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TMS320F28232PGFA

Texas Instruments

TMS320F28232PGFA by Texas Instruments

TMS320F28232PGFA by Texas Instruments is a 32-bit DSP with 176 terminals, operating at up to 100 MHz. It features 8 external interrupts and 6 DMA channels, suitable for industrial applications requiring high-speed signal processing. With on-chip data RAM width of 16 bits and flash ROM programmability, it offers efficient fixed-point computation capabilities.

Median Price

$27.629

Lifecycle Status

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6

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1k+

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Texas Instruments

USA . 554 parts In-Stock

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$21.218

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$18.534

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$12.782

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Mouser Electronics

USA . 80 parts In-Stock

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$34.040

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$26.090

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$23.180

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80

$34.040

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$23.180

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Digiode

USA . 2,594 parts In-Stock

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$20.157

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Vyrian

USA . 5,187 parts In-Stock

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EPE Components Inc.

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Bristol Electronics

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Ampacity Inc.

Singapore . 211 parts In-Stock

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$18.040

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Corphita

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Parana Technologies

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DigiPath Technology Company

USA . 1,984 parts In-Stock

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$51.180

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$47.086

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ChromeModa Solutions

Germany . 6,638 parts In-Stock

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$42.824

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IDEA Electronic Components Group

UK . 509 parts In-Stock

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Overview

Elevate your digital signal processing projects with the TMS320F28232PGFA by Texas Instruments. Known for its high-quality manufacturing, this DSP offers unmatched precision and reliability. Perfect for a wide range of applications, the TMS320F28232PGFA provides unparalleled value and benefits to customers seeking cutting-edge technology. With a multitude of features and advantages, this product is sure to take your projects to the next level. Trust in Texas Instruments for top-of-the-line digital signal processors that deliver exceptional performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and good thermal conductivity, making this product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.89 V

With a maximum supply voltage of 1.89 V, this product offers low power consumption and can operate efficiently in battery-powered devices.

On Chip Data RAM Width: 16

A wide on-chip data RAM width of 16 ensures fast data processing and manipulation, enhancing the performance of the DSP.

Address Bus Width: 20

A wider address bus width of 20 enables the DSP to access a larger memory space, supporting complex algorithms and computations.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality standards, making this product suitable for automotive and industrial applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy integration into compact electronic devices.

Bit Size: 32

High bit size of 32 enables the DSP to handle large amounts of data and perform complex operations, making it suitable for demanding signal processing tasks.

Power Supplies (V): 1.9,3.3

Support for multiple power supply voltages (1.9V and 3.3V) provides flexibility in system design and compatibility with different power sources.

No. of Terminals: 176

A high number of terminals (176) allow for versatile connectivity options and easy interfacing with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package styles offer space-saving benefits, making this product suitable for compact and lightweight designs.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage of 1.71V ensures efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows the DSP to perform reliably in harsh environmental conditions.

CPU Family: C28X

Being part of the C28X CPU family signifies compatibility with existing software and tools, simplifying development and integration processes.

No. of External Interrupts: 8

Presence of 8 external interrupts enables the DSP to respond to external events quickly and efficiently, enhancing real-time processing capabilities.

Minimum Operating Temperature: -40 °C

Wide operating temperature range of -40 to 85°C ensures reliable performance in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish offers excellent corrosion resistance and ensures reliable connections for long-term use.

ADC Channels: YES

Integrated ADC channels enable the DSP to directly interface with analog sensors and signals, broadening its range of applications.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and secure mounting on the PCB, improving reliability and manufacturing efficiency.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm allows for slim and compact device designs, ideal for space-constrained applications.

RAM Words: 52

Generous RAM word size of 52 provides ample memory for data storage and manipulation, supporting complex algorithms and computations.

Width: 24 mm

Compact width of 24 mm enables easy integration of the DSP into various electronic systems, including space-constrained applications.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes during production, improving manufacturing efficiency and product quality.

External Data Bus Width: 32

Wide external data bus width of 32 allows for high-speed data transfer between the DSP and external devices, enhancing overall system performance.

Maximum Clock Frequency: 100 MHz

High maximum clock frequency of 100 MHz enables the DSP to execute instructions quickly and efficiently, supporting real-time signal processing tasks.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable solder connections during the manufacturing process, contributing to product durability.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and allows for efficient communication between different processing units within the DSP.

Length: 24 mm

Compact length of 24 mm facilitates easy integration of the DSP into small form factor devices, making it suitable for portable and embedded applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making this product suitable for industrial automation and control systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports various digital signal processing tasks and peripheral functionalities, enhancing the overall applicability of the DSP.

No. of Timers: 19

Abundance of timers (19) allows for precise timing control and synchronization, supporting a wide range of time-critical applications.

RAM Bytes: 53248

Large RAM size of 53248 bytes provides ample memory for storing data and program instructions, supporting advanced signal processing algorithms and computations.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making this DSP suitable for battery-powered and high-performance applications.

Terminal Form: GULL WING

Gull wing terminal form provides robust solder connections and facilitates automated assembly processes, enhancing product durability and manufacturing efficiency.

Maximum Supply Current: 315 mA

With a maximum supply current of 315 mA, this DSP operates efficiently while consuming minimal power, prolonging battery life in portable devices.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage of 1.8V ensures consistent performance and reliable operation of the DSP in various operating conditions.

No. of DMA Channels: 6

Presence of 6 DMA channels allows for efficient data transfer between memory and peripherals, enhancing system performance and reducing processor load.

PWM Channels: YES

Integrated PWM channels enable the DSP to generate precise analog output signals, making it suitable for motor control, power conversion, and other applications requiring pulse-width modulation.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for firmware updates and customization, allowing for easy adaptation to changing system requirements and functionalities.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density PCB layouts and miniaturization of electronic devices, making this DSP suitable for compact and lightweight designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and reduces computational complexity, improving performance and efficiency in real-time signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate moisture sensitivity, ensuring proper handling and storage procedures to prevent moisture-related damage during assembly and operation.

Low Power Mode: YES

Low power mode capability enables the DSP to operate efficiently in power-constrained applications or battery-powered devices, extending battery life and reducing energy consumption.

On Chip Program ROM Width: 16

Wide on-chip program ROM width of 16 allows for storing large program code, supporting complex algorithms and applications with extensive firmware requirements.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28232PGFA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

176

No. of Timers:

19

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

53248

RAM Words:

52

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

315 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320F28232PGFA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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