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TMS320DM8167SCYG4

Texas Instruments

TMS320DM8167SCYG4 by Texas Instruments

TMS320DM8167SCYG4 by Texas Instruments is a 32-bit DSP with integrated cache, 15-bit address bus, and 32-bit external data bus. Ideal for digital signal processing applications due to its multiple internal bus architecture, low power mode, and 8 timers for efficient performance.

Median Price

$121.085

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,877 parts In-Stock

1+ parts

$121.085

100+ parts

$109.603

1k+ parts

$104.384

10k+ parts

-

1,877

$121.085

$109.603

$104.384

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$104.384

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$104.384

-

-

-

Digiode

USA . 3,123 parts In-Stock

1+ parts

$115.031

100+ parts

-

1k+ parts

-

10k+ parts

-

3,123

$115.031

-

-

-

Vyrian

USA . 6,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,192

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,050 parts In-Stock

1+ parts

$12.210

100+ parts

-

1k+ parts

-

10k+ parts

-

1,050

$12.210

-

-

-

Corohmni

South Africa . 2,518 parts In-Stock

1+ parts

$24.016

100+ parts

-

1k+ parts

-

10k+ parts

-

2,518

$24.016

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$28.007

100+ parts

$25.486

1k+ parts

$22.966

10k+ parts

-

500

$28.007

$25.486

$22.966

-

Parana Technologies

USA . 781 parts In-Stock

1+ parts

$47.439

100+ parts

-

1k+ parts

-

10k+ parts

-

781

$47.439

-

-

-

DigiPath Technology Company

USA . 1,752 parts In-Stock

1+ parts

$52.236

100+ parts

$48.057

1k+ parts

-

10k+ parts

-

1,752

$52.236

$48.057

-

-

ChromeModa Solutions

Germany . 5,692 parts In-Stock

1+ parts

$53.302

100+ parts

$43.708

1k+ parts

-

10k+ parts

-

5,692

$53.302

$43.708

-

-

IDEA Electronic Components Group

UK . 68 parts In-Stock

1+ parts

$53.302

100+ parts

$50.637

1k+ parts

$47.972

10k+ parts

-

68

$53.302

$50.637

$47.972

-

Ampacity Inc.

Singapore . 1,602 parts In-Stock

1+ parts

$102.920

100+ parts

-

1k+ parts

-

10k+ parts

-

1,602

$102.920

-

-

-

Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

$104.400

100+ parts

$99.180

1k+ parts

-

10k+ parts

$92.916

800

$104.400

$99.180

-

$92.916

Corphita

USA . 4,585 parts In-Stock

1+ parts

$108.976

100+ parts

-

1k+ parts

-

10k+ parts

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4,585

$108.976

-

-

-

Microchip USA

USA . 2,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,172

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Overview

Experience unparalleled processing power with the TMS320DM8167SCYG4 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This DSP is perfect for a wide range of applications, offering customers unmatched value and performance. Whether you're working on audio processing, video analytics, or telecommunications, this product will exceed your expectations with its integrated cache, low power mode, and advanced technology. Upgrade your projects today with the TMS320DM8167SCYG4 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Highly durable and impact-resistant material, protecting the internal components of the DSP from damage.

Integrated Cache: YES

Allows for faster data access and processing, improving overall performance of the DSP.

Maximum Supply Voltage: 1.05 V

Efficient power consumption, reducing heat generation and extending the lifespan of the DSP.

Address Bus Width: 15

Allows for efficient memory addressing and data transfer within the DSP.

Package Shape: SQUARE

Compact design, making it easy to integrate into various electronic systems.

Bit Size: 32

Enables the DSP to handle complex mathematical calculations and data processing tasks effectively.

No. of Terminals: 1031

Provides ample connectivity options for interfacing with other components in the system.

Minimum Supply Voltage: 0.95 V

Supports low-power operation, ideal for energy-efficient applications.

Maximum Operating Temperature: 95 °C

Can operate in high-temperature environments without risking performance degradation.

Minimum Operating Temperature: 0 °C

Capable of functioning in cold temperatures, ensuring reliability in various operating conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides corrosion resistance and reliable electrical connections for long-term use.

Terminal Position: BOTTOM

Facilitates easy installation and maintenance of the DSP in electronic systems.

RAM Words: 16384

Sufficient memory capacity for storing and processing data efficiently.

Width: 25 mm

Compact size, suitable for space-constrained applications.

Boundary Scan: YES

Allows for easy testing and debugging of the DSP during production and operation.

External Data Bus Width: 32

High data bandwidth for rapid communication with external devices.

Internal Bus Architecture: MULTIPLE

Supports concurrent data processing tasks, enhancing overall performance.

Temperature Grade: COMMERCIAL

Designed for standard commercial operating temperatures, suitable for a wide range of applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Versatile processing capabilities for handling a variety of signal processing tasks.

Technology: CMOS

Low power consumption and high-speed operation, ideal for battery-powered devices.

Terminal Form: BALL

Ensures reliable solder connections and efficient heat dissipation.

Nominal Supply Voltage: 1 V

Stable voltage supply for consistent performance of the DSP.

No. of DMA Channels: 72

Multiple channels for efficient data transfer between memory and peripherals.

Terminal Pitch: 0.65 mm

Compact terminal spacing for high-density PCB layouts.

Format: FLOATING POINT

Supports precise mathematical calculations and data processing tasks.

Moisture Sensitivity Level (MSL): 4

Resistant to moisture damage, ensuring reliability in humid environments.

Low Power Mode: YES

Allows for energy-efficient operation and extended battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8167SCYG4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8167SCYG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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