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TMS320C6747CZKBA3

Texas Instruments

TMS320C6747CZKBA3 by Texas Instruments

TMS320C6747CZKBA3 by Texas Instruments is a 32-bit DSP with 13-bit address bus, 16-bit external data bus, and max clock frequency of 50 MHz. Ideal for industrial applications requiring high-speed signal processing in a compact package. Features low power mode and boundary scan for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,260 parts In-Stock

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5,260

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Digiode

USA . 960 parts In-Stock

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960

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Distributors (Availability)

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AZTECH Wire

Italy . 550 parts In-Stock

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$13.857

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550

$13.857

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One Stop Electronics

USA . 779 parts In-Stock

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$25.000

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779

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Corohmni

South Africa . 1,066 parts In-Stock

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$42.543

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$42.543

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Parana Technologies

USA . 1,099 parts In-Stock

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$45.206

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1,099

$45.206

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ChromeModa Solutions

Germany . 3,679 parts In-Stock

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$50.793

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$41.650

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3,679

$50.793

$41.650

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IDEA Electronic Components Group

UK . 2,349 parts In-Stock

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$50.793

100+ parts

$48.253

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$45.714

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2,349

$50.793

$48.253

$45.714

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Corphita

USA . 1,407 parts In-Stock

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DigiPath Technology Company

USA . 1,038 parts In-Stock

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$45.795

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Microchip USA

USA . 323 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments TMS320C6747CZKBA3 Digital Signal Processor. Crafted by a trusted industry leader, this high-quality DSP offers unparalleled performance and reliability for a wide range of applications. From audio processing to telecommunications, this versatile processor delivers exceptional value, efficiency, and speed. Experience seamless integration and superior results with the TMS320C6747CZKBA3, setting a new standard in digital signal processing. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power requirements.

Address Bus Width: 13

A wider address bus allows for efficient data management and processing capabilities.

Package Shape: SQUARE

Square package shape is space-efficient and enables easy integration into compact electronic devices.

Bit Size: 32

With a 32-bit architecture, this DSP can handle complex calculations and processing tasks effectively.

Power Supplies (V): 1.2, 1.8, 3.3

Multiple power supply options provide flexibility and compatibility with various system requirements.

No. of Terminals: 256

A high number of terminals allow for versatile connectivity options and efficient data transfer.

RAM Words: 8192

A large RAM capacity enables the DSP to store and process a significant amount of data efficiently.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast data processing and response times, suitable for real-time applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6747CZKBA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6747CZKBA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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