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TMS320C6748EZCE4

Texas Instruments

TMS320C6748EZCE4 by Texas Instruments

TMS320C6748EZCE4 by Texas Instruments is a 16-bit DSP with 30MHz clock frequency, 361 terminals, and operates b/w -40 to 90°C. Ideal for digital signal processing applications due to its low power mode, fixed-point format, and multiple internal bus architecture.

Median Price

$18.844

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 20,691 parts In-Stock

1+ parts

$18.844

100+ parts

$16.460

1k+ parts

$11.352

10k+ parts

-

20,691

$18.844

$16.460

$11.352

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 1,598 parts In-Stock

1+ parts

$8.563

100+ parts

-

1k+ parts

-

10k+ parts

-

1,598

$8.563

-

-

-

Digiode

USA . 697 parts In-Stock

1+ parts

$17.902

100+ parts

-

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697

$17.902

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Vyrian

USA . 7,717 parts In-Stock

1+ parts

-

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7,717

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NAC Semi

USA . 1,298 parts In-Stock

1+ parts

-

100+ parts

$44.810

1k+ parts

-

10k+ parts

$41.360

1,298

-

$44.810

-

$41.360

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,666 parts In-Stock

1+ parts

$11.352

100+ parts

-

1k+ parts

-

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2,666

$11.352

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-

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Corphita

USA . 4,588 parts In-Stock

1+ parts

$16.960

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-

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4,588

$16.960

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AZTECH Wire

Italy . 560 parts In-Stock

1+ parts

$19.860

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560

$19.860

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Parana Technologies

USA . 776 parts In-Stock

1+ parts

$30.582

100+ parts

-

1k+ parts

$69.180

10k+ parts

-

776

$30.582

-

$69.180

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DigiPath Technology Company

USA . 1,350 parts In-Stock

1+ parts

$33.675

100+ parts

-

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1,350

$33.675

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ChromeModa Solutions

Germany . 1,774 parts In-Stock

1+ parts

$34.362

100+ parts

$28.177

1k+ parts

-

10k+ parts

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1,774

$34.362

$28.177

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IDEA Electronic Components Group

UK . 34 parts In-Stock

1+ parts

$34.362

100+ parts

$32.644

1k+ parts

$30.926

10k+ parts

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34

$34.362

$32.644

$30.926

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Perfect Parts

USA . 3,584 parts In-Stock

1+ parts

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100+ parts

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3,584

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GreenTree Electronics

Israel . 1,600 parts In-Stock

1+ parts

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1,600

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Authorized Procurement Solutions

USA . 1,600 parts In-Stock

1+ parts

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1,600

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Microchip USA

USA . 956 parts In-Stock

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956

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Overview

Unlock the power of cutting-edge technology with the TMS320C6748EZCE4 by Texas Instruments. This Digital Signal Processor is designed to deliver unparalleled performance and reliability, making it the ideal choice for a wide range of applications. From audio processing to industrial automation, this product offers exceptional value and benefits to customers looking to stay ahead of the curve. Trust in Texas Instruments' reputation for quality and innovation, and experience the advantages that the TMS320C6748EZCE4 can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation on PCBs, saving time and effort.

Maximum Supply Voltage: 1.05 V

This allows for efficient power consumption and ensures the device operates within safe voltage limits.

Address Bus Width: 14

A wider address bus allows the processor to access more memory locations, improving performance and versatility.

Package Shape: SQUARE

The square shape makes it easier to align and place on the PCB for assembly.

No. of Terminals: 361

Having a large number of terminals allows for more connections and functionality in the device.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density and reliability, making it suitable for compact electronic designs.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for flexibility in power input and can help extend battery life.

Maximum Operating Temperature: 90 °C

The high operating temperature range ensures the device can function in a variety of environments without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance even in cold conditions.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB layout and integration in the system.

Maximum Seated Height: 1.3 mm

Low seated height enables a slim design and saves space in electronic devices.

Width: 13 mm

Compact width makes the product suitable for small form factor designs.

Boundary Scan: YES

Boundary scan capability enhances testability and fault diagnosis during production and maintenance.

External Data Bus Width: 16

A wider external data bus allows for faster data transfer and processing capabilities.

Maximum Clock Frequency: 30 MHz

High clock frequency enables fast processing and execution of tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time reduces the risk of heat damage to the component during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and component reliability.

Internal Bus Architecture: MULTIPLE

Having multiple internal buses allows for parallel processing and efficient data transfer within the device.

Length: 13 mm

Compact length makes the product suitable for small electronic designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The device is designed specifically for signal processing tasks, ensuring optimal performance in such applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminals provide reliable connections and are suitable for surface mount applications.

Nominal Supply Voltage: 1 V

The nominal supply voltage ensures stable operation and performance of the device.

Terminal Pitch: 0.65 mm

Small terminal pitch allows for high-density packaging and miniaturization of the device.

Format: FIXED POINT

Fixed-point format simplifies processing and enhances accuracy in mathematical operations.

Moisture Sensitivity Level (MSL): 3

MSL rating of 3 indicates the device can withstand standard moisture exposure levels in production and storage environments.

Low Power Mode: YES

Low power mode offers energy-saving features for extended battery life and efficient power management.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6748EZCE4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

1.2V ,1.1V AND 1.3 VOLT NOMINAL FREQUENCY ALSO AVAILABLE

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320C6748EZCE4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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