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TMS320F2808GGMS

Texas Instruments

TMS320F2808GGMS by Texas Instruments

TMS320F2808GGMS by Texas Instruments is a 32-bit DSP with 100 terminals, operating at up to 100 MHz. Ideal for automotive applications, it features 10 timers, flash ROM programmability, and low power mode for efficient performance in a compact square package.

Median Price

$13.100

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 897 parts In-Stock

1+ parts

$13.100

100+ parts

$12.840

1k+ parts

$12.580

10k+ parts

-

897

$13.100

$12.840

$12.580

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,146 parts In-Stock

1+ parts

-

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6,146

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Digiode

USA . 2,432 parts In-Stock

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-

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2,432

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New Tech Sourcing

USA . 22 parts In-Stock

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-

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22

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 589 parts In-Stock

1+ parts

$13.408

100+ parts

-

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589

$13.408

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One Stop Electronics

USA . 1,077 parts In-Stock

1+ parts

$20.000

100+ parts

-

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1,077

$20.000

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Parana Technologies

USA . 1,452 parts In-Stock

1+ parts

$60.164

100+ parts

$5,587.140

1k+ parts

$54.148

10k+ parts

-

1,452

$60.164

$5,587.140

$54.148

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DigiPath Technology Company

USA . 1,910 parts In-Stock

1+ parts

$66.248

100+ parts

-

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10k+ parts

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1,910

$66.248

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ChromeModa Solutions

Germany . 6,245 parts In-Stock

1+ parts

$67.600

100+ parts

$55.432

1k+ parts

-

10k+ parts

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6,245

$67.600

$55.432

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IDEA Electronic Components Group

UK . 9 parts In-Stock

1+ parts

$67.600

100+ parts

$64.220

1k+ parts

$60.840

10k+ parts

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9

$67.600

$64.220

$60.840

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Corohmni

South Africa . 4,906 parts In-Stock

1+ parts

$70.288

100+ parts

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4,906

$70.288

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Corphita

USA . 2,998 parts In-Stock

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2,998

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Microchip USA

USA . 308 parts In-Stock

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Kepictronics

USA . 187 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320F2808GGMS by Texas Instruments. This top-of-the-line digital signal processor is designed to deliver unmatched performance and reliability, making it ideal for a wide range of applications. Whether you're working on automotive electronics or industrial automation, this DSP will exceed your expectations with its advanced features and innovative design. Experience the value and benefits that Texas Instruments brings to the table, and take your projects to the next level with the TMS320F2808GGMS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Maximum Supply Voltage: 1.89 V

Allows for reliable operation within specified voltage range.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability.

Bit Size: 32

Provides high processing power and efficiency for complex signal processing tasks.

Minimum Operating Temperature: -40 °C

Ensures reliable performance in extreme temperature conditions.

Maximum Clock Frequency: 100 MHz

Enables fast and efficient execution of signal processing algorithms.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed specifically for digital signal processing applications, ensuring optimized performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2808GGMS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e0

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2808GGMS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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