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TMS320LC543PZ1-50

Texas Instruments

TMS320LC543PZ1-50 by Texas Instruments

TMS320LC543PZ1-50 by Texas Instruments is a 16-bit DSP with 10K RAM words, 20MHz clock frequency, and 3.3V supply voltage. Ideal for industrial applications requiring low power consumption and fixed-point processing capabilities.

Median Price

$40.090

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

$40.090

100+ parts

$37.680

1k+ parts

$34.080

10k+ parts

-

90

$40.090

$37.680

$34.080

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,615 parts In-Stock

1+ parts

$38.086

100+ parts

-

1k+ parts

-

10k+ parts

-

1,615

$38.086

-

-

-

Vyrian

USA . 2,041 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,041

-

-

-

-

Freddi Giovanni

Italy . 24 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 432 parts In-Stock

1+ parts

$9.020

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$9.020

-

-

-

Parana Technologies

USA . 2,098 parts In-Stock

1+ parts

$24.197

100+ parts

-

1k+ parts

$24.861

10k+ parts

-

2,098

$24.197

-

$24.861

-

DigiPath Technology Company

USA . 2,268 parts In-Stock

1+ parts

$26.644

100+ parts

$24.513

1k+ parts

-

10k+ parts

-

2,268

$26.644

$24.513

-

-

ChromeModa Solutions

Germany . 4,412 parts In-Stock

1+ parts

$27.188

100+ parts

$22.294

1k+ parts

-

10k+ parts

-

4,412

$27.188

$22.294

-

-

IDEA Electronic Components Group

UK . 765 parts In-Stock

1+ parts

$27.188

100+ parts

$25.829

1k+ parts

$24.469

10k+ parts

-

765

$27.188

$25.829

$24.469

-

Corphita

USA . 4,403 parts In-Stock

1+ parts

$36.081

100+ parts

-

1k+ parts

-

10k+ parts

-

4,403

$36.081

-

-

-

Corohmni

South Africa . 651 parts In-Stock

1+ parts

$76.182

100+ parts

-

1k+ parts

-

10k+ parts

-

651

$76.182

-

-

-

Microchip USA

USA . 1,257 parts In-Stock

1+ parts

$93.680

100+ parts

$92.050

1k+ parts

$91.240

10k+ parts

$90.420

1,257

$93.680

$92.050

$91.240

$90.420

Overview

Experience the power of cutting-edge technology with the TMS320LC543PZ1-50 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Digital Signal Processors that are perfect for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial control systems, this DSP offers unparalleled performance and efficiency. With its advanced features and reliable design, the TMS320LC543PZ1-50 provides exceptional value to customers looking to take their projects to the next level. Trust Texas Instruments to provide the tools you need to succeed in today's fast-paced world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for portable and rugged applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and costs.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring safe operation.

On Chip Data RAM Width: 16

Wide data RAM width allows for efficient data processing and storage.

Address Bus Width: 23

Wide address bus width enables access to a larger memory space for complex algorithms.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Bit Size: 16

16-bit architecture ensures high-performance processing capabilities.

Power Supplies (V): 3.3

Standard power supply voltage for compatibility with existing systems.

No. of Terminals: 100

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact package style with fine pitch for space-saving and dense PCB integration.

Minimum Supply Voltage: 3 V

Wide range of supply voltage options for flexibility in power management.

Maximum Operating Temperature: 100 °C

Wide operating temperature range suitable for industrial applications.

No. of External Interrupts: 5

Multiple external interrupts for handling real-time events and tasks efficiently.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality finish for reliable terminal connections and corrosion resistance.

Terminal Position: QUAD

Quad terminal position for easy PCB mounting and soldering.

Maximum Seated Height: 1.6 mm

Low profile design for compact and slim electronic devices.

RAM Words: 10K

Large RAM capacity for storing and processing data efficiently.

Width: 14 mm

Compact width for space-efficient PCB layout and integration in small devices.

Boundary Scan: YES

Boundary scan capability for testing and debugging the device during production.

External Data Bus Width: 16

Wide external data bus width for fast data transfer and processing.

Maximum Clock Frequency: 20 MHz

High clock frequency for fast data processing and real-time operation.

Peak Reflow Temperature °C: 260

High reflow temperature for reliable solder connections during PCB assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture for efficient data routing and processing.

Length: 14 mm

Compact length for space-saving PCB layout and integration in small devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type for handling various digital signal processing tasks.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and reliable electrical connections.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage for compatibility with existing systems.

ROM Programmability: MROM

Mask ROM programmability for secure and reliable program storage.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB integration and space efficiency.

Format: FIXED POINT

Fixed-point format for efficient and accurate data processing in DSP applications.

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life.

Barrel Shifter: YES

Barrel shifter for efficient bitwise operations and data processing.

On Chip Program ROM Width: 16

Wide program ROM width for storing and executing program instructions efficiently.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC543PZ1-50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

10K

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320LC543PZ1-50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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