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TMS320C6455BGTZ8

Texas Instruments

TMS320C6455BGTZ8 by Texas Instruments

TMS320C6455BGTZ8 by Texas Instruments is a 32-bit DSP with integrated cache, operating at 66.6 MHz clock frequency. It features 64 DMA channels and 32768 RAM words, suitable for digital signal processing applications requiring high-speed data processing and low power consumption. The package style is grid array with fine pitch, making it ideal for surface mount assembly in compact electronic devices.

Median Price

$249.225

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 544 parts In-Stock

1+ parts

$212.110

100+ parts

$199.380

1k+ parts

$186.660

10k+ parts

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544

$212.110

$199.380

$186.660

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DigiKey

USA . 544 parts In-Stock

1+ parts

$265.140

100+ parts

-

1k+ parts

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544

$265.140

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Verical

USA . 440 parts In-Stock

1+ parts

-

100+ parts

$249.225

1k+ parts

$233.325

10k+ parts

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440

-

$249.225

$233.325

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 354 parts In-Stock

1+ parts

$222.670

100+ parts

-

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354

$222.670

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Vyrian

USA . 4,729 parts In-Stock

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4,729

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,512 parts In-Stock

1+ parts

$56.001

100+ parts

-

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1,512

$56.001

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Corohmni

South Africa . 1,884 parts In-Stock

1+ parts

$57.835

100+ parts

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1,884

$57.835

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IDEA Electronic Components Group

UK . 944 parts In-Stock

1+ parts

$62.922

100+ parts

$59.776

1k+ parts

$56.630

10k+ parts

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944

$62.922

$59.776

$56.630

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ChromeModa Solutions

Germany . 869 parts In-Stock

1+ parts

$62.922

100+ parts

$51.596

1k+ parts

-

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869

$62.922

$51.596

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Corphita

USA . 2,832 parts In-Stock

1+ parts

$210.951

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2,832

$210.951

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DigiPath Technology Company

USA . 2,292 parts In-Stock

1+ parts

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100+ parts

$56.730

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2,292

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$56.730

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Perfect Parts

USA . 49 parts In-Stock

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49

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Overview

Unlock the power of cutting-edge digital signal processing with the TMS320C6455BGTZ8 by Texas Instruments. As a leader in semiconductor technology, Texas Instruments delivers top-quality products that are trusted by industry professionals worldwide. This DSP processor offers unparalleled performance and efficiency for a wide range of applications, from telecommunications to industrial automation. Experience seamless integration, reliable operation, and enhanced functionality with the TMS320C6455BGTZ8. Elevate your projects to new heights with this innovative solution that brings value and efficiency to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to heat and moisture, ensuring the product's reliability and longevity.

Integrated Cache: YES

Having an integrated cache helps improve processing speed by storing frequently accessed data closer to the processor, reducing access time and enhancing overall performance.

Maximum Supply Voltage: 1.236 V

The higher maximum supply voltage allows for efficient power management and increased processing capabilities without risking damage to the components.

Address Bus Width: 20

A wider address bus width allows for greater memory addressing capabilities, enabling the DSP to access and process larger amounts of data more efficiently.

Maximum Clock Frequency: 66.6 MHz

The high maximum clock frequency enables fast data processing and execution of instructions, making the product suitable for applications that require real-time signal processing.

RAM Words: 32768

With a large RAM capacity, the DSP can store and manipulate a significant amount of data simultaneously, facilitating complex calculations and operations in real-time applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6455BGTZ8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e0

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

697

No. of Timers:

4

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.236 V

Minimum Supply Voltage:

1.164 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6455BGTZ8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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