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TMS320C6455BCTZ7

Texas Instruments

TMS320C6455BCTZ7 by Texas Instruments

TMS320C6455BCTZ7 by Texas Instruments is a DSP with max clock freq of 66.6 MHz, operating temp range of 0-90°C, and low power mode. It's used in digital signal processing applications requiring high-speed data processing and low power consumption.

Median Price

$193.884

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,550 parts In-Stock

1+ parts

$141.858

100+ parts

$128.406

1k+ parts

$122.291

10k+ parts

-

17,550

$141.858

$128.406

$122.291

-

Mouser Electronics

USA . 8 parts In-Stock

1+ parts

$245.910

100+ parts

$195.760

1k+ parts

-

10k+ parts

-

8

$245.910

$195.760

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,218 parts In-Stock

1+ parts

$134.765

100+ parts

-

1k+ parts

-

10k+ parts

-

2,218

$134.765

-

-

-

Vyrian

USA . 6,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,056

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 543 parts In-Stock

1+ parts

$43.379

100+ parts

-

1k+ parts

-

10k+ parts

-

543

$43.379

-

-

-

Parana Technologies

USA . 2,132 parts In-Stock

1+ parts

$53.412

100+ parts

-

1k+ parts

-

10k+ parts

-

2,132

$53.412

-

-

-

ChromeModa Solutions

Germany . 1,800 parts In-Stock

1+ parts

$60.013

100+ parts

$49.211

1k+ parts

-

10k+ parts

-

1,800

$60.013

$49.211

-

-

IDEA Electronic Components Group

UK . 88 parts In-Stock

1+ parts

$60.013

100+ parts

$57.012

1k+ parts

$54.012

10k+ parts

-

88

$60.013

$57.012

$54.012

-

Corphita

USA . 1,951 parts In-Stock

1+ parts

$127.672

100+ parts

-

1k+ parts

-

10k+ parts

-

1,951

$127.672

-

-

-

DigiPath Technology Company

USA . 32 parts In-Stock

1+ parts

-

100+ parts

$54.108

1k+ parts

-

10k+ parts

-

32

-

$54.108

-

-

Overview

Unleash the power of cutting-edge technology with the TMS320C6455BCTZ7 by Texas Instruments. As a leader in the industry, Texas Instruments delivers exceptional quality and reliability in their products. The TMS320C6455BCTZ7 falls into the category of Digital Signal Processors (DSPs), offering endless possibilities for applications in various fields. From audio processing to telecommunications, this DSP provides unmatched value, efficiency, and performance. Elevate your projects to new heights with the TMS320C6455BCTZ7 and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easier assembly and smaller form factor of the product.

Maximum Supply Voltage: 1.236 V

Operating within a moderate supply voltage range ensures efficient power consumption and performance.

Package Shape: SQUARE

Square package shape allows for easier integration and placement on circuit boards.

No. of Terminals: 697

Having a high number of terminals provides flexibility in connectivity and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enhances signal integrity and reduces interference.

Minimum Supply Voltage: 1.164 V

Support for low supply voltage operation enables energy efficiency and extended battery life.

Maximum Operating Temperature: 90 °C

High maximum operating temperature tolerance ensures reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, the product can operate in cold environments without issues.

Terminal Finish: TIN SILVER COPPER

Terminal finish of tin, silver, and copper provides good conductivity and durability.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to mount and connect the DSP in a circuit.

Maximum Seated Height: 3.242 mm

Low seated height saves PCB space and allows for more compact designs.

Width: 24 mm

Compact width dimension ensures the product can fit into tight spaces or crowded PCB layouts.

Boundary Scan: YES

Boundary scan capability facilitates debugging, testing, and verification of the DSP during development.

Maximum Clock Frequency: 66.6 MHz

High maximum clock frequency allows for fast signal processing and real-time data handling.

Maximum Time At Peak Reflow Temperature (s): 30

Short duration at peak reflow temperature reduces the risk of thermal damage during soldering.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures proper soldering and component reliability.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and performance of the DSP.

Length: 24 mm

Compact length dimension complements the width for a space-efficient design.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripheral IC type for digital signal processing ensures specialized functionality and performance.

Technology: CMOS

Using CMOS technology enables low power consumption and high-speed operation for the DSP.

Terminal Form: BALL

Ball terminal form allows for reliable connections and solder joints on the PCB.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the DSP.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables more terminals in a smaller space for increased connectivity options.

Format: FIXED POINT

Fixed point format provides precision in calculations and accurate processing of digital signals.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates good resistance to moisture, making the product suitable for a variety of environments.

Low Power Mode: YES

Low power mode option allows for energy-efficient operation and extends battery life for portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6455BCTZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.242 mm

Maximum Supply Voltage:

1.236 V

Minimum Supply Voltage:

1.164 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6455BCTZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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