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TMS320C6474FCUNA2

Texas Instruments

TMS320C6474FCUNA2 by Texas Instruments

TMS320C6474FCUNA2 by Texas Instruments is a DSP with 32-bit external data bus, 14-bit address bus, and 64 DMA channels. Ideal for industrial applications, it features multiple internal bus architecture and low power mode for efficient processing in a compact square package.

Median Price

$260.507

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 275 parts In-Stock

1+ parts

$260.507

100+ parts

$235.804

1k+ parts

$224.575

10k+ parts

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275

$260.507

$235.804

$224.575

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Distributors (In-Stock)

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Digiode

USA . 2,788 parts In-Stock

1+ parts

$247.482

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2,788

$247.482

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Vyrian

USA . 6,307 parts In-Stock

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6,307

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ACDS - Activité Composants Distribution Service

France . 16 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 876 parts In-Stock

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$21.090

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876

$21.090

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Parana Technologies

USA . 2,224 parts In-Stock

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$51.556

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2,224

$51.556

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DigiPath Technology Company

USA . 632 parts In-Stock

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$56.769

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$52.228

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632

$56.769

$52.228

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IDEA Electronic Components Group

UK . 1,888 parts In-Stock

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$57.928

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$55.032

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$52.135

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1,888

$57.928

$55.032

$52.135

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ChromeModa Solutions

Germany . 1,593 parts In-Stock

1+ parts

$57.928

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$47.501

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1,593

$57.928

$47.501

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Corohmni

South Africa . 688 parts In-Stock

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$71.107

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Corphita

USA . 1,458 parts In-Stock

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$234.456

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1,458

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Microchip USA

USA . 1,446 parts In-Stock

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$471.608

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1,446

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Overview

Experience cutting-edge technology with the TMS320C6474FCUNA2 by Texas Instruments, a leading manufacturer in digital signal processors. This high-quality product offers integrated cache, boundary scan, and low power mode, making it perfect for a wide range of applications. With its advanced internal bus architecture and 64 DMA channels, this DSP provides unmatched performance and flexibility. Trust Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations. Unlock the potential of the TMS320C6474FCUNA2 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the DSP, making it suitable for various industrial applications.

Integrated Cache: YES

Integrated cache helps improve the performance and efficiency of the DSP by reducing data access times and enhancing overall processing speed.

Surface Mount: YES

Surface mount capability allows for easy installation and integration of the DSP onto circuit boards, saving space and simplifying manufacturing processes.

Address Bus Width: 14

With a wider address bus width, the DSP can handle larger amounts of memory and data, enabling more complex signal processing tasks.

No. of Terminals: 561

Having a high number of terminals allows for versatile connectivity options and interfaces, making the DSP suitable for diverse system configurations.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature tolerance ensures reliability and stability of the DSP even in harsh industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range makes the DSP suitable for use in cold environments or applications where temperature fluctuations are common.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Maximum Seated Height: 3.3 mm

The low maximum seated height enables the DSP to be used in compact designs and applications where space constraints are a concern.

Width: 23 mm

The compact width of the DSP allows for easy integration into smaller electronic devices or systems, saving valuable space in the overall design.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the DSP during production and maintenance, ensuring efficient operation and troubleshooting.

External Data Bus Width: 32

The wide external data bus width of 32 bits enables fast and efficient data transfer between the DSP and external devices, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps prevent damage to the DSP during soldering processes, ensuring product quality and reliability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance of 245°C allows for reliable soldering of the DSP onto circuit boards without compromising its performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing speed and efficiency, enabling the DSP to handle complex computations and algorithms effectively.

Length: 23 mm

The compact length of the DSP makes it suitable for integration into small form factor devices or systems, maximizing design flexibility and space utilization.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures that the DSP can operate reliably in rugged industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with other peripheral IC types, the DSP offers versatile signal processing capabilities and compatibility with various external devices and systems.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and reliable performance, making the DSP energy-efficient and suitable for battery-powered applications.

Terminal Form: BALL

The ball terminal form ensures secure connections and reliable contact with the PCB, enhancing the overall stability and performance of the DSP in electronic systems.

No. of DMA Channels: 64

Having 64 DMA channels allows for efficient data transfer and communication between the DSP and external peripherals, improving overall system throughput and performance.

ROM Programmability: MROM

MROM programmability enables the DSP to store and execute programs and algorithms with high reliability and security, ensuring consistent performance without the risk of data loss.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for dense packaging and efficient use of space on the PCB, making the DSP suitable for compact designs and miniaturized electronic devices.

Format: FIXED POINT

Fixed-point format provides accurate and precise calculations for signal processing tasks, making the DSP ideal for applications that require high computational accuracy and efficiency.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the DSP is resistant to moisture-related damage during handling, storage, and assembly processes, ensuring long-term reliability and performance.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state, conserving energy and extending battery life in portable or embedded applications.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM allows the DSP to store and execute programs with high efficiency and reliability, ensuring consistent performance in signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6474FCUNA2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

0.9-1.2V CORE NOMINAL VALUE AVAILABLE

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B561

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

561

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

ROM Programmability:

MROM

Maximum Seated Height:

3.3 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6474FCUNA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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