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TMS320DM6437ZWT5

Texas Instruments

TMS320DM6437ZWT5 by Texas Instruments

TMS320DM6437ZWT5 by Texas Instruments is a 32-bit DSP with integrated cache and 32-bit address bus. It operates at max frequency of 27 MHz, suitable for digital signal processing applications requiring low power consumption. With 72 DMA channels and on-chip data RAM width of 8, it offers high performance in a compact square package.

Median Price

$31.084

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 355 parts In-Stock

1+ parts

-

100+ parts

$27.630

1k+ parts

$24.720

10k+ parts

$23.260

355

-

$27.630

$24.720

$23.260

DigiKey

USA . 355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

355

-

-

-

-

Verical

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$34.538

1k+ parts

$30.900

10k+ parts

$29.075

180

-

$34.538

$30.900

$29.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 673 parts In-Stock

1+ parts

$29.165

100+ parts

-

1k+ parts

-

10k+ parts

-

673

$29.165

-

-

-

Vyrian

USA . 4,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,676

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,810 parts In-Stock

1+ parts

$23.030

100+ parts

-

1k+ parts

$23.675

10k+ parts

-

1,810

$23.030

-

$23.675

-

ChromeModa Solutions

Germany . 5,654 parts In-Stock

1+ parts

$25.876

100+ parts

$21.218

1k+ parts

-

10k+ parts

-

5,654

$25.876

$21.218

-

-

IDEA Electronic Components Group

UK . 2,152 parts In-Stock

1+ parts

$25.876

100+ parts

$24.582

1k+ parts

$23.288

10k+ parts

-

2,152

$25.876

$24.582

$23.288

-

Ampacity Inc.

Singapore . 297 parts In-Stock

1+ parts

$26.090

100+ parts

-

1k+ parts

-

10k+ parts

-

297

$26.090

-

-

-

Corphita

USA . 1,081 parts In-Stock

1+ parts

$27.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,081

$27.630

-

-

-

Component Stockers USA

USA . 958 parts In-Stock

1+ parts

$31.460

100+ parts

$29.570

1k+ parts

-

10k+ parts

-

958

$31.460

$29.570

-

-

Corohmni

South Africa . 113 parts In-Stock

1+ parts

$35.064

100+ parts

-

1k+ parts

-

10k+ parts

-

113

$35.064

-

-

-

Microchip USA

USA . 431 parts In-Stock

1+ parts

$73.440

100+ parts

$72.160

1k+ parts

$71.520

10k+ parts

$70.880

431

$73.440

$72.160

$71.520

$70.880

DigiPath Technology Company

USA . 235 parts In-Stock

1+ parts

-

100+ parts

$23.330

1k+ parts

-

10k+ parts

-

235

-

$23.330

-

-

Overview

Experience the power of cutting-edge technology with the TMS320DM6437ZWT5 by Texas Instruments. As a leader in Digital Signal Processors, Texas Instruments delivers top-notch quality and reliability. This versatile DSP is perfect for a wide range of applications, offering customers unmatched value and benefits. Whether you're working on audio processing, image recognition, or communications systems, this product will exceed your expectations with its integrated cache, low power mode, and high-speed performance. Trust Texas Instruments to provide you with the tools you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the DSP, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

Integrated cache helps in improving the overall performance of the DSP by reducing memory access times and enhancing data processing speed.

Maximum Supply Voltage: 1.89 V

Having a high maximum supply voltage allows for flexibility in power management and compatibility with different power sources.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width allows for storing and accessing more data quickly, enhancing the processing capabilities of the DSP.

Address Bus Width: 32

A wide address bus width enables the DSP to access a larger memory space, improving its capacity for data storage and retrieval.

Package Shape: SQUARE

The square package shape offers efficient use of space and facilitates easier mounting and integration into electronic systems.

Bit Size: 32

With a 32-bit architecture, the DSP can handle complex calculations and process large amounts of data with precision and speed.

Power Supplies (V): 1.2,1.8,3.3

Having multiple power supply options ensures compatibility with different power sources and allows for power optimization based on performance requirements.

No. of Terminals: 361

A high number of terminals provide ample connectivity options and facilitate interfacing with other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package styles offers versatility in mounting options and efficient space utilization.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures energy efficiency and allows for operation in low-power settings without compromising performance.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range indicates the DSP's ability to withstand heat stress and perform reliably in challenging environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the DSP can function effectively in a wide range of temperature conditions without performance degradation.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper provides excellent conductivity and corrosion resistance for reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy integration and soldering during the assembly process, ensuring efficient PCB layout design.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for compact and slim device designs, contributing to space-saving considerations in electronic systems.

RAM Words: 81920

Having a high number of RAM words provides ample storage capacity for data processing, enabling efficient multitasking and enhanced performance.

Width: 16 mm

Compact width dimension allows for the DSP to be integrated into various electronic devices with limited space constraints, maximizing design flexibility.

Boundary Scan: YES

Boundary scan feature enables efficient testing and debugging of the DSP during production, ensuring high quality and reliability of the final product.

External Data Bus Width: 32

A wide external data bus width enhances data transfer rates between the DSP and external memory devices, improving overall system performance.

Maximum Clock Frequency: 27 MHz

High maximum clock frequency allows for fast data processing and real-time signal processing capabilities, making the DSP suitable for high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for extended periods ensures reliable soldering processes during manufacturing, contributing to product durability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables the DSP to undergo robust soldering processes, ensuring strong and reliable connections on the PCB.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data transfer and communication within the DSP, enhancing processing speed and system performance.

Length: 16 mm

Compact length dimension enables easy integration of the DSP into various electronic devices, optimizing space utilization and design flexibility.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The combination of digital signal processor peripheral IC type and other integrated circuits enhances the DSP's functionality and versatility for diverse applications.

No. of Timers: 5

Having multiple timers allows for precise timing control and synchronization of operations within the DSP, enhancing performance and operational efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high reliability, making the DSP energy-efficient and suitable for battery-powered applications.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and strong electrical connections during the assembly process, ensuring reliable performance in the final product.

Nominal Supply Voltage: 1.8 V

Having a stable nominal supply voltage ensures consistent and reliable operation of the DSP, guaranteeing performance integrity in various operating conditions.

No. of DMA Channels: 72

A high number of DMA channels enables efficient data transfer and processing tasks, reducing the workload on the CPU and improving overall system performance.

ROM Programmability: MROM

MROM programmability allows for efficient programming and storage of read-only memory data, enhancing the DSP's versatility and adaptability for different applications.

Terminal Pitch: 0.8 mm

Narrow terminal pitch simplifies PCB layout design and facilitates compact device integration, optimizing space utilization and overall system efficiency.

Format: FIXED POINT

Fixed-point format enables precise and efficient numeric calculations, making the DSP suitable for various signal processing applications that require accuracy and speed.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the DSP can withstand moderate exposure to moisture during handling and assembly processes, ensuring reliability and longevity of the product.

Low Power Mode: YES

Low power mode functionality allows the DSP to operate efficiently in power-constrained environments or extend battery life in portable devices, making it a versatile choice for energy-efficient applications.

On Chip Program ROM Width: 8

Wider on-chip program ROM width provides ample storage capacity for program instructions, enabling efficient program execution and enhancing the DSP's processing capabilities.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6437ZWT5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

361

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

81920

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6437ZWT5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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