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TMS320DM648ZUT7

Texas Instruments

TMS320DM648ZUT7 by Texas Instruments

TMS320DM648ZUT7 by Texas Instruments is a 32-bit DSP with 720 MHz clock frequency, 529 terminals, and 8 DMA channels. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption. Features integrated cache, multiple internal bus architecture, and boundary scan capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,669 parts In-Stock

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Digiode

USA . 619 parts In-Stock

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619

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One Stop Electronics

USA . 850 parts In-Stock

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$2.000

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850

$2.000

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AZTECH Wire

Italy . 440 parts In-Stock

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$14.296

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$58.927

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$53.624

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$48.320

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$58.927

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Parana Technologies

USA . 1,970 parts In-Stock

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$72.438

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DigiPath Technology Company

USA . 1,527 parts In-Stock

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$79.763

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ChromeModa Solutions

Germany . 2,238 parts In-Stock

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$81.391

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$66.741

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$66.741

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IDEA Electronic Components Group

UK . 1,289 parts In-Stock

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$81.391

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$77.321

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$73.252

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$73.252

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Corohmni

South Africa . 953 parts In-Stock

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$85.644

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QUARKTWIN TECHNOLOGY LTD

USA . 18,200 parts In-Stock

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Corphita

USA . 1,681 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Metaverse IC Inc.

Canada . 200 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 160 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Experience unparalleled performance and efficiency with the TMS320DM648ZUT7 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Digital Signal Processors that cater to a wide range of applications. Whether you need high-speed data processing or low power consumption, this product has got you covered. With integrated cache and advanced technology, the TMS320DM648ZUT7 offers exceptional value and benefits to customers, making it the ideal choice for your DSP needs. Elevate your projects to the next level with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the DSP, making it suitable for various operating environments.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, making the DSP capable of handling complex algorithms and data processing tasks effectively.

Maximum Supply Voltage: 1.26 V

Operates within a safe voltage range, ensuring reliable performance and protection against voltage spikes.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data access and processing, enhancing overall performance and speed of the DSP.

Address Bus Width: 32

A wider address bus width allows for larger memory addressing capabilities, enabling the DSP to handle more complex data processing tasks and algorithms.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM648ZUT7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

720 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

529

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM648ZUT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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