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TMS320F2806ZGMSR

Texas Instruments

TMS320F2806ZGMSR by Texas Instruments

TMS320F2806ZGMSR by Texas Instruments is a 100-terminal DSP with max clock freq of 100 MHz. Ideal for automotive applications, it operates b/w -40 to 125 °C with low power mode and boundary scan feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,056 parts In-Stock

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Digiode

USA . 381 parts In-Stock

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381

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AZTECH Wire

Italy . 212 parts In-Stock

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$11.929

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$11.929

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Parana Technologies

USA . 567 parts In-Stock

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$15.507

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$1,440.094

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$13.957

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567

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$13.957

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DigiPath Technology Company

USA . 217 parts In-Stock

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$17.076

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ChromeModa Solutions

Germany . 3,489 parts In-Stock

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$17.424

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$14.288

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IDEA Electronic Components Group

UK . 448 parts In-Stock

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$17.424

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$16.553

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$15.682

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$17.424

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$15.682

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One Stop Electronics

USA . 1,607 parts In-Stock

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$26.000

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Corohmni

South Africa . 197 parts In-Stock

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$57.310

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Corphita

USA . 3,990 parts In-Stock

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Microchip USA

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Overview

Unlock the full potential of your digital signal processing projects with the TMS320F2806ZGMSR by Texas Instruments. Renowned for their superior quality and cutting-edge technology, Texas Instruments delivers unmatched performance in the field of DSPs. Ideal for automotive applications, this innovative product offers high-speed processing capabilities up to 100 MHz, low power mode features, and a compact square package design. Elevate your designs with the value, benefits, and advantages that only Texas Instruments can provide. Choose the TMS320F2806ZGMSR for reliability and excellence in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the DSP, ensuring long-lasting performance.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage allows for flexibility in power requirements, making it suitable for a variety of applications.

Minimum Operating Temperature: -40 °C

The wide temperature range indicates that this DSP can function reliably in harsh environments, making it ideal for automotive use.

Maximum Clock Frequency: 100 MHz

With a high clock frequency, this DSP can process data quickly and efficiently, making it suitable for demanding signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this DSP energy-efficient and reliable in operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2806ZGMSR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2806ZGMSR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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