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TMS320C80GF60

Texas Instruments

TMS320C80GF60 by Texas Instruments

TMS320C80GF60 by Texas Instruments is a 32-bit DSP with 120 MHz clock frequency, 64-bit external data bus width, and 51200 RAM words. Ideal for digital signal processing applications requiring high-speed computation and precision. Operates at temperatures b/w 0-85°C with a supply voltage of 3.3V for efficient performance.

Median Price

$914.880

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 231 parts In-Stock

1+ parts

$757.630

100+ parts

$712.170

1k+ parts

$666.710

10k+ parts

-

231

$757.630

$712.170

$666.710

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DigiKey

USA . 231 parts In-Stock

1+ parts

$914.880

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231

$914.880

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Verical

USA . 123 parts In-Stock

1+ parts

$947.038

100+ parts

$890.212

1k+ parts

$833.388

10k+ parts

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123

$947.038

$890.212

$833.388

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 8 parts In-Stock

1+ parts

$786.800

100+ parts

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8

$786.800

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Digiode

USA . 3,868 parts In-Stock

1+ parts

$835.706

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3,868

$835.706

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DigiKey Marketplace

USA . 231 parts In-Stock

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$914.880

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231

$914.880

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Vyrian

USA . 6,975 parts In-Stock

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6,975

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Microfarads

USA . 8 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 2,419 parts In-Stock

1+ parts

$18.490

100+ parts

-

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2,419

$18.490

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Parana Technologies

USA . 566 parts In-Stock

1+ parts

$29.642

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$61.545

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566

$29.642

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$61.545

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DigiPath Technology Company

USA . 796 parts In-Stock

1+ parts

$32.640

100+ parts

$30.029

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-

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796

$32.640

$30.029

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ChromeModa Solutions

Germany . 5,494 parts In-Stock

1+ parts

$33.306

100+ parts

$27.311

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5,494

$33.306

$27.311

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IDEA Electronic Components Group

UK . 1,985 parts In-Stock

1+ parts

$33.306

100+ parts

$31.641

1k+ parts

$29.975

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1,985

$33.306

$31.641

$29.975

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Corphita

USA . 2,037 parts In-Stock

1+ parts

$791.721

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2,037

$791.721

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Microchip USA

USA . 412 parts In-Stock

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412

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Overview

Unleash the power of cutting-edge technology with the TMS320C80GF60 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unmatched quality and reliability. This DSP is perfect for a wide range of applications, offering customers unparalleled value and performance. Experience seamless operation and superior functionality with the TMS320C80GF60, setting new standards in the industry. Elevate your projects to the next level with this innovative and versatile solution.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent thermal conductivity and durability, ensuring reliable performance even in high temperature environments.

Maximum Supply Voltage: 3.465 V

Allows for a higher voltage input, providing flexibility and compatibility with various power sources.

Bit Size: 32

This allows for processing of data in 32-bit chunks, increasing efficiency and speed of operations.

Maximum Clock Frequency: 120 MHz

With a high clock frequency, this DSP can perform tasks quickly and efficiently, making it suitable for real-time processing applications.

RAM Words: 51200

The large RAM capacity enables storage of a significant amount of data for processing, making it suitable for complex tasks and multitasking.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C80GF60 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

32

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P305

Length:

47.245 mm

Low Power Mode:

NO

No. of Terminals:

305

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

HSPGA305,35X35MOD

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

51200

Maximum Seated Height:

5.59 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

2500 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

47.245 mm

Peripheral IC Type:

Trade Compliance

TMS320C80GF60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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