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TMS320LC50PQA

Texas Instruments

TMS320LC50PQA by Texas Instruments

TMS320LC50PQA by Texas Instruments is a 16-bit DSP with 512 RAM words, operating at -40 to 85°C. It features a 3.3V supply, boundary scan support, and barrel shifter. Ideal for industrial applications requiring low power consumption and fixed-point processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,942 parts In-Stock

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5,942

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Digiode

USA . 2,026 parts In-Stock

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2,026

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Distributors (Availability)

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AZTECH Wire

Italy . 844 parts In-Stock

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$10.519

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844

$10.519

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One Stop Electronics

USA . 1,194 parts In-Stock

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$12.000

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$12.000

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Corohmni

South Africa . 1,862 parts In-Stock

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$16.590

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$16.590

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Parana Technologies

USA . 122 parts In-Stock

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$21.803

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$22.273

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122

$21.803

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$22.273

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DigiPath Technology Company

USA . 295 parts In-Stock

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$24.008

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295

$24.008

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ChromeModa Solutions

Germany . 3,836 parts In-Stock

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$24.498

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$20.088

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3,836

$24.498

$20.088

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IDEA Electronic Components Group

UK . 1,759 parts In-Stock

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$24.498

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$23.273

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$22.048

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1,759

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$22.048

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Component Stockers USA

USA . 693 parts In-Stock

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$99.990

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Corphita

USA . 783 parts In-Stock

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Microchip USA

USA . 495 parts In-Stock

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Overview

Discover the power of the Texas Instruments TMS320LC50PQA Digital Signal Processor, a cutting-edge technology designed to revolutionize your electronic projects. With top-notch quality and reliability from a trusted manufacturer like Texas Instruments, this DSP opens up endless possibilities for applications in telecommunications, audio processing, and more. Experience unparalleled value and performance with the TMS320LC50PQA, delivering faster processing speeds and efficient power consumption. Upgrade your projects today and unlock the full potential of your designs with this versatile and innovative DSP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection to the components inside, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 3.47 V

This higher supply voltage allows for efficient processing and operation of the digital signals.

Bit Size: 16

With a 16-bit size, this DSP can handle complex calculations and operations with high precision.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this DSP suitable for industrial applications where heat resistance is crucial.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This specialized DSP is designed specifically for processing digital signals, making it an excellent choice for applications requiring signal processing capabilities.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC50PQA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

9K WORDS DATA/PROG RAM

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

132

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

TMS320LC50PQA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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