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TMS320C6745BPTPA3

Texas Instruments

TMS320C6745BPTPA3 by Texas Instruments

TMS320C6745BPTPA3 by Texas Instruments is a 32-bit DSP with 16-bit address and data bus width, operating at up to 30 MHz. It features low power mode, boundary scan, and internal multiple bus architecture. Ideal for industrial applications requiring high-speed signal processing in compact designs.

Median Price

$17.305

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 154 parts In-Stock

1+ parts

-

100+ parts

$16.060

1k+ parts

$14.370

10k+ parts

$13.530

154

-

$16.060

$14.370

$13.530

DigiKey

USA . 154 parts In-Stock

1+ parts

-

100+ parts

$18.550

1k+ parts

-

10k+ parts

-

154

-

$18.550

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 238 parts In-Stock

1+ parts

$16.948

100+ parts

-

1k+ parts

-

10k+ parts

-

238

$16.948

-

-

-

Vyrian

USA . 5,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,393

-

-

-

-

DigiKey Marketplace

USA . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

168

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,248 parts In-Stock

1+ parts

$16.056

100+ parts

-

1k+ parts

-

10k+ parts

-

2,248

$16.056

-

-

-

Parana Technologies

USA . 224 parts In-Stock

1+ parts

$42.050

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$42.050

-

-

-

Corohmni

South Africa . 877 parts In-Stock

1+ parts

$46.624

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$46.624

-

-

-

IDEA Electronic Components Group

UK . 1,710 parts In-Stock

1+ parts

$47.247

100+ parts

$44.885

1k+ parts

$42.522

10k+ parts

-

1,710

$47.247

$44.885

$42.522

-

ChromeModa Solutions

Germany . 1,166 parts In-Stock

1+ parts

$47.247

100+ parts

$38.743

1k+ parts

-

10k+ parts

-

1,166

$47.247

$38.743

-

-

A-Z Elektronik GmbH

Germany . 6,948 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,948

-

-

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DigiPath Technology Company

USA . 1,947 parts In-Stock

1+ parts

-

100+ parts

$42.598

1k+ parts

-

10k+ parts

-

1,947

-

$42.598

-

-

Microchip USA

USA . 315 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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315

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Overview

Unleash the power of cutting-edge technology with the TMS320C6745BPTPA3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that redefine possibilities. The TMS320C6745BPTPA3 offers unparalleled performance and reliability, making it ideal for a wide range of applications. Experience seamless operation, enhanced efficiency, and unbeatable value with this innovative product. Elevate your projects to new heights with the TMS320C6745BPTPA3 and discover the limitless potential it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the DSP a portable and affordable option.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.32 V

Operates efficiently within a safe voltage range to prevent damage and ensure stable performance.

Address Bus Width: 16

Wide address bus allows for efficient communication and data transfer between memory and processing units.

Package Shape: SQUARE

Square shape provides a compact design, maximizing space utilization on the PCB.

Bit Size: 32

32-bit processing capability enables high-speed computational performance and precision in signal processing tasks.

Power Supplies (V): 1.2, 1.8, 3.3

Supports multiple power supply options for flexibility in design and compatibility with various voltage systems.

No. of Terminals: 176

Sufficient number of terminals for interfacing with external components and peripherals, enhancing connectivity options.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Various package styles offer versatility in mounting and heat dissipation solutions to meet different application requirements.

Minimum Supply Voltage: 1.14 V

Even lower voltage support allows for energy-efficient operation and optimization of power consumption.

Maximum Operating Temperature: 105 °C

Operates reliably at high temperatures, suitable for industrial environments and applications with heat exposure.

Minimum Operating Temperature: -40 °C

Maintains functionality in low-temperature conditions, ensuring reliable performance in a wide range of operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and excellent conductivity for long-term reliability and signal integrity.

Terminal Position: QUAD

Quad terminal layout facilitates easy connection to other components and PCBs, enhancing ease of installation and maintenance.

Maximum Seated Height: 1.6 mm

Low profile design minimizes space requirements and allows for compact integration in space-constrained applications.

RAM Words: 8192

Sufficient memory capacity for storing and processing data, supporting complex algorithms and signal processing tasks.

Width: 24 mm

Compact width dimension for space-efficient PCB layout and system integration.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during production and maintenance.

External Data Bus Width: 16

Wide external data bus allows for high-speed data transfer and efficient communication with external devices.

Maximum Clock Frequency: 30 MHz

High clock frequency supports fast data processing and real-time signal analysis for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures safe and reliable soldering during manufacturing processes, preventing overheating and component damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust soldering and secure connection on PCBs.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput efficiency and parallel processing capabilities for complex signal processing tasks.

Length: 24 mm

Compact length dimension for space-efficient PCB layout and system integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions and extended usage scenarios.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports various digital signal processing applications and additional functions for system integration.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation for efficient signal processing and data manipulation tasks.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical connection and facilitates easy soldering during PCB assembly.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for consistent performance and operational reliability within specified voltage range.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and space-saving design on PCBs.

Format: FLOATING POINT

Floating-point format enables precise arithmetic calculations and complex signal processing algorithms with enhanced accuracy.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent component damage.

Low Power Mode: YES

Low power mode option for energy-efficient operation and extended battery life in portable and power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6745BPTPA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

176

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6745BPTPA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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