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TMS320DM641AGNZ6

Texas Instruments

TMS320DM641AGNZ6 by Texas Instruments

TMS320DM641AGNZ6 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 32-bit external data bus, and max clock frequency of 75 MHz. Ideal for digital signal processing applications requiring low power mode, it features a grid array package style and CMOS technology.

Median Price

$32.660

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14 parts In-Stock

1+ parts

-

100+ parts

$32.660

1k+ parts

$29.220

10k+ parts

$27.500

14

-

$32.660

$29.220

$27.500

DigiKey

USA . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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14

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,180 parts In-Stock

1+ parts

$34.476

100+ parts

-

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3,180

$34.476

-

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Vyrian

USA . 3,494 parts In-Stock

1+ parts

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3,494

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ACDS - Activité Composants Distribution Service

France . 69 parts In-Stock

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69

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Bristol Electronics

USA . 69 parts In-Stock

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69

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Dan-Mar Components

USA . 69 parts In-Stock

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69

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 726 parts In-Stock

1+ parts

$29.997

100+ parts

-

1k+ parts

$65.728

10k+ parts

-

726

$29.997

-

$65.728

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Corohmni

South Africa . 4,962 parts In-Stock

1+ parts

$32.360

100+ parts

-

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4,962

$32.360

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Corphita

USA . 3,653 parts In-Stock

1+ parts

$32.661

100+ parts

-

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3,653

$32.661

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DigiPath Technology Company

USA . 873 parts In-Stock

1+ parts

$33.030

100+ parts

$30.388

1k+ parts

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873

$33.030

$30.388

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ChromeModa Solutions

Germany . 1,328 parts In-Stock

1+ parts

$33.704

100+ parts

$27.637

1k+ parts

-

10k+ parts

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1,328

$33.704

$27.637

-

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IDEA Electronic Components Group

UK . 880 parts In-Stock

1+ parts

$33.704

100+ parts

$32.019

1k+ parts

$30.334

10k+ parts

-

880

$33.704

$32.019

$30.334

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Microchip USA

USA . 353 parts In-Stock

1+ parts

$80.130

100+ parts

$78.740

1k+ parts

$78.040

10k+ parts

$77.340

353

$80.130

$78.740

$78.040

$77.340

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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2,500

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Overview

Experience unparalleled performance and reliability with the TMS320DM641AGNZ6 by Texas Instruments. As a leading manufacturer of Digital Signal Processors (DSPs), Texas Instruments delivers cutting-edge technology for a wide range of applications. This versatile product offers exceptional value, providing customers with high-quality processing power, low power consumption, and advanced features. Trust Texas Instruments to meet your needs and exceed your expectations with the TMS320DM641AGNZ6. Elevate your projects to the next level with this top-of-the-line DSP solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

Surface Mount: YES

Convenient installation on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.44 V

Optimal operating voltage ensuring safe and efficient performance.

Address Bus Width: 23

Sufficient address bus width for handling complex memory addressing tasks.

Bit Size: 32

High processing capability with a 32-bit architecture for faster data manipulation.

Power Supplies (V): 1.4,3.3

Support for multiple power supply voltages for versatile application requirements.

No. of Terminals: 548

Abundant terminals for flexible connectivity options with external devices.

Package Style (Meter): GRID ARRAY

Grid array packaging for enhanced thermal performance and reliability.

Minimum Supply Voltage: 1.36 V

Low minimum supply voltage for power efficiency and reduced energy consumption.

Terminal Finish: TIN LEAD

Tin lead terminal finish for improved solderability and electrical conductivity.

Terminal Position: BOTTOM

Bottom terminal position for convenient board mounting and signal routing.

Maximum Seated Height: 2.8 mm

Low seated height for space-saving designs and compact electronic systems.

RAM Words: 16384

Large RAM capacity for storing and processing a significant amount of data efficiently.

Width: 27 mm

Compact width dimension for integration into various electronic devices.

Boundary Scan: YES

Boundary scan feature for enhanced testing and debugging capabilities.

External Data Bus Width: 32

Wide external data bus width for fast data transfer and processing.

Maximum Clock Frequency: 75 MHz

High maximum clock frequency for quick execution of instructions and tasks.

Maximum Time At Peak Reflow Temperature (s): 20

Sufficient time at peak reflow temperature for reliable solder connections.

Peak Reflow Temperature °C: 220

High peak reflow temperature for proper solder melting and component bonding.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture for efficient data flow and processing.

Length: 27 mm

Short length dimension for compact and space-efficient product designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type for diverse signal processing applications.

Technology: CMOS

CMOS technology for low power consumption and efficient operation.

Terminal Form: BALL

Ball terminal form for reliable electrical connections and signal transmission.

Nominal Supply Voltage: 1.4 V

Stable nominal supply voltage for consistent and reliable performance.

Terminal Pitch: 1 mm

Fine terminal pitch for compact layout and increased connectivity options.

Format: FIXED POINT

Fixed-point format for simplified arithmetic operations and precise calculations.

Moisture Sensitivity Level (MSL): 4

MSL level 4 for enhanced moisture protection and reliability in varying environments.

Low Power Mode: YES

Low power mode capability for energy-efficient operation and extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM641AGNZ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320DM641AGNZ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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