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TMS320DM8168CCYGH

Texas Instruments

TMS320DM8168CCYGH by Texas Instruments

TMS320DM8168CCYGH by Texas Instruments is a 32-bit DSP with integrated cache and 32-bit external data bus width. It features 72 DMA channels, low power mode, and boundary scan. Ideal for applications requiring high-performance digital signal processing in commercial temperature grade environments.

Median Price

$115.211

Lifecycle Status

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7

In-Stock Inventory

1k+

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Texas Instruments

USA . 1,742 parts In-Stock

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$115.211

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$111.746

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$86.625

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1,742

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$111.746

$86.625

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Bristol Electronics

USA . 23 parts In-Stock

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$103.712

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$95.415

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Digiode

USA . 3,380 parts In-Stock

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$109.450

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Vyrian

USA . 5,913 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 23 parts In-Stock

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Dan-Mar Components

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Distributors (Availability)

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AZTECH Wire

Italy . 529 parts In-Stock

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$15.020

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$15.020

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Parana Technologies

USA . 15 parts In-Stock

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$47.219

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DigiPath Technology Company

USA . 797 parts In-Stock

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$51.994

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$51.994

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ChromeModa Solutions

Germany . 3,884 parts In-Stock

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$53.055

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$43.505

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$43.505

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IDEA Electronic Components Group

UK . 1,937 parts In-Stock

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$53.055

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$50.402

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$47.750

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Corohmni

South Africa . 2,456 parts In-Stock

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$64.867

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Ampacity Inc.

Singapore . 1,299 parts In-Stock

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$97.930

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Corphita

USA . 2,558 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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Continental Prestige Electronics

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Aranea Global

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Overview

Unlock the power of cutting-edge technology with the TMS320DM8168CCYGH by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Digital Signal Processors that revolutionize performance across various applications. With integrated cache, advanced internal bus architecture, and low power mode, this product offers unparalleled value and benefits to customers seeking efficient solutions. Whether you're in telecommunications, automotive, or industrial automation, this DSP will take your projects to new heights, setting you apart from the competition. Elevate your designs with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making it a cost-effective choice.

Integrated Cache: YES

With integrated cache, this DSP offers faster access to frequently used data, enhancing performance.

Surface Mount: YES

This feature allows for easier integration into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in minimizing power consumption, making it energy-efficient.

Address Bus Width: 15

The wide address bus width allows for efficient data handling and processing, improving overall performance.

Package Shape: SQUARE

The square shape of the package makes it easier to handle and fit into compact spaces.

Bit Size: 32

With a 32-bit architecture, this DSP can handle complex mathematical operations efficiently.

No. of Terminals: 1031

The high number of terminals allow for a wide range of connectivity options, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

This package style provides effective heat dissipation, ensuring optimal performance under heavy workloads.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures stable operation even under low power conditions.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature range allows for reliable operation even in challenging environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the DSP can be used in a wide range of environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position allows for easy soldering and better heat dissipation.

Max Seated Height: 3.31 mm

The low maximum seated height makes it suitable for slim devices and applications with space constraints.

RAM Words: 16384

With a large RAM capacity, this DSP can efficiently handle data processing and storage requirements.

Width: 25 mm

The compact width of the DSP allows for easy integration into various systems and devices.

Boundary Scan: YES

The presence of boundary scan capability helps in diagnosing and debugging the system during development and testing.

External Data Bus Width: 32

The wide external data bus width allows for fast data transfer between the processor and external components.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures reliable soldering during manufacturing and assembly processes.

Internal Bus Architecture: MULTIPLE

The use of multiple internal bus architectures enhances data throughput and processing efficiency.

Length: 25 mm

The compact length of the DSP makes it suitable for space-constrained applications and devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in typical operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

This DSP supports a wide range of peripheral ICs, making it versatile for diverse applications.

No. of Timers: 8

With multiple timers, this DSP can handle various time-sensitive tasks simultaneously, enhancing its functionality.

Technology: CMOS

The CMOS technology used in this DSP ensures low power consumption and high performance.

Terminal Form: BALL

The ball terminal form makes it easy to solder and connect the DSP to external components.

Nominal Supply Voltage: 1 V

The nominal supply voltage provides a stable power source for consistent and reliable operation.

No. of DMA Channels: 72

With a high number of DMA channels, this DSP can efficiently manage data transfers and processing tasks.

Terminal Pitch: 0.65 mm

The narrow terminal pitch allows for compact placement of terminals, saving space on the PCB.

Format: FLOATING POINT

The floating-point format used in this DSP enables precise and efficient processing of decimal numbers.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that this DSP is capable of withstanding moderate moisture exposure without damage.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption when the DSP is idle, improving overall energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8168CCYGH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8168CCYGH Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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