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TMS320C6745CPTPA3

Texas Instruments

TMS320C6745CPTPA3 by Texas Instruments

TMS320C6745CPTPA3 by Texas Instruments is a 32-bit DSP with 13-bit address bus, operating at max 50 MHz. Ideal for industrial applications, it features low power mode, floating point format, and boundary scan capability. With a package style of flatpack and quad terminal position, it offers high performance in digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,644 parts In-Stock

1+ parts

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4,644

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Vyrian

USA . 2,380 parts In-Stock

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2,380

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 586 parts In-Stock

1+ parts

$6.000

100+ parts

-

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586

$6.000

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AZTECH Wire

Italy . 511 parts In-Stock

1+ parts

$19.050

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-

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511

$19.050

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Corohmni

South Africa . 1,139 parts In-Stock

1+ parts

$61.004

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1,139

$61.004

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Parana Technologies

USA . 695 parts In-Stock

1+ parts

$61.228

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695

$61.228

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DigiPath Technology Company

USA . 354 parts In-Stock

1+ parts

$67.419

100+ parts

$62.026

1k+ parts

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354

$67.419

$62.026

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ChromeModa Solutions

Germany . 5,586 parts In-Stock

1+ parts

$68.795

100+ parts

$56.412

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5,586

$68.795

$56.412

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IDEA Electronic Components Group

UK . 80 parts In-Stock

1+ parts

$68.795

100+ parts

$65.355

1k+ parts

$61.916

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80

$68.795

$65.355

$61.916

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Corphita

USA . 3,341 parts In-Stock

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3,341

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Microchip USA

USA . 350 parts In-Stock

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350

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Overview

Experience the power of advanced signal processing with the TMS320C6745CPTPA3 by Texas Instruments. Renowned for their top-quality products, Texas Instruments delivers cutting-edge technology in the form of digital signal processors. Designed for a wide range of applications, this DSP offers unparalleled performance and efficiency. With multiple power supplies, versatile package styles, and low power mode capabilities, this product ensures superior functionality and reliability. Take your projects to the next level with the TMS320C6745CPTPA3 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides a lightweight and durable housing for the DSP, making it suitable for portable electronic devices.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, reducing assembly time and saving space in the design.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wider range of systems.

Address Bus Width: 13

Wider address bus width enables the DSP to access a larger memory space, enhancing its processing capabilities for complex algorithms.

Bit Size: 32

32-bit architecture provides high processing power and precision for handling digital signal processing tasks efficiently.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6745CPTPA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

176

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6745CPTPA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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