Loading...

TMS320C6678XCYPA

Texas Instruments

TMS320C6678XCYPA by Texas Instruments

TMS320C6678XCYPA by Texas Instruments is a 32-bit DSP with 24-bit address bus width, 16-bit external data bus width, and max clock frequency of 312.5 MHz. It is used in industrial applications requiring high processing power and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,576 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,576

-

-

-

-

Digiode

USA . 1,857 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,857

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 519 parts In-Stock

1+ parts

$7.670

100+ parts

-

1k+ parts

-

10k+ parts

-

519

$7.670

-

-

-

One Stop Electronics

USA . 1,480 parts In-Stock

1+ parts

$30.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,480

$30.000

-

-

-

Corohmni

South Africa . 4,878 parts In-Stock

1+ parts

$42.062

100+ parts

-

1k+ parts

-

10k+ parts

-

4,878

$42.062

-

-

-

Parana Technologies

USA . 1,878 parts In-Stock

1+ parts

$47.250

100+ parts

-

1k+ parts

-

10k+ parts

-

1,878

$47.250

-

-

-

DigiPath Technology Company

USA . 137 parts In-Stock

1+ parts

$52.028

100+ parts

-

1k+ parts

-

10k+ parts

-

137

$52.028

-

-

-

ChromeModa Solutions

Germany . 5,107 parts In-Stock

1+ parts

$53.090

100+ parts

$43.534

1k+ parts

-

10k+ parts

-

5,107

$53.090

$43.534

-

-

IDEA Electronic Components Group

UK . 1,212 parts In-Stock

1+ parts

$53.090

100+ parts

$50.436

1k+ parts

$47.781

10k+ parts

-

1,212

$53.090

$50.436

$47.781

-

Component Stockers USA

USA . 741 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

741

$99.990

-

-

-

Microchip USA

USA . 4,913 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,913

-

-

-

-

Corphita

USA . 691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

691

-

-

-

-

Overview

Experience unparalleled performance and versatility with the TMS320C6678XCYPA by Texas Instruments, a leading manufacturer in the industry. As a cutting-edge Digital Signal Processor (DSP), this product offers a wide range of applications across various industries. With its advanced features and top-notch quality, customers can expect efficient processing, seamless integration, and reliable performance. Elevate your projects to new heights with the TMS320C6678XCYPA, unlocking endless possibilities and delivering exceptional value every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the DSP, making it suitable for a variety of applications.

Surface Mount: YES

The surface mount capability makes it easy to integrate the DSP into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures stable operation while minimizing power consumption.

Address Bus Width: 24

The 24-bit address bus width allows for efficient memory access, enhancing the overall performance of the DSP.

Package Shape: SQUARE

The square package shape offers a compact form factor, making it versatile for various system designs.

Bit Size: 32

The 32-bit bit size enables the DSP to process data efficiently and handle complex algorithms with ease.

Power Supplies (V): 1, 1.5, 1.8

The availability of multiple power supply options allows for flexibility in design and power consumption optimization.

No. of Terminals: 841

The large number of terminals provides ample connectivity options for interfacing with other components in the system.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style offers high-density mounting capability, enhancing reliability and performance in compact designs.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95 V ensures operational stability even under low power conditions.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the DSP can operate in a wide range of temperature environments.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and enhances thermal management for the DSP.

Maximum Seated Height: 3.39 mm

The maximum seated height of 3.39 mm ensures compatibility with slim profile designs and PCB layouts.

RAM Words: 8192

The 8192 RAM words provide ample memory capacity for storing data and performing computations efficiently.

Width: 24 mm

The 24 mm width offers a compact form factor, enabling the DSP to fit into space-constrained designs.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the DSP during manufacturing and maintenance.

External Data Bus Width: 16

The 16-bit external data bus width allows for high-speed data transfer between the DSP and external memory or peripherals.

Maximum Clock Frequency: 312.5 MHz

The high maximum clock frequency of 312.5 MHz enables fast processing speed and real-time data handling.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data throughput and parallel processing capabilities of the DSP.

Length: 24 mm

The 24 mm length complements the compact width and square shape, making the DSP suitable for small form factor designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The digital signal processor peripheral IC type offers versatile functionality for signal processing and data manipulation in diverse applications.

Technology: CMOS

The CMOS technology provides low power consumption and high performance, making the DSP energy-efficient and reliable for long-term use.

Terminal Form: BALL

The ball terminal form facilitates easy soldering and reliability in connecting the DSP to the PCB for robust electrical connections.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V ensures consistent and stable operation of the DSP in various power supply conditions.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch offers fine pitch spacing for compact PCB layout and high-density mounting of the DSP.

Format: FLOATING POINT

The floating-point format allows for precise numerical calculations and supports a wide range of mathematical operations in the DSP.

Low Power Mode: YES

The low power mode feature enhances energy efficiency and extends battery life in portable devices or power-constrained systems.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6678XCYPA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

312.5 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

Length:

24 mm

Low Power Mode:

YES

No. of Terminals:

841

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6678XCYPA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20