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TMS320DM6437ZWTQ5

Texas Instruments

TMS320DM6437ZWTQ5 by Texas Instruments

TMS320DM6437ZWTQ5 by Texas Instruments is a 32-bit DSP with integrated cache and 32-bit external data bus width. Ideal for automotive applications, it operates at up to 27 MHz clock frequency and features low power mode for efficient performance. With a package style of grid array, this DSP has 361 terminals and boundary scan capability.

Median Price

$45.360

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 380 parts In-Stock

1+ parts

$38.789

100+ parts

$34.479

1k+ parts

$25.352

10k+ parts

-

380

$38.789

$34.479

$25.352

-

DigiKey

USA . 7 parts In-Stock

1+ parts

$45.360

100+ parts

$32.960

1k+ parts

$31.663

10k+ parts

-

7

$45.360

$32.960

$31.663

-

Mouser Electronics

USA . 19 parts In-Stock

1+ parts

$62.640

100+ parts

$45.110

1k+ parts

-

10k+ parts

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19

$62.640

$45.110

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,231 parts In-Stock

1+ parts

$27.788

100+ parts

-

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10k+ parts

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3,231

$27.788

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Vyrian

USA . 8,961 parts In-Stock

1+ parts

-

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8,961

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Chip Stock

USA . 293 parts In-Stock

1+ parts

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100+ parts

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293

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 951 parts In-Stock

1+ parts

$13.538

100+ parts

-

1k+ parts

$14.041

10k+ parts

-

951

$13.538

-

$14.041

-

IDEA Electronic Components Group

UK . 1,922 parts In-Stock

1+ parts

$15.211

100+ parts

$14.450

1k+ parts

$13.690

10k+ parts

-

1,922

$15.211

$14.450

$13.690

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ChromeModa Solutions

Germany . 428 parts In-Stock

1+ parts

$15.211

100+ parts

$12.473

1k+ parts

-

10k+ parts

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428

$15.211

$12.473

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-

Corphita

USA . 1,336 parts In-Stock

1+ parts

$26.325

100+ parts

-

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1,336

$26.325

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Corohmni

South Africa . 5,163 parts In-Stock

1+ parts

$38.665

100+ parts

-

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5,163

$38.665

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Microchip USA

USA . 6,421 parts In-Stock

1+ parts

$99.498

100+ parts

-

1k+ parts

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6,421

$99.498

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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2,500

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DigiPath Technology Company

USA . 272 parts In-Stock

1+ parts

-

100+ parts

$13.714

1k+ parts

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272

-

$13.714

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Overview

Experience unmatched performance and reliability with the TMS320DM6437ZWTQ5 by Texas Instruments, a leading manufacturer in the field of Digital Signal Processors (DSPs). This cutting-edge product offers integrated cache, low power mode, and multiple DMA channels, making it ideal for a wide range of applications. From automotive to industrial, this DSP delivers exceptional value, benefits, and advantages to customers seeking high-quality solutions. Trust Texas Instruments for innovative technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Integrated Cache: YES

Having integrated cache helps in improving the speed and performance of the processor by reducing memory access times.

Maximum Supply Voltage: 1.89 V

The maximum supply voltage of 1.89 V ensures safe operation and compatibility with a wide range of power sources.

On Chip Data RAM Width: 8

With an on-chip data RAM width of 8, the processor can efficiently handle and store data during processing tasks.

Address Bus Width: 32

A wider address bus width of 32 allows the processor to access a larger memory space, enabling faster data processing.

Package Shape: SQUARE

The square package shape helps in efficient placement on circuit boards, optimizing space utilization in electronic devices.

Bit Size: 32

A bit size of 32 enables the processor to handle and process data in 32-bit chunks, which improves computational efficiency.

Power Supplies (V): 1.2,1.8,3.3

Having multiple power supply options allows flexibility in different applications and ensures stable operation under varying voltage conditions.

No. of Terminals: 361

With a high number of terminals, the processor can interface with various external components and peripherals, expanding its functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch enables easy installation and reliable connection in compact electronic devices.

Minimum Supply Voltage: 1.71 V

The minimum supply voltage of 1.71 V provides a safe operating range for the processor while ensuring energy efficiency.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the processor can withstand high thermal conditions, suitable for demanding industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40°C ensures reliable performance in extreme cold environments, making the processor versatile in various applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the assembly process and enhances thermal conductivity for effective heat dissipation.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm allows for a compact design and easy integration into slim electronic devices.

RAM Words: 81920

With a high number of RAM words, the processor can efficiently store and retrieve data during processing operations, enhancing overall performance.

Width: 16 mm

The compact width of 16 mm enables the processor to be used in space-constrained applications without compromising performance.

Boundary Scan: YES

Having boundary scan capability ensures easy testing and debugging of the processor during development and production stages, improving overall reliability.

External Data Bus Width: 32

The external data bus width of 32 allows for fast data transfer between the processor and external memory or peripherals, enhancing processing speed.

Maximum Clock Frequency: 27 MHz

With a maximum clock frequency of 27 MHz, the processor can perform tasks at high speeds, suitable for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering during manufacturing processes, maintaining product quality.

Peak Reflow Temperature °C: 260

Operating at a peak reflow temperature of 260°C allows for proper soldering of the processor on PCBs, ensuring strong and durable connections.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances data flow and communication within the processor, optimizing performance and efficiency.

Length: 16 mm

The length of 16 mm provides a compact form factor, making the processor suitable for small-scale applications without compromising functionality.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable operation in automotive applications, where temperature variations and harsh conditions are common.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral IC types enhances the processor's versatility for a wide range of signal processing applications.

No. of Timers: 5

Having 5 timers allows the processor to manage various time-sensitive tasks efficiently, improving overall system performance and responsiveness.

Technology: CMOS

The use of CMOS technology provides low power consumption and high speed operation, making the processor energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and ensures reliable electrical connections, enhancing the overall durability of the product.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V provides a stable operating voltage for the processor, ensuring consistent performance and reliability.

No. of DMA Channels: 72

Having 72 DMA channels allows for efficient data transfer and processing, enabling high-speed communication with external devices and peripherals.

ROM Programmability: MROM

The MROM programmability ensures that the processor's program memory is non-volatile and secure, protecting important data even during power loss.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, the processor can be easily mounted on PCBs with tight spacing, making it suitable for compact electronic designs.

Format: FIXED POINT

Using a fixed-point format simplifies arithmetic operations and improves processing efficiency, making the processor ideal for real-time signal processing applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates the level of protection against moisture-induced damage, ensuring long-term reliability in various environments.

Low Power Mode: YES

The low power mode feature allows the processor to operate in a power-efficient state, conserving energy and extending battery life in portable devices.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 enables the processor to store program instructions efficiently, enhancing performance and speed in executing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6437ZWTQ5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

361

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

81920

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6437ZWTQ5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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