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TMS320DM640AGNZA4

Texas Instruments

TMS320DM640AGNZA4 by Texas Instruments

TMS320DM640AGNZA4 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 32-bit external data bus, and max clock frequency of 75 MHz. Ideal for digital signal processing applications requiring low power mode, it features a grid array package style and CMOS technology.

Median Price

$39.499

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 910 parts In-Stock

1+ parts

-

100+ parts

$35.110

1k+ parts

$31.420

10k+ parts

$29.570

910

-

$35.110

$31.420

$29.570

DigiKey

USA . 910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

910

-

-

-

-

Verical

USA . 910 parts In-Stock

1+ parts

-

100+ parts

$43.888

1k+ parts

$39.275

10k+ parts

$36.962

910

-

$43.888

$39.275

$36.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,557 parts In-Stock

1+ parts

$37.060

100+ parts

-

1k+ parts

-

10k+ parts

-

3,557

$37.060

-

-

-

Vyrian

USA . 3,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,967

-

-

-

-

DigiKey Marketplace

USA . 910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

910

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$22.137

100+ parts

$20.145

1k+ parts

$18.152

10k+ parts

-

5,000

$22.137

$20.145

$18.152

-

Corphita

USA . 2,718 parts In-Stock

1+ parts

$35.109

100+ parts

-

1k+ parts

-

10k+ parts

-

2,718

$35.109

-

-

-

Corohmni

South Africa . 216 parts In-Stock

1+ parts

$42.576

100+ parts

-

1k+ parts

-

10k+ parts

-

216

$42.576

-

-

-

Parana Technologies

USA . 256 parts In-Stock

1+ parts

$45.218

100+ parts

-

1k+ parts

-

10k+ parts

-

256

$45.218

-

-

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ChromeModa Solutions

Germany . 6,451 parts In-Stock

1+ parts

$50.807

100+ parts

$41.662

1k+ parts

-

10k+ parts

-

6,451

$50.807

$41.662

-

-

IDEA Electronic Components Group

UK . 1,919 parts In-Stock

1+ parts

$50.807

100+ parts

$48.267

1k+ parts

$45.726

10k+ parts

-

1,919

$50.807

$48.267

$45.726

-

Microchip USA

USA . 1,387 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,387

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DigiPath Technology Company

USA . 1,163 parts In-Stock

1+ parts

-

100+ parts

$45.808

1k+ parts

-

10k+ parts

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1,163

-

$45.808

-

-

Overview

Unlock the power of cutting-edge technology with the TMS320DM640AGNZA4 by Texas Instruments. As a leader in the industry, Texas Instruments consistently delivers top-quality products like this digital signal processor, known for its exceptional performance and reliability. Ideal for a wide range of applications, from audio processing to telecommunications, this DSP offers unparalleled value and benefits to customers seeking high-speed processing capabilities. Experience the advantages of Texas Instruments' innovation with the TMS320DM640AGNZA4 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a sturdy and durable construction for the DSP, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.26 V

Efficient power management with a low maximum supply voltage, reducing energy consumption.

Address Bus Width: 23

Wide address bus width enables efficient communication and processing of data within the DSP.

Bit Size: 32

32-bit architecture provides high processing power and accuracy for complex signal processing tasks.

Power Supplies (V): 1.4,3.3

Supports multiple power supply options for flexibility in different applications and environments.

No. of Terminals: 548

Large number of terminals facilitate connectivity and enable the DSP to interface with various components and systems.

Package Style (Meter): GRID ARRAY

Grid array package style ensures secure placement and soldering of the DSP on the circuit board.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage allows for efficient operation even under low power conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers reliable electrical connections and prevents corrosion for extended product life.

Terminal Position: BOTTOM

Bottom terminal position simplifies the integration process and optimizes space utilization on the circuit board.

Maximum Seated Height: 2.8 mm

Low seated height enables compact design and enhances thermal management for improved performance.

RAM Words: 16384

With a large RAM capacity, the DSP can efficiently process and store a significant amount of data for complex algorithms.

Width: 27 mm

Compact width allows for flexibility in placement within systems and minimizes space requirements.

Boundary Scan: YES

Boundary scan feature enables efficient testing and diagnosis of the DSP for improved reliability and maintenance.

External Data Bus Width: 32

A wide external data bus width facilitates high-speed data transfer and processing capabilities in the DSP.

Maximum Clock Frequency: 75 MHz

High maximum clock frequency ensures fast operation and real-time processing of signals in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 20

Can withstand peak reflow temperatures for a sufficient duration during manufacturing processes without compromising performance.

Peak Reflow Temperature °C: 220

Withstands high peak reflow temperatures for robust soldering and assembly during manufacturing.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer efficiency and speed for complex signal processing tasks.

Length: 27 mm

Efficient length design for compact integration and space optimization within electronic systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports a variety of peripheral IC types for versatile connectivity and functionality in diverse applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed performance for efficient signal processing.

Terminal Form: BALL

Ball terminal form enables secure and reliable connections with other components for stable operation.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable performance of the DSP in various operating conditions.

Terminal Pitch: 1 mm

Compact terminal pitch enables high-density mounting and connectivity for optimized circuit board layout.

Format: FIXED POINT

Fixed-point format offers precise and efficient computation for signal processing algorithms and calculations.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating ensures that the DSP is protected against moisture during storage, handling, and operation.

Low Power Mode: YES

Low power mode feature allows for energy-efficient operation and extends battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM640AGNZA4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320DM640AGNZA4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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