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TMS320C6657SCZH

Texas Instruments

TMS320C6657SCZH by Texas Instruments

TMS320C6657SCZH by Texas Instruments is a 32-bit DSP with integrated cache, 8-bit on-chip data RAM, and 24-bit address bus width. Ideal for digital signal processing applications, it features a grid array package style, 625 terminals, and operates b/w 0-85°C temperature range.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,305 parts In-Stock

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Digiode

USA . 1,541 parts In-Stock

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One Stop Electronics

USA . 951 parts In-Stock

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$4.000

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951

$4.000

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AZTECH Wire

Italy . 763 parts In-Stock

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$6.998

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Corohmni

South Africa . 929 parts In-Stock

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$69.925

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Parana Technologies

USA . 1,304 parts In-Stock

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$71.443

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DigiPath Technology Company

USA . 291 parts In-Stock

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$78.668

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$72.374

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$72.374

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ChromeModa Solutions

Germany . 3,653 parts In-Stock

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$80.273

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$65.824

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IDEA Electronic Components Group

UK . 450 parts In-Stock

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$80.273

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$76.259

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$72.246

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Component Stockers USA

USA . 632 parts In-Stock

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$99.990

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Corphita

USA . 2,072 parts In-Stock

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the TMS320C6657SCZH by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their products, making this digital signal processor a must-have for a wide range of applications. From high-performance audio processing to advanced image recognition, this DSP offers unparalleled value and benefits to customers seeking seamless integration and exceptional performance. Upgrade your projects with the TMS320C6657SCZH and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP against external elements, ensuring a longer lifespan for the product.

Integrated Cache: YES

The integrated cache helps in improving the processing speed and efficiency of the DSP, making it suitable for handling complex signal processing tasks.

Surface Mount: YES

Being surface mountable makes this DSP easy to install on circuit boards, saving space and providing flexibility in design options.

Address Bus Width: 24

The wide address bus width allows for efficient memory access, enabling faster data retrieval and processing in real-time applications.

Bit Size: 32

With a 32-bit architecture, this DSP can handle more complex calculations and processing tasks with higher precision, making it suitable for demanding signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption and high reliability, making this DSP energy-efficient and suitable for battery-operated devices or applications that require long-term reliability.

Low Power Mode: YES

The low power mode option allows for energy-saving operation when high processing power is not required, making it an efficient choice for applications where power consumption is a concern.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6657SCZH attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

625

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.99 mm

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

TMS320C6657SCZH Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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