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TMS320DM8147BCYE0

Texas Instruments

TMS320DM8147BCYE0 by Texas Instruments

TMS320DM8147BCYE0 by Texas Instruments is a 32-bit DSP with 8-bit address bus, 16-bit external data bus, and max clock frequency of 30 MHz. Ideal for digital signal processing applications requiring low power mode, it features a package style of grid array with fine pitch and operates b/w 0-90°C temperature range.

Median Price

$58.790

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,667 parts In-Stock

1+ parts

$58.790

100+ parts

$57.620

1k+ parts

$56.450

10k+ parts

-

1,667

$58.790

$57.620

$56.450

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 131 parts In-Stock

1+ parts

$55.850

100+ parts

-

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-

10k+ parts

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131

$55.850

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Vyrian

USA . 3,987 parts In-Stock

1+ parts

-

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-

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3,987

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Chip Stock

USA . 2,980 parts In-Stock

1+ parts

-

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2,980

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Connect4Technologies Inc.

Canada . 10 parts In-Stock

1+ parts

-

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-

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10

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Bristol Electronics

USA . 4 parts In-Stock

1+ parts

-

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 289 parts In-Stock

1+ parts

$8.250

100+ parts

-

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289

$8.250

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Parana Technologies

USA . 2,364 parts In-Stock

1+ parts

$33.319

100+ parts

-

1k+ parts

$123.268

10k+ parts

-

2,364

$33.319

-

$123.268

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DigiPath Technology Company

USA . 1,012 parts In-Stock

1+ parts

$36.688

100+ parts

$33.753

1k+ parts

-

10k+ parts

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1,012

$36.688

$33.753

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ChromeModa Solutions

Germany . 3,408 parts In-Stock

1+ parts

$37.437

100+ parts

$30.698

1k+ parts

-

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3,408

$37.437

$30.698

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IDEA Electronic Components Group

UK . 2,374 parts In-Stock

1+ parts

$37.437

100+ parts

$35.565

1k+ parts

$33.693

10k+ parts

-

2,374

$37.437

$35.565

$33.693

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Ampacity Inc.

Singapore . 1,558 parts In-Stock

1+ parts

$49.970

100+ parts

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1,558

$49.970

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-

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Corphita

USA . 3,070 parts In-Stock

1+ parts

$52.911

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-

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3,070

$52.911

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Corohmni

South Africa . 650 parts In-Stock

1+ parts

$74.066

100+ parts

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650

$74.066

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

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3,000

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Microchip USA

USA . 378 parts In-Stock

1+ parts

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378

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Overview

Unlock the power of cutting-edge technology with the TMS320DM8147BCYE0 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that are versatile and reliable. With applications ranging from telecommunications to automotive systems, this DSP offers unparalleled performance and efficiency. Experience seamless integration, high-speed processing, and innovative features that will elevate your projects to new heights. Trust in Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, making it suitable for various environmental conditions.

Maximum Supply Voltage: 1.16 V

Allows for efficient power usage while providing a sufficient voltage supply for optimal performance of the DSP.

Bit Size: 32

A 32-bit architecture offers high precision and computational capabilities, making it suitable for complex signal processing tasks.

RAM Words: 16384

With a large RAM capacity, the DSP can efficiently store and process a significant amount of data, enhancing its performance in handling intensive processing tasks.

Maximum Clock Frequency: 30 MHz

A high clock frequency allows for fast data processing and real-time signal analysis, making the DSP suitable for time-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital systems, making the DSP energy-efficient and versatile.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This specific IC type indicates that the DSP is designed for signal processing applications, ensuring optimal performance and reliability in handling digital signals.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8147BCYE0 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

8

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B684

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

684

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA688,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

0.95/1.35

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.06 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8147BCYE0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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