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TMS320C6418ZTSA500

Texas Instruments

TMS320C6418ZTSA500 by Texas Instruments

TMS320C6418ZTSA500 by Texas Instruments is a 32-bit DSP with integrated cache, 23mm width, and 30MHz clock frequency. Ideal for industrial applications requiring high-speed processing, it features 64 DMA channels, low power mode, and boundary scan capability.

Median Price

$74.976

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,555 parts In-Stock

1+ parts

$74.976

100+ parts

$66.645

1k+ parts

$49.004

10k+ parts

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4,555

$74.976

$66.645

$49.004

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Mouser Electronics

USA . 31 parts In-Stock

1+ parts

$104.810

100+ parts

$79.940

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31

$104.810

$79.940

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Rochester

USA . 6 parts In-Stock

1+ parts

-

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$70.450

1k+ parts

$63.040

10k+ parts

$59.330

6

-

$70.450

$63.040

$59.330

DigiKey

USA . 6 parts In-Stock

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Digiode

USA . 143 parts In-Stock

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$64.657

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DigiKey Marketplace

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$65.540

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Vyrian

USA . 2,026 parts In-Stock

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Semi Source

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Cyclops Electronics Ltd

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Microfarads

USA . 1 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Corphita

USA . 3,846 parts In-Stock

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$61.254

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Parana Technologies

USA . 888 parts In-Stock

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$76.396

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Corohmni

South Africa . 3,159 parts In-Stock

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$81.506

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DigiPath Technology Company

USA . 2,217 parts In-Stock

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$84.121

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2,217

$84.121

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ChromeModa Solutions

Germany . 3,211 parts In-Stock

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$85.838

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$70.387

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$85.838

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IDEA Electronic Components Group

UK . 2,339 parts In-Stock

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$85.838

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$81.546

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$77.254

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2,339

$85.838

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$77.254

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Lixinc

USA . 16,539 parts In-Stock

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Perfect Parts

USA . 269 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320C6418ZTSA500 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors that provide unparalleled performance and reliability. Ideal for applications in telecommunications, audio processing, and industrial control systems, this DSP offers customers exceptional value with its integrated cache, advanced internal bus architecture, and low power mode. Experience seamless operation and optimized functionality with the TMS320C6418ZTSA500, setting new standards in digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Integrated Cache: YES

Having an integrated cache helps improve the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures safe operation and prevents damage to the DSP.

Address Bus Width: 23

A wider address bus width of 23 enables the DSP to access a larger memory space, improving overall performance.

Bit Size: 32

The 32-bit size allows the DSP to handle complex calculations and data processing tasks with high accuracy.

Power Supplies (V): 1.2,3.3

Support for multiple power supplies (1.2V and 3.3V) offers flexibility and compatibility with various systems.

No. of Terminals: 288

With a high number of terminals, the DSP can facilitate connections with a wide range of external components and peripherals.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures the DSP can operate efficiently even under low power conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the DSP to withstand demanding environmental conditions.

No. of External Interrupts: 4

Support for 4 external interrupts enables the DSP to respond quickly to external events and prioritize tasks effectively.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the DSP can function reliably in cold environments.

RAM Words: 16384

With a large RAM capacity of 16384 words, the DSP can store and process a significant amount of data efficiently.

Maximum Clock Frequency: 30 MHz

A high maximum clock frequency of 30 MHz enables the DSP to execute instructions quickly and handle real-time processing tasks.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption and high-speed operation, making it energy-efficient.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6418ZTSA500 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA288,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6418ZTSA500 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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