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TMS320C6727BGDH300

Texas Instruments

TMS320C6727BGDH300 by Texas Instruments

TMS320C6727BGDH300 by Texas Instruments is a 32-bit DSP with integrated cache, 262144 RAM words, and 25 MHz clock frequency. Ideal for digital signal processing applications requiring high-speed data processing and multiple DMA channels.

Median Price

$34.198

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,720 parts In-Stock

1+ parts

$31.458

100+ parts

$27.963

1k+ parts

$20.561

10k+ parts

-

1,720

$31.458

$27.963

$20.561

-

Mouser Electronics

USA . 28 parts In-Stock

1+ parts

$46.630

100+ parts

$33.830

1k+ parts

-

10k+ parts

-

28

$46.630

$33.830

-

-

Rochester

USA . 612 parts In-Stock

1+ parts

-

100+ parts

$29.550

1k+ parts

$26.440

10k+ parts

$24.890

612

-

$29.550

$26.440

$24.890

DigiKey

USA . 612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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612

-

-

-

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Verical

USA . 139 parts In-Stock

1+ parts

-

100+ parts

$36.938

1k+ parts

$33.050

10k+ parts

$31.113

139

-

$36.938

$33.050

$31.113

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 810 parts In-Stock

1+ parts

$26.938

100+ parts

$22.795

1k+ parts

$22.089

10k+ parts

-

810

$26.938

$22.795

$22.089

-

Digiode

USA . 2,792 parts In-Stock

1+ parts

$27.132

100+ parts

-

1k+ parts

-

10k+ parts

-

2,792

$27.132

-

-

-

Vyrian

USA . 4,246 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

4,246

-

-

-

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Dan-Mar Components

USA . 810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

810

-

-

-

-

DigiKey Marketplace

USA . 612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

612

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 401 parts In-Stock

1+ parts

$24.280

100+ parts

-

1k+ parts

-

10k+ parts

-

401

$24.280

-

-

-

Corphita

USA . 4,328 parts In-Stock

1+ parts

$25.704

100+ parts

-

1k+ parts

-

10k+ parts

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4,328

$25.704

-

-

-

Component Stockers USA

USA . 893 parts In-Stock

1+ parts

$26.740

100+ parts

$25.130

1k+ parts

-

10k+ parts

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893

$26.740

$25.130

-

-

Corohmni

South Africa . 913 parts In-Stock

1+ parts

$29.900

100+ parts

-

1k+ parts

-

10k+ parts

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913

$29.900

-

-

-

Microchip USA

USA . 1,369 parts In-Stock

1+ parts

$68.310

100+ parts

$67.120

1k+ parts

$66.530

10k+ parts

$65.930

1,369

$68.310

$67.120

$66.530

$65.930

Parana Technologies

USA . 451 parts In-Stock

1+ parts

$75.556

100+ parts

$7,016.489

1k+ parts

$68.000

10k+ parts

-

451

$75.556

$7,016.489

$68.000

-

DigiPath Technology Company

USA . 1,080 parts In-Stock

1+ parts

$83.196

100+ parts

-

1k+ parts

-

10k+ parts

-

1,080

$83.196

-

-

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ChromeModa Solutions

Germany . 6,921 parts In-Stock

1+ parts

$84.894

100+ parts

$69.613

1k+ parts

-

10k+ parts

-

6,921

$84.894

$69.613

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-

IDEA Electronic Components Group

UK . 43 parts In-Stock

1+ parts

$84.894

100+ parts

$80.649

1k+ parts

$76.405

10k+ parts

-

43

$84.894

$80.649

$76.405

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,000

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Overview

Unlock the power of cutting-edge technology with the TMS320C6727BGDH300 by Texas Instruments. Designed to deliver unparalleled performance, this Digital Signal Processor (DSP) is a game-changer in the world of integrated circuits. With its innovative features and advanced capabilities, it offers a wide range of applications in various industries. From faster processing speeds to efficient power consumption, this product provides value, benefits, and advantages that exceed expectations. Elevate your projects to new heights with the TMS320C6727BGDH300 and experience the difference that superior quality and reliability can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Integrated Cache: YES

Integrated cache helps improve processing speed by storing frequently accessed data, reducing the need to fetch data from external memory.

Maximum Supply Voltage: 1.32 V

Operating within a maximum supply voltage of 1.32 V helps in energy efficiency and prevents damage to the components due to overvoltage.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width of 8 allows for faster data processing and manipulation within the DSP.

Package Shape: SQUARE

Square package shape provides efficient use of space and makes it easier to integrate the DSP into various electronic devices.

Bit Size: 32

32-bit processing capability enables handling of larger data sets and complex algorithms, improving the overall performance of the DSP.

Power Supplies (V): 1.2,3.3

Having multiple power supply options allows flexibility in designing and powering the DSP in different applications.

RAM Words: 262144

A large RAM size of 262144 words enables storage of a significant amount of data, facilitating complex calculations and processing tasks.

Maximum Clock Frequency: 25 MHz

Operating at a maximum clock frequency of 25 MHz ensures high-speed data processing and efficient execution of algorithms in real-time applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various electronic systems, making the DSP energy-efficient and versatile.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6727BGDH300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Length:

17 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of Terminals:

256

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

MROM

Maximum Seated Height:

2.02 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6727BGDH300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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