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TMS320F2808GGMA

Texas Instruments

TMS320F2808GGMA by Texas Instruments

TMS320F2808GGMA by Texas Instruments is a 32-bit DSP with 100 terminals, operating at max 100 MHz. Ideal for industrial applications, it features flash ROM programmability, low power mode, and multiple internal bus architecture for efficient signal processing.

Median Price

$16.165

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 233 parts In-Stock

1+ parts

$11.910

100+ parts

$11.670

1k+ parts

$11.430

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233

$11.910

$11.670

$11.430

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DigiKey

USA . 373 parts In-Stock

1+ parts

$20.420

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$14.100

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373

$20.420

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$14.100

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Distributors (In-Stock)

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Vyrian

USA . 7,233 parts In-Stock

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Digiode

USA . 3,900 parts In-Stock

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3,900

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Inventory MP

USA . 13 parts In-Stock

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13

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Bristol Electronics

USA . 13 parts In-Stock

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13

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Electronics Depot

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$8.408

100+ parts

-

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874

$8.408

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One Stop Electronics

USA . 1,103 parts In-Stock

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$11.000

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$11.000

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Ampacity Inc.

Singapore . 1,308 parts In-Stock

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$16.000

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$16.000

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Corohmni

South Africa . 4,865 parts In-Stock

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$18.148

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$18.148

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Parana Technologies

USA . 345 parts In-Stock

1+ parts

$57.216

100+ parts

$5,313.403

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$51.495

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345

$57.216

$5,313.403

$51.495

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DigiPath Technology Company

USA . 940 parts In-Stock

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$63.002

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940

$63.002

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ChromeModa Solutions

Germany . 1,383 parts In-Stock

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$64.288

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$52.716

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1,383

$64.288

$52.716

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IDEA Electronic Components Group

UK . 312 parts In-Stock

1+ parts

$64.288

100+ parts

$61.074

1k+ parts

$57.859

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312

$64.288

$61.074

$57.859

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Corphita

USA . 4,345 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320F2808GGMA by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors that excel in applications such as automotive, industrial control, and power electronics. With its advanced features and reliable performance, this DSP offers unmatched value and benefits to customers seeking high-speed processing, low power consumption, and versatile functionality. Elevate your projects to the next level with the TMS320F2808GGMA and experience the innovation and excellence that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.89 V

Allows for a higher supply voltage which can result in better performance and operating capabilities.

On Chip Data RAM Width: 16

Having a wider data RAM width enables faster processing and manipulation of data.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board.

Bit Size: 32

A 32-bit architecture provides enhanced computational capabilities and precision.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages gives flexibility in various system configurations.

No. of Terminals: 100

Having a larger number of terminals allows for more connectivity options and integration with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact size, low profile design, and fine pitch for optimal board space utilization.

Minimum Supply Voltage: 1.71 V

The minimum supply voltage range provides efficient power management options for different applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability in various environmental conditions.

CPU Family: C28X

Belonging to the C28X CPU family indicates specialized processing capabilities and performance characteristics.

No. of External Interrupts: 3

Having multiple external interrupts allows for efficient handling of real-time events and communications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables use in extreme cold environments without performance degradation.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and reliability during the assembly process.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier and more secure mounting on a PCB.

Maximum Seated Height: 1.4 mm

The low seated height allows for a compact overall design and efficient use of space.

RAM Words: 18432

The large RAM word size provides ample memory for data storage and processing requirements.

Width: 10 mm

The compact width dimension allows for flexibility in placement on a circuit board without sacrificing performance.

Boundary Scan: YES

Boundary scan capability enables easy testing and debugging of the device during production and maintenance.

Maximum Clock Frequency: 100 MHz

High clock frequency allows for fast processing and response times in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 20

The specified reflow time ensures proper soldering and reliability of the product during assembly.

Peak Reflow Temperature °C: 220

The high peak reflow temperature capability enables reliable soldering in various manufacturing processes.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for efficient data transfer and processing within the device.

Length: 10 mm

The compact length dimension contributes to space-saving design and versatility in circuit board layout.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, the product can withstand harsh operating conditions and provide reliable performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The product being a digital signal processor with additional peripheral ICs offers versatile processing capabilities for various applications.

No. of Timers: 10

Having multiple timers allows for efficient scheduling and timing functions in the device.

RAM Bytes: 36864

With a large RAM byte capacity, the device can handle extensive data processing and storage requirements.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for energy-efficient performance.

Terminal Form: BALL

Ball terminal form facilitates secure connections and reliability in the mounting process.

Maximum Supply Current: 230 mA

The specified maximum supply current indicates efficient power usage and operational stability under varying loads.

Nominal Supply Voltage: 1.8 V

The specified nominal supply voltage ensures stable and consistent operation of the device.

PWM Channels: YES

Support for PWM channels enables precise control and modulation of signals for various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for flexibility in updating firmware and software configurations.

Terminal Pitch: 0.8 mm

The specified terminal pitch provides compatibility for easy integration and connection with other components.

Format: FIXED POINT

Being a fixed-point format processor offers efficient arithmetic operations and precision for data processing.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates moderate sensitivity to moisture during handling and storage.

Low Power Mode: YES

The low power mode feature offers energy-saving capabilities for extended battery life and efficient power management.

On Chip Program ROM Width: 16

Having a 16-bit program ROM width allows for efficient program storage and execution within the device.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2808GGMA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e0

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2808GGMA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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