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TMS320DM6437ZDU6

Texas Instruments

TMS320DM6437ZDU6 by Texas Instruments

TMS320DM6437ZDU6 by Texas Instruments is a 32-bit DSP with 8-word cache, 32-bit data bus, and 27 MHz clock frequency. Ideal for digital signal processing applications due to its low power mode, multiple internal bus architecture, and 72 DMA channels for efficient data transfer.

Median Price

$36.327

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29,142 parts In-Stock

1+ parts

$36.327

100+ parts

$32.290

1k+ parts

$23.743

10k+ parts

-

29,142

$36.327

$32.290

$23.743

-

Rochester

USA . 41 parts In-Stock

1+ parts

-

100+ parts

$34.130

1k+ parts

$30.540

10k+ parts

$28.740

41

-

$34.130

$30.540

$28.740

DigiKey

USA . 41 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

41

-

-

-

-

Verical

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$38.750

1k+ parts

$35.038

10k+ parts

-

11

-

$38.750

$35.038

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,289 parts In-Stock

1+ parts

$31.331

100+ parts

-

1k+ parts

-

10k+ parts

-

1,289

$31.331

-

-

-

Vyrian

USA . 7,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,071

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,835 parts In-Stock

1+ parts

$17.654

100+ parts

-

1k+ parts

$17.845

10k+ parts

-

1,835

$17.654

-

$17.845

-

DigiPath Technology Company

USA . 1,383 parts In-Stock

1+ parts

$19.439

100+ parts

$17.884

1k+ parts

-

10k+ parts

-

1,383

$19.439

$17.884

-

-

IDEA Electronic Components Group

UK . 800 parts In-Stock

1+ parts

$19.836

100+ parts

$18.844

1k+ parts

$17.852

10k+ parts

-

800

$19.836

$18.844

$17.852

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ChromeModa Solutions

Germany . 354 parts In-Stock

1+ parts

$19.836

100+ parts

$16.266

1k+ parts

-

10k+ parts

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354

$19.836

$16.266

-

-

Corphita

USA . 2,896 parts In-Stock

1+ parts

$29.682

100+ parts

-

1k+ parts

-

10k+ parts

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2,896

$29.682

-

-

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Corohmni

South Africa . 2,948 parts In-Stock

1+ parts

$83.293

100+ parts

-

1k+ parts

-

10k+ parts

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2,948

$83.293

-

-

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

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Overview

Experience unparalleled performance and reliability with the TMS320DM6437ZDU6 by Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor (DSP) offers integrated cache, multiple power supplies, and boundary scan capabilities for seamless operation. With a wide range of applications in telecommunications, multimedia, and industrial automation, this product provides customers with efficient data processing and high-speed performance. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Elevate your projects with the TMS320DM6437ZDU6 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for various applications.

Integrated Cache: YES

The integrated cache helps in improving the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.26 V

Having a maximum supply voltage of 1.26 V allows for efficient power usage while providing enough voltage for optimal performance.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for faster data processing and storage on the chip.

Address Bus Width: 32

A wider address bus width of 32 allows for increased memory addressing capability and overall system performance.

Bit Size: 32

With a 32-bit architecture, the DSP can handle complex calculations and process data efficiently.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supplies ensures compatibility with various systems and flexibility in power management.

No. of Terminals: 376

Having a large number of terminals allows for connectivity with other components and peripherals, enhancing the versatility of the DSP.

RAM Words: 81920

The extensive RAM capacity of 81920 words enables the DSP to handle large amounts of data and execute complex algorithms efficiently.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor and supporting other types of peripheral ICs makes this product suitable for a wide range of applications in signal processing and control systems.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6437ZDU6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

376

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

81920

ROM Programmability:

MROM

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6437ZDU6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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