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TMS320C6747BZKB4

Texas Instruments

TMS320C6747BZKB4 by Texas Instruments

TMS320C6747BZKB4 by Texas Instruments is a 32-bit DSP with 16-bit address and data bus width, operating at max 30 MHz. It features low power mode, floating-point format, and boundary scan support. Ideal for digital signal processing applications requiring high-speed computation in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,962 parts In-Stock

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Digiode

USA . 670 parts In-Stock

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670

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Speed Components Ltd

Israel . 6 parts In-Stock

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6

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Distributors (Availability)

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AZTECH Wire

Italy . 232 parts In-Stock

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$6.085

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One Stop Electronics

USA . 473 parts In-Stock

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$21.000

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$21.000

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Parana Technologies

USA . 355 parts In-Stock

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$34.847

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ChromeModa Solutions

Germany . 2,242 parts In-Stock

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$39.154

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$32.106

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$32.106

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IDEA Electronic Components Group

UK . 166 parts In-Stock

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$39.154

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$37.196

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$35.239

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166

$39.154

$37.196

$35.239

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Corohmni

South Africa . 3,112 parts In-Stock

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$59.870

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Corphita

USA . 1,859 parts In-Stock

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DigiPath Technology Company

USA . 1,001 parts In-Stock

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$35.301

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Microchip USA

USA . 234 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS320C6747BZKB4 by Texas Instruments, a top-tier manufacturer renowned for innovation and quality. This Digital Signal Processor (DSP) offers unparalleled performance and efficiency, making it ideal for a wide range of applications. From audio processing to telecommunications, this versatile product delivers exceptional value, benefits, and advantages to customers seeking reliable solutions for their projects. Elevate your designs with the TMS320C6747BZKB4 and experience the difference that superior technology can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and facilitating automated assembly.

Maximum Supply Voltage: 1.35 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat generation, contributing to energy efficiency.

Address Bus Width: 16

With a 16-bit address bus width, the DSP can access a large memory space efficiently, enabling high-speed data processing.

Bit Size: 32

The 32-bit processing capability allows for handling complex calculations and data manipulation with precision and speed.

Power Supplies (V): 1.3, 1.8, 3.3

Support for multiple power supply voltages offers flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 256

Having 256 terminals enhances connectivity options and allows for interfacing with multiple external devices and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates a high-density layout, enabling efficient use of board space and enhancing signal integrity.

Minimum Supply Voltage: 1.25 V

Operating at a low minimum supply voltage ensures reliable performance even under low-power conditions, extending battery life in portable devices.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the DSP can function in harsh environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliable performance in various thermal environments, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability, ensuring robust electrical connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making the installation process more efficient and reliable.

Maximum Seated Height: 2.05 mm

The compact maximum seated height allows for a low-profile design, ideal for space-constrained applications and slim devices.

RAM Words: 8192

With 8192 RAM words, the DSP can efficiently store and process data, enhancing real-time computational capabilities and overall performance.

Width: 17 mm

The 17mm width of the DSP module enables compact integration into electronic systems, saving valuable board space and facilitating component layout.

Boundary Scan: YES

Boundary scan support enables easy testing and debugging of the DSP module, ensuring high product quality and reliability.

External Data Bus Width: 16

With a 16-bit external data bus width, the DSP can efficiently exchange data with external devices and peripherals, enhancing system performance.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30 MHz allows for fast data processing and high-speed computation, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reflow processes during assembly, enhancing product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable solder joint formation, ensuring robust connections even in demanding operating conditions.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architectures enhances data throughput and efficiency, enabling parallel processing and optimizing performance.

Length: 17 mm

The 17mm length of the DSP module contributes to a compact form factor, making it suitable for space-limited applications and integration into small devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of a digital signal processor and other peripheral IC types offers a versatile solution for various signal processing and control applications.

Technology: CMOS

Operating on CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems, enhancing overall performance.

Terminal Form: BALL

The ball terminal form factor simplifies soldering and installation, improving manufacturing efficiency and ensuring reliable electrical connections.

Nominal Supply Voltage: 1.3 V

Having a nominal supply voltage of 1.3V ensures stable and efficient operation, meeting the power requirements of modern digital systems.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for precise and compact soldering, facilitating a high-density PCB layout and improving signal integrity.

Format: FLOATING POINT

Supporting floating-point format enhances the DSP's ability to handle complex mathematical calculations and advanced signal processing tasks with accuracy and efficiency.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the DSP can withstand moderate moisture exposure during storage and assembly, ensuring reliability in varied environmental conditions.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in energy-efficient modes when idle or under light loads, conserving power and extending battery life.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6747BZKB4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6747BZKB4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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