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TMS320F241FNA

Texas Instruments

TMS320F241FNA by Texas Instruments

TMS320F241FNA by Texas Instruments is a 16-bit DSP with 544 RAM words, operating at max 5 MHz clock frequency. Ideal for industrial applications, it features low power mode, barrel shifter, and boundary scan support.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,749 parts In-Stock

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Digiode

USA . 1,258 parts In-Stock

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LWI Electronics Inc

India . 2 parts In-Stock

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AZTECH Wire

Italy . 704 parts In-Stock

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$10.714

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$10.714

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One Stop Electronics

USA . 211 parts In-Stock

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$28.000

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211

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Corohmni

South Africa . 460 parts In-Stock

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$30.272

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Parana Technologies

USA . 727 parts In-Stock

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$37.265

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DigiPath Technology Company

USA . 1,865 parts In-Stock

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$41.034

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$41.034

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ChromeModa Solutions

Germany . 4,440 parts In-Stock

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$41.871

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$34.334

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$41.871

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IDEA Electronic Components Group

UK . 263 parts In-Stock

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$41.871

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$39.777

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$37.684

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$37.684

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Corphita

USA . 2,534 parts In-Stock

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Microchip USA

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Overview

Unlock the power of digital signal processing with the Texas Instruments TMS320F241FNA. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge technology in a compact package ideal for a variety of applications. Whether you're designing audio equipment or implementing motor control systems, this DSP offers unparalleled performance and reliability. With low power mode and a maximum clock frequency of 5 MHz, the TMS320F241FNA provides exceptional value and efficiency for all your processing needs. Experience the difference that Texas Instruments can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 16

Offers high computational power and precision for processing digital signals efficiently.

Power Supplies (V): 5

Operates efficiently at standard voltages, ensuring compatibility with common power sources.

No. of Terminals: 68

Provides multiple connection points for interfacing with other components, increasing flexibility in system integration.

Minimum Operating Temperature: -40 °C

Maintains performance even in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures reliable electrical connections and resistance to corrosion for long-term functionality.

RAM Words: 544

Offers ample memory capacity for storing and processing data efficiently.

Maximum Clock Frequency: 5 MHz

Enables swift processing speeds for real-time signal processing tasks.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with high reliability and stability.

Technology: CMOS

Utilizes low power consumption and provides high speed performance for efficient signal processing.

Format: FIXED POINT

Facilitates accurate and precise calculations for digital signal processing tasks.

Low Power Mode: YES

Allows for energy-efficient operation, reducing power consumption and heat dissipation.

Barrel Shifter: YES

Enhances computational capabilities by enabling efficient shifting and rotation operations on binary data.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F241FNA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

5 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

544

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

TMS320F241FNA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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