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TMS320C6418GTSA500

Texas Instruments

TMS320C6418GTSA500 by Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 288; Package Code: BGA; Package Shape: SQUARE;

Median Price

$79.260

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,865 parts In-Stock

1+ parts

$74.976

100+ parts

$66.645

1k+ parts

$49.004

10k+ parts

-

1,865

$74.976

$66.645

$49.004

-

Rochester

USA . 26 parts In-Stock

1+ parts

-

100+ parts

$79.260

1k+ parts

$70.920

10k+ parts

$66.740

26

-

$79.260

$70.920

$66.740

DigiKey

USA . 26 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26

-

-

-

-

Verical

USA . 26 parts In-Stock

1+ parts

-

100+ parts

$99.075

1k+ parts

$88.650

10k+ parts

$83.425

26

-

$99.075

$88.650

$83.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,632 parts In-Stock

1+ parts

$67.355

100+ parts

-

1k+ parts

-

10k+ parts

-

4,632

$67.355

-

-

-

Vyrian

USA . 3,111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,111

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 389 parts In-Stock

1+ parts

$40.604

100+ parts

-

1k+ parts

-

10k+ parts

-

389

$40.604

-

-

-

Corohmni

South Africa . 416 parts In-Stock

1+ parts

$43.259

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$43.259

-

-

-

ChromeModa Solutions

Germany . 3,686 parts In-Stock

1+ parts

$45.623

100+ parts

$37.411

1k+ parts

-

10k+ parts

-

3,686

$45.623

$37.411

-

-

IDEA Electronic Components Group

UK . 248 parts In-Stock

1+ parts

$45.623

100+ parts

$43.342

1k+ parts

$41.061

10k+ parts

-

248

$45.623

$43.342

$41.061

-

Corphita

USA . 515 parts In-Stock

1+ parts

$63.810

100+ parts

-

1k+ parts

-

10k+ parts

-

515

$63.810

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

DigiPath Technology Company

USA . 2,240 parts In-Stock

1+ parts

-

100+ parts

$41.134

1k+ parts

-

10k+ parts

-

2,240

-

$41.134

-

-

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6418GTSA500 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA288,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6418GTSA500 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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