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TMS320C6746EZCED4

Texas Instruments

TMS320C6746EZCED4 by Texas Instruments

TMS320C6746EZCED4 by Texas Instruments is a DSP with 30MHz clock, 327680 RAM words, and 80 DMA channels. Ideal for industrial applications requiring low power mode, it features a single internal bus architecture and floating-point format for high-performance signal processing tasks.

Median Price

$20.890

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$20.890

100+ parts

$14.130

1k+ parts

$13.970

10k+ parts

-

6

$20.890

$14.130

$13.970

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,482 parts In-Stock

1+ parts

$17.309

100+ parts

-

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3,482

$17.309

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Vyrian

USA . 3,114 parts In-Stock

1+ parts

$18.220

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-

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-

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3,114

$18.220

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-

-

Chip Stock

USA . 1,094 parts In-Stock

1+ parts

-

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1,094

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ACDS - Activité Composants Distribution Service

France . 61 parts In-Stock

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-

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61

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,430 parts In-Stock

1+ parts

$15.730

100+ parts

-

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-

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2,430

$15.730

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Corphita

USA . 1,729 parts In-Stock

1+ parts

$16.398

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1,729

$16.398

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Microchip USA

USA . 2,390 parts In-Stock

1+ parts

$41.170

100+ parts

$40.580

1k+ parts

$40.280

10k+ parts

$39.990

2,390

$41.170

$40.580

$40.280

$39.990

Parana Technologies

USA . 76 parts In-Stock

1+ parts

$42.592

100+ parts

-

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-

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76

$42.592

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DigiPath Technology Company

USA . 721 parts In-Stock

1+ parts

$46.899

100+ parts

$43.147

1k+ parts

-

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721

$46.899

$43.147

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ChromeModa Solutions

Germany . 5,104 parts In-Stock

1+ parts

$47.856

100+ parts

$39.242

1k+ parts

-

10k+ parts

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5,104

$47.856

$39.242

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IDEA Electronic Components Group

UK . 1,427 parts In-Stock

1+ parts

$47.856

100+ parts

$45.463

1k+ parts

$43.070

10k+ parts

-

1,427

$47.856

$45.463

$43.070

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Lixinc

USA . 2,583 parts In-Stock

1+ parts

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2,583

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Authorized Procurement Solutions

USA . 161 parts In-Stock

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161

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Overview

Unlock the power of cutting-edge technology with the TMS320C6746EZCED4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that are essential for a range of applications. With integrated cache and low power mode, this product offers unparalleled value and benefits to customers looking for high-performance solutions. Experience seamless operation and superior efficiency with the TMS320C6746EZCED4, setting new standards in digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Integrated Cache: YES

Enhances the performance by storing frequently used data for quick access.

Maximum Supply Voltage: 1.05 V

Provides appropriate power supply for the processor to function efficiently.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and reducing assembly time.

RAM Words: 327680

Large RAM capacity for handling extensive data processing tasks smoothly.

Maximum Clock Frequency: 30 MHz

Capable of high-speed operations for quick signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6746EZCED4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPEARTES AT 1.1V, 1.2V AND 1.3V SUPLLY

Address Bus Width:

23

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

No. of Timers:

8

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

327680

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320C6746EZCED4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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