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TMS320C6727BZDH250

Texas Instruments

TMS320C6727BZDH250 by Texas Instruments

TMS320C6727BZDH250 by Texas Instruments is a 32-bit DSP with 13-bit address bus, operating at max 25 MHz. Ideal for digital signal processing applications, it features a package style of grid array and fine pitch, with terminal finish in tin silver copper.

Median Price

$31.458

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 891 parts In-Stock

1+ parts

$31.458

100+ parts

$27.963

1k+ parts

$20.561

10k+ parts

-

891

$31.458

$27.963

$20.561

-

Rochester

USA . 1,175 parts In-Stock

1+ parts

-

100+ parts

$29.550

1k+ parts

$26.440

10k+ parts

$24.890

1,175

-

$29.550

$26.440

$24.890

DigiKey

USA . 1,175 parts In-Stock

1+ parts

-

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1k+ parts

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1,175

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Verical

USA . 844 parts In-Stock

1+ parts

-

100+ parts

$36.938

1k+ parts

$33.050

10k+ parts

$31.113

844

-

$36.938

$33.050

$31.113

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 319 parts In-Stock

1+ parts

$27.132

100+ parts

-

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319

$27.132

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Vyrian

USA . 3,128 parts In-Stock

1+ parts

$28.560

100+ parts

-

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3,128

$28.560

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DigiKey Marketplace

USA . 1,175 parts In-Stock

1+ parts

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1,175

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 915 parts In-Stock

1+ parts

$24.280

100+ parts

-

1k+ parts

-

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915

$24.280

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-

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Corphita

USA . 493 parts In-Stock

1+ parts

$25.704

100+ parts

-

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493

$25.704

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-

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Corohmni

South Africa . 4,952 parts In-Stock

1+ parts

$27.122

100+ parts

-

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4,952

$27.122

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Parana Technologies

USA . 1,793 parts In-Stock

1+ parts

$33.815

100+ parts

-

1k+ parts

$135.214

10k+ parts

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1,793

$33.815

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$135.214

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DigiPath Technology Company

USA . 1,177 parts In-Stock

1+ parts

$37.234

100+ parts

$34.255

1k+ parts

-

10k+ parts

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1,177

$37.234

$34.255

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ChromeModa Solutions

Germany . 4,005 parts In-Stock

1+ parts

$37.994

100+ parts

$31.155

1k+ parts

-

10k+ parts

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4,005

$37.994

$31.155

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IDEA Electronic Components Group

UK . 567 parts In-Stock

1+ parts

$37.994

100+ parts

$36.094

1k+ parts

$34.195

10k+ parts

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567

$37.994

$36.094

$34.195

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Lixinc

USA . 8,451 parts In-Stock

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8,451

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 266 parts In-Stock

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266

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Perfect Parts

USA . 101 parts In-Stock

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101

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Overview

Unlock the power of cutting-edge technology with the TMS320C6727BZDH250 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability in every product. Ideal for a wide range of applications, this DSP offers customers exceptional value, benefits, and advantages. Experience seamless performance and innovation with the TMS320C6727BZDH250, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, making it suitable for various environmental conditions.

Surface Mount: YES

Ease of integration and compact design for efficient PCB layout.

Maximum Supply Voltage: 1.32 V

Allows for higher performance and flexibility in power management.

Address Bus Width: 13

Sufficient address bus width for handling complex signal processing tasks efficiently.

Package Shape: SQUARE

Space-saving design for efficient use of PCB real estate.

No. of Terminals: 256

Sufficient terminals for connectivity and functionality requirements.

Package Style (Meter): GRID ARRAY, FINE PITCH

High-density packaging for more computing power in a smaller form factor.

Minimum Supply Voltage: 1.14 V

Allows for lower power consumption and extended battery life in portable devices.

Maximum Operating Temperature: 90 °C

Wide operating temperature range for versatile applications.

Minimum Operating Temperature: 0 °C

Can operate in cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

Provides reliable electrical connections and corrosion resistance.

Terminal Position: BOTTOM

Facilitates easy soldering and PCB mounting.

Maximum Seated Height: 2.02 mm

Low-profile design for space-constrained applications.

Width: 17 mm

Compact size for versatile placement within electronic devices.

Boundary Scan: YES

Ease of testing and debugging during development and production.

External Data Bus Width: 32

Wide data bus for high-speed data processing and transfer.

Maximum Clock Frequency: 25 MHz

Allows for fast signal processing and real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized reflow process for reliable solder joints and component longevity.

Peak Reflow Temperature °C: 260

High reflow temperature capability for lead-free soldering processes.

Internal Bus Architecture: MULTIPLE

Efficient data flow and parallel processing capabilities for enhanced performance.

Length: 17 mm

Symmetrical design for uniform heat dissipation and component layout.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated DSP functionality for specialized signal processing tasks.

Technology: CMOS

Low power consumption and high speed operation for energy-efficient applications.

Terminal Form: BALL

Enables reliable solder connections and easy rework.

Nominal Supply Voltage: 1.2 V

Standard voltage level for compatibility with various power sources.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density interconnections.

Format: FIXED POINT

Suitable for applications that do not require floating-point calculations.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for standard handling and storage practices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6727BZDH250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.02 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6727BZDH250 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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