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TMS320F2809ZGMS

Texas Instruments

TMS320F2809ZGMS by Texas Instruments

TMS320F2809ZGMS by Texas Instruments is a 32-bit DSP with 100 terminals, operating at up to 100 MHz. Ideal for automotive applications, it features low power mode, flash ROM programmability, and multiple internal bus architecture.

Median Price

$14.580

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 82 parts In-Stock

1+ parts

$14.580

100+ parts

$14.290

1k+ parts

$14.000

10k+ parts

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82

$14.580

$14.290

$14.000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,810 parts In-Stock

1+ parts

-

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4,810

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Digiode

USA . 2,224 parts In-Stock

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-

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2,224

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Distributors (Availability)

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AZTECH Wire

Italy . 473 parts In-Stock

1+ parts

$12.031

100+ parts

-

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473

$12.031

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One Stop Electronics

USA . 683 parts In-Stock

1+ parts

$27.000

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683

$27.000

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Corohmni

South Africa . 387 parts In-Stock

1+ parts

$48.455

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387

$48.455

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Parana Technologies

USA . 1,641 parts In-Stock

1+ parts

$71.767

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1,641

$71.767

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DigiPath Technology Company

USA . 126 parts In-Stock

1+ parts

$79.024

100+ parts

$72.702

1k+ parts

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126

$79.024

$72.702

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ChromeModa Solutions

Germany . 4,288 parts In-Stock

1+ parts

$80.637

100+ parts

$66.122

1k+ parts

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4,288

$80.637

$66.122

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IDEA Electronic Components Group

UK . 626 parts In-Stock

1+ parts

$80.637

100+ parts

$76.605

1k+ parts

$72.573

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626

$80.637

$76.605

$72.573

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Microchip USA

USA . 188 parts In-Stock

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188

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Corphita

USA . 121 parts In-Stock

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121

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Overview

Unlock the power of cutting-edge technology with the TMS320F2809ZGMS by Texas Instruments. As a leader in the industry, Texas Instruments brings you a top-of-the-line Digital Signal Processor designed to deliver high performance and reliability. This versatile product is perfect for a wide range of applications, offering customers unmatched value and benefits. Experience seamless integration, superior quality, and advanced features that will take your projects to the next level. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Maximum Supply Voltage: 1.89 V

Allows for stable power supply for optimal performance.

Bit Size: 32

Higher bit size allows for more complex calculations and processing capabilities.

No. of Terminals: 100

Provides ample connectivity options for various peripherals and external devices.

Maximum Clock Frequency: 100 MHz

High clock frequency enables fast data processing and execution of operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2809ZGMS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

9216

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2809ZGMS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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