas Instruments to deliver excellence in every aspect of your digital processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, providing protection to the internal components of the DSP.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Can operate efficiently within a wide voltage range, providing versatility in different applications.

Address Bus Width: 23

Allows for greater memory addressing capabilities, enabling the processing of larger data sets.

Bit Size: 16

Suitable for processing data in smaller chunks efficiently, making it ideal for a variety of signal processing tasks.

Power Supplies (V): 3.3

Operates at a common power supply voltage, compatible with many other components in a system.

No. of Terminals: 144

Offers a high density of I/O connections, enabling the DSP to interface with a wide range of external devices.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme temperature conditions, suitable for industrial and harsh environments.

Maximum Clock Frequency: 20 MHz

Provides fast processing speeds, essential for real-time signal processing applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed specifically for digital signal processing tasks, ensuring optimal performance and efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC548PGE-66 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

5

No. of Serial I/Os:

1

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

8K

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320LC548PGE-66 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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