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TMS320C6472ECTZA6

Texas Instruments

TMS320C6472ECTZA6 by Texas Instruments

TMS320C6472ECTZA6 by Texas Instruments is a 32-bit DSP with 737 terminals, operating at max 50 MHz. It features integrated cache, 8-bit data RAM width, and 32-bit external data bus width. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$230.239

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 949 parts In-Stock

1+ parts

$229.588

100+ parts

$207.817

1k+ parts

$197.921

10k+ parts

-

949

$229.588

$207.817

$197.921

-

Rochester

USA . 147 parts In-Stock

1+ parts

$230.890

100+ parts

$226.290

1k+ parts

$221.670

10k+ parts

-

147

$230.890

$226.290

$221.670

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,773 parts In-Stock

1+ parts

$218.109

100+ parts

-

1k+ parts

-

10k+ parts

-

1,773

$218.109

-

-

-

Vyrian

USA . 2,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,478

-

-

-

-

Chip Stock

USA . 390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

390

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 2,087 parts In-Stock

1+ parts

$12.110

100+ parts

-

1k+ parts

-

10k+ parts

-

2,087

$12.110

-

-

-

Parana Technologies

USA . 2,251 parts In-Stock

1+ parts

$16.270

100+ parts

-

1k+ parts

$16.578

10k+ parts

-

2,251

$16.270

-

$16.578

-

DigiPath Technology Company

USA . 1,568 parts In-Stock

1+ parts

$17.915

100+ parts

$16.482

1k+ parts

-

10k+ parts

-

1,568

$17.915

$16.482

-

-

ChromeModa Solutions

Germany . 4,400 parts In-Stock

1+ parts

$18.281

100+ parts

$14.990

1k+ parts

-

10k+ parts

-

4,400

$18.281

$14.990

-

-

IDEA Electronic Components Group

UK . 1,166 parts In-Stock

1+ parts

$18.281

100+ parts

$17.367

1k+ parts

$16.453

10k+ parts

-

1,166

$18.281

$17.367

$16.453

-

AZTECH Wire

Italy . 1,174 parts In-Stock

1+ parts

$22.180

100+ parts

-

1k+ parts

-

10k+ parts

-

1,174

$22.180

-

-

-

Corohmni

South Africa . 178 parts In-Stock

1+ parts

$60.209

100+ parts

-

1k+ parts

-

10k+ parts

-

178

$60.209

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$63.784

100+ parts

$58.043

1k+ parts

$52.303

10k+ parts

-

2,500

$63.784

$58.043

$52.303

-

Corphita

USA . 4,976 parts In-Stock

1+ parts

$206.629

100+ parts

-

1k+ parts

-

10k+ parts

-

4,976

$206.629

-

-

-

Microchip USA

USA . 1,233 parts In-Stock

1+ parts

$271.180

100+ parts

$263.950

1k+ parts

$260.340

10k+ parts

$256.720

1,233

$271.180

$263.950

$260.340

$256.720

Overview

Experience the power of cutting-edge technology with the TMS320C6472ECTZA6 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors like no other. With integrated cache, a wide range of power supplies, and a multitude of terminals, this DSP is versatile and reliable for a variety of applications. Whether you're working on audio processing, telecommunications, or industrial automation, this product offers unmatched value and benefits to meet all your needs. Upgrade your projects with the TMS320C6472ECTZA6 and unleash its full potential today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable for easy handling and long-term reliability.

Integrated Cache: YES

Having integrated cache helps in improving the processing speed and efficiency of the DSP, making it suitable for handling complex algorithms and calculations.

Maximum Supply Voltage: 1.16 V

Operating at a maximum supply voltage of 1.16 V ensures low power consumption and efficient performance of the DSP.

On Chip Data RAM Width: 8

A wider data RAM width of 8 allows for faster data processing and efficient storage of information within the DSP.

Address Bus Width: 14

With a wider address bus width of 14, the DSP can access a larger memory address space, enabling it to handle more data and complex instructions.

Bit Size: 32

Operating at a bit size of 32 allows the DSP to perform high-speed mathematical and logical operations, making it suitable for real-time signal processing applications.

Power Supplies (V): 1.1,1.8,3.3

Supporting multiple power supply voltages makes the DSP versatile and compatible with different power sources, enhancing its usability in various applications.

No. of Terminals: 737

Having a high number of terminals enables easy connectivity and integration of the DSP into complex systems, making it a versatile and adaptable choice for different design requirements.

Maximum Operating Temperature: 100 °C

Operating at a maximum temperature of 100°C ensures the DSP can withstand high temperature environments, making it suitable for industrial applications where heat resistance is essential.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral IC type makes this product suitable for a wide range of signal processing tasks, offering flexibility and efficiency in handling diverse applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6472ECTZA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

14

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B737

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

737

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA737,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6472ECTZA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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